Ai Architect in United States

Our Purpose Mastercard powers economies and empowers people in 200+ countries and territories worldwide. Together with our customers, we’re helping build a sustainable economy where everyone can prosper. We support a wide range of digital payments choices, making transactions secure, simple, smart and accessible. Our technology and innovation, partnerships and networks combine to deliver a unique set of products and services that help people, businesses and governments realize their greatest potential. Title and Summary Lead Workday Engineer - Integrations and Extend Overview The P&C Engineering team designs, develops, and implements technology solutions that improve and engage Mastercard employees across the globe. • Do you enjoy building enterprise applications that solve complex business challenges at global scale? • Do you have a passion for architecting innovative Workday solutions that improve employee experiences? • Do you thrive in environments where modernization, automation, AI, and continuous improvement are strategic priorities? • Can you connect business strategy with technical architecture and guide engineering teams toward the right solution? This role serves as a Lead Integration Engineer, responsible for architecting enterprise applications, modern employee experience, and scalable platform capabilities. You will lead the evolution of Mastercard's Workday platform through Workday Extend, AI, automation, APIs, and modern application development. Role • Lead the architecture, design, development, testing, implementation, documentation, and support of enterprise applications using Workday Extend. • Architect scalable solutions leveraging Workday Extend, Orchestrate, APIs, Studio, Core Connectors, EIBs, and Workday Web Services. • Design reusable application frameworks, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Job Requisition ID # 26WD101260 L'affichage de poste en français suivra / The French job posting follows. 26WD101260, Senior Manager, Product Position Overview Autodesk's Technical Advisory organization helps the world's leading architecture, engineering, construction, manufacturing, and media companies get the most from their Autodesk investments. We are transforming this expertise from traditional consulting into a digital-first platform strategy — and the Senior Manager, Product Management will define what that platform becomes. Reporting to the Director of Platform & Productization within Global Delivery & Solutions, you will lead a product management team responsible for Autodesk's digital consulting platform. Your portfolio spans platform capabilities, industry-specific solutions, consulting tools, and packaged services. In the first year, you will launch and land our first digital consulting offering, validating our new consulting model with paying customers. You will establish product management discipline for a maturing capability — discovery practices, prioritization frameworks, go-to-market coordination — while simultaneously delivering product that proves the model works. You own the product strategy and roadmap. You will partner with Content & Knowledge on knowledge readiness and publication decisions, with Architecture and Engineering on technical feasibility and delivery sequencing, and with GTM on market positioning and launch execution. The role sits at the center of the organization, and yo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology and amazing people. Today, we're harnessing the boundless possibilities of AI to build the next era of computing. An era in which our GPU acts as the brain of computers, robots, and self-driving cars that can understand the world. Accomplishing unprecedented goals calls for imagination, inventiveness, and exceptional talent from around the world. As a NVIDIAN, you'll be immersed in a diverse, encouraging environment where everyone is inspired to do their best work. Join our team and discover how you can build a lasting impact on the world. NVIDIA's Silicon Co-Design Group (SCG) leads the full product development lifecycle, from early architecture definition through silicon bringup to product release. The ArchDev team is the hub for silicon and system-level feature development, driving tradeoff analysis, system integration, and POR alignment across the entire organization. This is where ideas become chips, and chips become products that define the state of the art — and we're building that future with some of the most motivated engineers in the industry. We're looking for a Senior Memory Systems Engineer to own HBM and LPDDR integration in sophisticated SoCs. This role covers the full stack, including silicon, package, embedded software, testing, and product development. The engineer will resolve the toughest system-level memory challenges throughout the process, building solutions that hold up at scale. What you'll be doing: HBM & LPDDR System Integration and Bringup: Drive HBM and LPDDR system integration, bringup, characterization, and debug for next-generation SoCs — taking memory subsystems through the full arc from first silicon to production-ready at scale. Full-Stack Memory Closure: <s

At NVIDIA, we push the boundaries of computing innovation. Our ASIC Verification Engineers focus on developing the world’s top SoCs and GPUs. Joining us as a Senior ASIC Verification Engineer - GPU means working on modern technology powering consumer graphics and AI applications. This position is ideal for those passionate about technology and eager to impact computing’s future. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs. You will be responsible for verifying the ASIC build, architecture, golden models, and micro-architecture using advanced verification methodologies such as UVM or equivalent. Understand the design and implementation of your unit/cluster/chip, define the verification scope, develop the verification infrastructure, and verify the correctness of the design. Collaborate with architects, designers, and pre- and post-silicon verification teams to accomplish your task. What we need to see: Bachelor's Degree in EE, CS, or CE or equivalent experience. 5&#43; years of relevant experience. Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies. Experience with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, Indago, GDB). Expertise in System Verilog or similar HVL. Strong debugging and analytical skills. Perl and C/C&#43;&#43; programming language experience desirable. Strong communication skills and the ability & desire to work as a great teammate are huge pluses. Experience in crafting test bench environments for unit and system level verification. #LI-Hybrid Your base salary will be det

