Ai Enabled Full Stack Developer Experienced in Boise

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life through innovative memory and storage solutions. The DRAM Thin Films Process Engineering team develops advanced materials and deposition processes that enable future memory scaling, improved device performance, and next-generation semiconductor technology. Our team works at the forefront of process development to support DRAM technologies that power artificial intelligence, cloud computing, and data-intensive applications. As a DRAM Thin Films Process Engineering Intern, you will work alongside experienced engineers on a high-impact summer project focused on semiconductor process development and optimization. This role provides hands-on experience with experimental design, process characterization, data analysis, and multi-functional collaboration. You will contribute to real engineering challenges and present your results to technical and leadership audiences at the conclusion of the internship. Responsibilities Research and develop innovative solutions that support next-generation memory technology and thin film process advancement. Develop, complete, and analyze experiments to improve thin films process performance, manufacturability, and product quality. Apply statistical analysis, data science techniques, and AI-enabled tools to identify process trends, optimize performance, and accelerate engineering decision-making. Partner with process, equipment, and integration engineering teams to solve complex technic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Smart Manufacturing Product Owner at Micron Technology, Inc., you will be responsible to enable innovation and new frontier technology for Smart manufacturing to define, drive and deliver end to end smart manufacturing solution, coordinated across functions of the business. The team will look into applying industry-leading the best methodologies in automation, AI and machine learning to improve Micron’s product development, business and administrative processes across the company. You are joining a team where 'we' matter and hold high standards to achieve perfection. Key Responsibilities Lead the development and implementation of AI-driven Smart Manufacturing solutions to improve product yield, quality, test coverage, and system-level performance across Micron's semiconductor operations. Partner with Test Solutions Engineering, Product Engineering, Global Quality, and multi-functional collaborators to find opportunities and drive digital transformation initiatives. Collaborate with Data Scientists, Machine Learning Engineers, Solution Architects, and Data Engineers to define requirements, prioritize solutions, and deliver end-to-end projects. Translate business needs into detailed business requirements, user stories, acceptance criteria, and data requirements while ensuring alignment with enterprise standards and governance. Develop arguments for proposed solutions, including value quantification, analysis of return on investment and net present value, success metrics, and impl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron currently has an opening for a Staff or Principal level EUV Equipment Engineer for our Boise, Idaho location. Our Advanced Lithography and Equipment Engineering team enables the technologies that power the future of semiconductor innovation. We work at the leading edge of EUV and High-NA EUV development, partnering across process, manufacturing, facilities, and supplier organizations to deliver world-class equipment performance and support Micron’s technology roadmap. This EUV Equipment Engineer is a technical leadership role focused on maximizing the performance, reliability, and capability of EUV lithography systems. This position plays a critical role in advancing next-generation semiconductor technologies through equipment optimization, problem solving, supplier engagement, and collaboration across engineering disciplines. Responsibilities: Own the performance, reliability, availability, and productivity of assigned EUV lithography equipment Lead equipment installations, upgrades, qualifications, maintenance strategies, and continuous improvement initiatives Drive improvements in scanner performance, tool matching, imaging stability, defectivity reduction, contamination control, and recipe optimization Analyze equipment data and establish monitoring systems to improve overlay, focus, source performance, automation, and overall equipment health Provide technical leadership through supplier management, cross-functional collaboration, mentoring, a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Advanced Packaging Technology Development (APTD) organization, where new AI assisted packaging technologies are developed to enable future generations of memory and storage solutions. Our team works closely across engineering disciplines to improve manufacturing performance, solve complex technical challenges, and support the technologies driving advances in AI and high-performance computing. As a Shift Process Engineer, you will play a key role in supporting and improving assembly processes within a fast-paced development environment. You will investigate process issues, use data to drive decisions, and work with cross-functional teams to improve yield, quality, and operational performance. This role offers the opportunity to make a direct impact on process capability while collaborating with teams across Micron's global network. Responsibilities: Identify, diagnose, and resolve process issues using failure analysis, FMEA, 8D, SPC, and FDC methodologies Analyze process and manufacturing data to improve yield, product quality, and cost performance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Principal Product Marketing Manager for the Cloud Memory Business Unit is responsible for defining and communicating the value of Micron's memory portfolio for AI, cloud, and data center markets. This role serves as a strategic link between product management and global marketing to shape market perception, drive demand, and enable competitive differentiation. At the Principal level, this role operates with significant independence and serves as a subject matter authority, influencing cross-functional decisions and shaping business outcomes at the portfolio level. This Principal PMM operates as a subject matter authority, influencing both near-term go-to-market execution and long-term category leadership positioning in high-growth markets. The role is expected to harness advanced AI technologies, including the creation, deployment, and management of AI agents and automated workflows, to optimize market analysis, customer insights, content development, campaign execution, competitive intelligence, and operational effectiveness. The successful candidate will demonstrate proficiency in finding opportunities where AI can accelerate business outcomes, increase productivity, improve decision-making, and scale marketing impact across the organization. Responsibilities: Product Positioning & Value Definition - Define and articulate clear product value propositions, differentiated positioning, and customer-facing messaging; translate complex technical capabilities into business outcomes Go-to-Ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Identify, diagnose and resolve DRAM (Dynamic Random Access Memory) process integration related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC. Employer will accept a Master’s degree in Mechanical Engineering, Electrical Science, Material Science, Physics, Chemical Engineering, or related field. Position requires: 1. Validate and qualify processes, tools, and materials for product introduction 2. Manage and audit material suppliers to meet quality, cost, and risk objectives 3. Support internal and external audits 4. Sustain fab healthiness with daily monitoring 5. Drive effective process technology improvement that enables best-in-class yield, quality and cost As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that b