Asic Verification Engineer in United States

NVIDIA is seeking elite ASIC Verification Engineers to verify the design and implementation of the world’s leading SoC's and GPU's. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of extraordinary people stretching around the globe, whose mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs You will be responsible for verification of the ASIC design, architecture, golden models and micro-architecture using advanced verification methodologies such as UVM Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verification teams to accomplish your tasks What we need to see: Bachelors Degree in EE, CS or CE or equivalent experience 2+ years of relevant experience Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies Background with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, GDB) Experience crafting test bench environments for unit and system level verification Strong background in System Verilog or similar HVL Expertise with C/C++ programmin

At NVIDIA, we push the boundaries of computing innovation. Our ASIC Verification Engineers focus on developing the world’s top SoCs and GPUs. Joining us as a Senior ASIC Verification Engineer - GPU means working on modern technology powering consumer graphics and AI applications. This position is ideal for those passionate about technology and eager to impact computing’s future. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of the industry's leading GPUs. You will be responsible for verifying the ASIC build, architecture, golden models, and micro-architecture using advanced verification methodologies such as UVM or equivalent. Understand the design and implementation of your unit/cluster/chip, define the verification scope, develop the verification infrastructure, and verify the correctness of the design. Collaborate with architects, designers, and pre- and post-silicon verification teams to accomplish your task. What we need to see: Bachelor's Degree in EE, CS, or CE or equivalent experience. 5+ years of relevant experience. Experience in verification using random stimulus along with functional coverage and assertion-based verification methodologies. Experience with design and verification tools (VCS or equivalent simulation tools, debug tools like Verdi, Indago, GDB). Expertise in System Verilog or similar HVL. Strong debugging and analytical skills. Perl and C/C++ programming language experience desirable. Strong communication skills and the ability & desire to work as a great teammate are huge pluses. Experience in crafting test bench environments for unit and system level verification. #LI-Hybrid Your base salary will be det

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is seeking best-in-class ASIC Verification Engineers to verify the design and implementation of the world’s leading inference accelerator. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of outstanding people around the globe. Their mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of inference accelerator You will be responsible for verification of the ASIC design, architecture, reference models and micro-architecture using advanced verification methodologies Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for an embedded engineer to help build firmware and associated modeling software for OpenAI’s in house AI accelerator. This role involves designing and developing drivers and functional models for a large array of HW components, writing high throughput and low latency firmware code, investigating bring-up and production issues. Responsibilities Design and implement drivers for hardware peripherals, including those related to AI chips. Design and implement functional software models to simulate SoC uncore logic and enable FW testing against the model Design and implement low-latency and high throughput embedded SW to manage HW resources. Work with adjacent software and hardware teams to implement requirements, debug issues and shape future generations of the hardware. Collaborate with vendors to integrate their technologies within our systems. Bring up and debug firmware/driver on new platforms. Come up with processes and debug issues raised in the field. Set up monitoring, integration testing and diagnostics tools. Qualifications 5+ years of experience working in embedded SW space. Ability to thrive in ambiguity and learn new technologies. Strong programming skills in C/C++ and/or Rust. Experience developing high throughput, low latency and multi-threaded code. Experience working with real time operating systems (RTOS). Experience developing hardware drivers and working with hardware Experience with HW/SW co-design Knowledge of common embedded pr

NVIDIA is now looking for a Senior Memory System Engineer to join our ASIC Memory Subsystem team! As a Senior Systems Engineer at NVIDIA, you'll join a group of hardworking engineers to develop and architect innovative Memory Solution for Tegra SoCs. In this position, you'll make a real impact in a multifaceted, technology-focused company. You will work with memory controller/PHY and Platform / System architect, Firmware, SI/PI, Memory suppliers to design and architect cutting edge, high speed and lower power memory technology for NVIDIA CPUs and SOCs. What You Will Be Doing: Analyze future DDR/LPDDR/HBM technologies to determine optimum performance, power, function and RAS in memory for Next generation SOC and Systems. Collaborate with ASIC Architects, Designers, Software and Firmware SW/FW teams to drive memory technology and associated requirements for memory controllers. Define Memory module, Package, and PCB layouts appropriate to the system workloads Debug and bring up memory evaluation / validation and failure issues on memory technology. Collaborate with DRAM suppliers and industry partners on to develop memory and memory related component technology. What We need to see: Bachelor's degree or master’s degree in Electrical Engineering, Computer Engineering (CE), or a related field (or equivalent experience) 10 years of proven track record in DRAM design, module design, or memory sub system design. Deep understanding and strong fundamental of memory design, features, ECC algorithm, SI and PI (Training algorithm) in DDR, LPDDR, and HBM. Strong understanding of memory sub system level interaction with Cache, Memory controller and PHY. Experience in the design, bring-up and validation for memory failure analysis Experience with Python, C/C