Are you ready to contribute to world-class innovation and push the boundaries of what's possible? At NVIDIA, you'll have the opportunity to be part of a team that is driving groundbreaking impacts across various markets. As a Thermal Solutions Development Engineer, you will play a pivotal role in our Silicon Codesign Group, transforming thermal solution concepts into lab-ready builds and beyond. What you will be doing: Build thermal solutions for engineering characterization and validation of next-gen GPU/SOC products, ensuring flawless delivery from concept to lab. Drive end-to-end development and deployment of thermal solutions, collaborating with internal teams and external vendors on build requirements, prototype evaluation, test system integration, and software automation. Improve thermal design processes by incorporating feedback and findings, developing workflow and maintaining our world-class standards. Work closely with system architects, chip and board designers, and software/firmware engineers in a dynamic and high-energy environment to bring industry-defining products to market. Apply AI-enabled approaches and AI tools to accelerate design iteration, test planning, and characterization/validation triage (e.g., requirements/spec summarization, experiment prioritization, log/telemetry summarization, anomaly/outlier detection), improving cycle time, coverage, and traceability while validating outputs against physics, specs, and lab measurements. Partner with AI/tooling teams as the thermal domain SME to define use-cases, success criteria, and evaluation methods; provide feedback to improve tool reliability and usability. What we need to see:

NVIDIA has been redefining computer graphics, desktop gaming, and enhanced computing capabilities for more than 25 years. Today, we are tapping into the unlimited potential of AI to define the next era of computing. As a NVIDIAN, you will work on problems that sit at the boundary of architecture, silicon, firmware, software, and production, where strong judgment matters as much as technical depth. We're the Silicon Design for Productization (DFP) Team, within the broader Silicon Co-Design Group, and we turn power and thermal design into executable productization methodology. Power and thermal are among the most complicated problems we work on at NVIDIA because they sit at the intersection of architecture, workload behavior, silicon variation, firmware policy, platform constraints, and product goals. Small decisions here have an outsized impact on performance, efficiency, reliability, bring-up speed, and ultimately what the product can deliver in the field. We define how features move from concepts to bring-up, characterization, validation, and release. In this role, you will help us build that bridge. We're looking for an engineer who reasons from first principles, flourishes with ownership in a fast-paced environment, and uses AI with sound judgment. What you’ll be doing: Lead the effort across multi-functional teams to keep the program’s power and thermal productization strategy clear, executable, and on track. Create methodology and silicon test plan based controller designs and architecture, including characterization process, debug tools, fuse/firmware settings and lab requirements. Drive resolution for challenging silicon issues through structured hypotheses, measurement plans, and root-cause closure. Steward the Power and Thermal playbook when the existing productization methodology

Job Details: Job Description: About the Role Join Intel's Client Computing and Physical AI Group and help enable the next generation of mobile and desktop client platforms. We are seeking a Senior Customer Solutions Engineer to serve as a key technical leader responsible for customer platform enablement, architecture collaboration, and execution across Intel's client platform ecosystem. In this role, you will work closely with OEM customers, engineering teams, and program stakeholders to drive the successful delivery of innovative platform technologies. You will play a critical role in platform planning, issue resolution, customer engagement, and cross-functional execution from product definition through product launch and production. What You’ll Do Key responsibilities will include but not limited to: Serve as the primary technical interface between customers and Intel engineering teams, driving platform enablement and customer success. Lead cross-functional execution across platform technologies including hardware, firmware, graphics, connectivity, and I/O technologies. Drive resolution of critical platform issues, customer escalations, and technical challenges throughout the product lifecycle. Represent customer readiness, platform health, and execution status in program reviews and leadership forums. Develop technical assessments, customer enablement plans, and supporting documentation to accelerate design wins and product launches. Drive technical program execution across customer and engineering teams by aligning milestones, dependencies, risks, priorities, and deliverables. Behavioral traits that we are looking for: Strong customer focus and the ability to build trusted partners

