Principal Hbm Design Architect in Singapore

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Responsibilities and Tasks: Coordinate with Internal and External Teams on Preparation for Silicon Work with Manufacturing teams to ensure resources are available Identify HBM Component Validation equipment needs Identify and validate HBM Component Validation equipment and testing flow Ensure that Silicon Meets Product Expectations Debug and identify root cause for failures Implement fixes for fails (Design or Process) Work with Design Validation (DV) and Quality Assurance (QA) Teams on customer returns to identify new tests Work with Global Quality Team (GQ) to ensure reliability Partner with Engineering, Manufacturing and Marke

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an HBM PE Principal Component Validation Engineer for the Heterogenous Integration Group, you will be part of a forward-thinking team of engineers that solves complex problems, responsible for enabling Micron’s products with flawless and issue free release to both internal and external customers. Responsibilities and Tasks: Coordinate with Internal and External Teams on Preparation for Silicon Work with Manufacturing teams to ensure resources are available Identify HBM Component Validation equipment needs Identify and validate HBM Component Validation equipment and testing flow Ensure that Silicon Meets Product Expectations Debug and identify root cause for failures Im

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a key leader within High Bandwidth Memory (HBM) Product Engineering Media Health team, you will spearhead and develop a high performing team driving Media Health Manufacturing and activities for Micron’s latest HBM products, both on DRAM and Interface die and a stacked product. You will lead a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. This include lead the manufacturing test flow development and validation, improve the device/stacked yield with most optimized extrinsic and intrinsic reliability through in depth circuit debug, test coverage optimization and strategy innovation, test time improvement for manufacturing flow and drive the DFT (design for test) strategy to stage new ideas to improve cost, cycle time and quality. You wi

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal Engineer, you will be a senior technical authority who owns complex validation scopes, optimizes test flows, and leads technical problem solving for next generation HBM products. You’ll drive coverage completeness, improve detection efficiency, and mentor junior engineers—ensuring flawless product readiness through deep platform, Verilog simulation, and analysis expertise. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient IQP/ETV material usage . Own time‑bound data crunching pipelines (automated log parsing,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Validation Execution Lead end‑to‑end Validation Run execution in a high‑pressure, fast‑paced environment , ensuring on‑schedule starts/completions , risk‑aware re‑plans , and efficient material usage . Own time‑bound data crunching pipelines (automated log parsing, metrics aggregation, anomaly ranking) and deliver decision‑ready summary reports and sightings by agreed Cycle Time. Guarantee coverage completeness across Validation flows; drive Hot/Cold corners , screen , timing boundary coverage, and evidence‑backed closure . Platform Leadership Develop and debug test programs on ATEs like Advantest and In-house ATE;

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Principal Engineer/MTS – Member of Technical Staff, HIG-HBM Product System Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Manufacturing) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability Coding) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff/Principal Engineer, HIG-HBM Product System & Engineering (Media Health Reliability) — Fab 10A, Singapore. Apply via Workday.

Principal Engineer, Product Engineering, Media Health Reliability, HIG-HBM — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . </

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . We are looking f

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your