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Global Supplier Quality organization is seeking a Controller Quality Principal Engineer to lead the quality strategy, qualification, and continuous improvement of storage and memory controller (ASIC/SoC) manufacturers supporting Micron's SSD, embedded, and storage solutions portfolio. This is a senior technical leadership role responsible for driving controller supplier quality performance from design qualification through mass production and field support The successful candidate will collaborate across functions with ASIC Development Team, Compose Engineering, Product Engineering, Dependability, Manufacturing, and Commodity Management, as well as directly with controller IC vendors, foundries, third party reliability labs and OSAT (outsourced assembly and test) partners, to ensure controller quality, reliability, and supply continuity meet Micron's standards. This role can be based in Taiwan, Hyderabad, or San Jose and will work extensively across time zones with global partners and suppliers! Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when vital. Ensures that established manufacturing inspection, sampling and statisti

NVIDIA's GPUs and SOCs are the world leaders in power, performance and efficiency. We are continually innovating to deliver new and creative, unusual solutions to extraordinary problems in a wide range of sectors. To this purpose, we are now seeking a hard-working Senior Package Layout Engineer who is committed to making a difference in the world through their contributions! This position will collaborate with Technical Package Lead and different design teams in the design and development of sophisticated, detailed layout of IC substrates for NVIDIA products. In addition, work with design teams to plan schedules, resolve costs, manufacturing, and electrical design issues. What you'll be doing: As part of a Layout team, you will collaborate to implement high speed/density ASIC packages. Perform substrate breakout patterns for ASIC packages. Optimize package pinout incorporating system level trade-offs of pins assignment. Help perform package routing, placement, stack-up, reference plane and power distribution using Cadence APD or SiP tool suite. Propose layout design trade-offs to the Technical Package Lead for resolution and implementation. Conduct design feasibility studies to evaluate the Package design goals for size, cost, and system performance. Develop symbols and CAD library databases using Cadence APD design tools Develop methodologies to improve layout productivity What we need to see: Hold a B.S. Electrical Engineering or equivalent experience 5+ years experience in PCB Layout of graphics cards, motherboards, line cards or other related technology. Experience with HDI designs is a plus Proven experience in substrate layout of wire bond and flip chip packages, preferred Significant background with Cadence AP

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role summary We are seeking a Networking Operating System Firmware Engineer to help bootstrap and scale the switching layer of our AI supercomputers. In this role, you will build and maintain custom NOS images from scratch, using open source components from SONiC, SAI, FRR, and related networking stacks while working across the Linux kernel, switch ASIC SAI/SDKs, platform drivers, control-plane services, and orchestration layers. This is a software engineering role that requires a deep understanding of networking, NOS internals, switch hardware, and production systems. You will design, implement, test, and debug production NOS software across platform drivers, routing and control-plane state, ASIC programming, observability, and fleet integration. The engineer in this role should be able to work through ambiguous, open-ended technical problems and drive feature development across software, hardware, and vendor boundaries. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will Design, develop, and maintain custom NOS images for large-scale AI fabrics, using open source components from SONiC, FRR, and related networking stacks. Integrate, build and configure Linux kernel components, device drivers, switch ASIC SDKs, and SAI layers. Bring up new switch platforms, including thermal and fan control, power monitoring, transceiver management, watchdogs, OSFP CMIS, L

The SCG Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges architecture, silicon, and platform — translating product noise targets into shipped specifications, and feeding silicon findings back into the next generation's build. Success in this role requires strong systems thinking and a willingness to accept ambiguity. It also requires the ability to apply AI as a force multiplier while maintaining rigorous engineering judgment. What you'll be doing: Architect voltage-noise mitigation across the full stack — silicon, package, board, platform — and own the codesign trade-offs between them. Co-design noise features with Speed, Power, Reliability, Circuit Design , Power-Arch, ASIC, and platform teams. You're the connective tissue across the codesign web. Work with other team members to define product-level voltage noise targets, drive them to closure, and sign them off at shipment. Build and take ownership of the Sim-to-Si correlation methodology for noise. You know when a model is lying and when silicon is. Model and prototype next-gen noise features — transient sense, droop response, mitigation IP, and codify them so every future program inherits them. Lead show-stopper noise bugs during bringup. The critical issues stop with you. Drive architecture-level codesign tradeoffs across V/F Power Noise Reliability Thermal (Noise-Variation) and (Noise-to-Closure) boundary work, where the highest-leverage innovation lives. What we need to see: BS / MS / PhD in EE, CE, or related (or equivalent experience). 5+ years in silicon power integrity, voltage noise, or PDN. Deep expertise in at least one of

NVIDIA's Silicon Co-design Group (SCG) sits at a rare intersection: we own the full product development lifecycle, from early architecture definition through silicon bringup to product release. Our ArchDev team is the hub for silicon and system-level feature development, driving tradeoff analysis, system integration, and POR alignment across the entire organization. If you want to see your work go from whiteboard to world-class silicon, this is where that happens. What You'll Be Doing: Architect and integrate system-level performance and power management features, controllers, and policies to optimize product efficiency across datacenter and client products . Build feature roadmaps to address low-power, low-noise, and performance-per-watt product needs through prototyping, use-case analysis, and cost/benefit trade-offs. Partner with architecture, ASIC, board/platform, software/firmware, and marketing teams to drive design decisions and debug complex issues. Track industry trends and market needs and translate them into forward-looking roadmaps that keep NVIDIA's products ahead of the curve. Lead debug efforts, develop workarounds, and support bringup , validation, manufacturing, and customer escalations. What We Need to See: <

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid , based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-