Strength in Trust OneTrust’s mission is to enable innovation through the responsible use of data and AI. We believe that ensuring data is trusted shouldn’t slow teams down—it should accelerate what’s possible. This led us to develop the first technology platform for responsible data use in 2016. Today, with AI representing the latest and most impactful expansion of data yet, OneTrust is once again redefining what responsible innovation looks like. OneTrust, the AI‑Ready Governance Platform™, unifies regulatory intelligence, automation, and connected governance workflows so businesses can continue to move at the speed of AI while ensuring good governance to prevent data misuse at scale. Trusted by thousands of organizations worldwide, OneTrust is shaping the future where trusted data becomes a transformative force for business and society. Role Mission: OneTrust is seeking a Principal Learning Experience Designer to architect and scale high‑impact, release‑driven digital education for complex SaaS products. This is a senior‑level individual contributor role for a proven learning architect who thrives in fast‑moving environments and sets the standard for quality, speed, and scalability. In this role, you will be the studio’s learning design authority and quality multiplier, building flagship eLearning, converting instructor‑led content into scalable self‑directed experiences, and creating reusable design patterns that allow learning to move in lockstep with product releases. You will combine strong instructional design judgment with hands‑on execution, helping customers and partners quickly adopt new functionality and realize value from OneTrust’s platform. Principal Learning Experience Designer What You’ll Do Architect and deliver rapid, release‑synchronous eLearning for technical SaaS products, using modern authoring tools (primarily Rise) Convert ILT/VILT and SME‑led content into high‑quality, self‑directed digital learning that sc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The HBM Design Technology Package Co-Optimization (DTPCO) organization is seeking a Staff Engineer! Lead the design and development of test vehicles that enable technology learning and risk reduction for future HBM products! This role serves as a key technical contributor within DTPCO, partnering closely with Architecture, Design, Layout, Product Engineering, Reliability, and Advanced Packaging teams to translate emerging product requirements and technology challenges into actionable test vehicle solutions. You will apply expertise in semiconductor design, physical implementation, silicon characterization, and advanced packaging technologies to define test structures, develop validation strategies, and generate data that drives product decisions across future HBM generations. Unlike a traditional product role centered on ownership of product blocks, this position emphasizes enabling learning in development and engineering. It does so by developing representative test vehicles and characterization structures. Key Responsibilities Serve as a technical lead for HBM test vehicle design and structure development within DTPCO. Partner with HBM product, technology and reliability team. Define and implement test structures targeting key learning areas such as package interaction and reliability Drive test vehicle content definition, structure specifications, measurement requirements, and validation objectives. Analyze silicon characterization and qualification results to identify optimization opportunit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Manager, Electrical Engineering is responsible for the electrical systems of the KARNO generator, including high-voltage power electronics, battery systems, low- and high-voltage architecture, wiring harnesses, and the hardware that converts linear motion into electrical output. This is a working manager role: the position leads and develops a team of electrical engineers while remaining directly involved in technical execution, including circuit architecture, schematic review, and hardware bring-up in the lab. The Manager is accountable for the technical excellence, safety, and reliability of the electrical engineering function, and for establishing the design standards and review practices the team works to. The position plans team capacity, owns hiring and development for the electrical engineering staff, and partners with mechanical, controls, supply chain, and program management on system integration. KARNO systems are deployed in data center, military, and industrial applications. AI at Hyliion At Hyliion, AI is core to how we work. We equip every team member with leading AI tools and count on you to use them — to move faster, solve harder problems, and help us realize the full potential of KARNO technology for the world. Duties and Responsibilities Own critical electrical designs personally, including regular time at the bench and in the test cell, while leading the team as a practicing engineer. Lead the electrical engineering team in the design and development of KARNO generator electrical systems, including high-voltage power electronics, battery systems, linear generator power stages, and low-voltage controls hardwar

About us Graphcore is one of the world’s leading innovators in artificial intelligence compute. We are developing hardware, software and systems infrastructure that will unlock the next generation of AI breakthroughs and support the widespread adoption of AI solutions across every industry. As part of the SoftBank Group, Graphcore is a member of a family of companies responsible for some of the world’s most transformative technologies. Together, we share a bold vision to enable advanced artificial intelligence and ensure its benefits are accessible to everyone. Graphcore brings together AI researchers, silicon designers, software engineers and systems architects to solve complex technical challenges and deliver innovative computing solutions. Job Summary The Principal Electrical Engineer will be a technical authority within Data Center Engineering, leading the architecture and delivery of safe, resilient and scalable electrical infrastructure for high-density AI computing environments. Working with internal teams, data center developers, utilities, consultants and equipment partners, this role will guide projects from early technical studies through design, construction, commissioning, operation and lifecycle improvement. The successful candidate must reside in, or be willing to relocate to, Austin, Texas. Approximately 10% travel may be required. The Team The Data Center Engineering team is responsible for defining and enabling the infrastructure needed to deploy and operate Graphcore’s computing systems at scale. The team works across electrical, mechanical, thermal, controls, systems and operational disciplines, collaborating with external engineering and construction partners to deliver reliable, efficient and maintainable data center environments. Responsibilities and Duties Act as the technical authority for electrical engineering across data center infrastructure projects, from the utility or on-site power source through to the IT rack. Lead electrical archit