Assembly Mechanic Apprenticeship in United States

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing & quality engineer, who will be responsible for driving technical initiatives related to the manufacturing, quality and reliability of our AI supercomputer hardware systems to ensure product success from concept to launch and through mass production. You’ll have the opportunity to coordinate with functional SMEs and work with a wide range of stakeholders, from design engineering and operations teams, TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees In this role, you will: Own the integrated manufacturing and quality readiness for a product across L6, L10, and L11, with clear gates, milestones, deliverables, owners, and closure criteria. Lead readiness of process flows, tooling, fixtures, assembly operations, test interfaces, and production controls. Review and contribute to work instructions. Translate product requirements into qualification plans, process controls, test requirements and acceptance criteria with design engineering and Area SMEs Coordinate and drive execution of product and process qualification, reliability testing, and validation with the relevant SMEs. Maintain traceable evidence that assigned products and processes meet agreed performance, reliability,

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve peoples’ lives. About the Role We are seeking a Mechanical Design Engineer to lead the development of motor mechanical designs and prototype hardware for advanced robotic systems. You will own stator and rotor mechanical development from early concepts and detailed design through hands-on builds and prototype validation, partnering closely with electromagnetic, electrical, test, and manufacturing teams. This role focuses on the design, integration, and validation of motor components and prototype processes, including laminations, stack assemblies, bobbins, winding interfaces, and fixtures. You will help drive motor development from initial design through repeatable low-volume builds while establishing the tooling, work instructions, and validation practices needed for future robotic platforms. This role is based in San Francisco, CA, and requires in-person presence 4 days a week. In this role, you will Own stator and rotor mechanical designs and released CAD and drawings, including geometry, interfaces, fits, tolerances, retention, assembly access, and mechanical validation. Develop laminations, stack assembly methods, bobbins, and winding interfaces that control alignment, insulation, conductor placement, and end-turn packaging. Design, fabricate, and debug fixtures for winding, stacking, assembly, alignment, and inspection. Build and troubleshoot prototypes. Use measurements, defects, rework, and assembly effort to improve designs and processes. Establish low-volume prototype production with equipment, build sequences, work instructions, revision control, traceability

About the Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a PCB Layout Engineer to design high-density electronics for next-generation robotic systems. You will own PCB layout from floor planning through fabrication release, working closely with electrical, SI/PI, mechanical, and manufacturing teams. This role is based in San Francisco and requires in-person presence four days per week. In this role, you will: Own PCB layout, component placement, routing, and fabrication release for complex robotic systems. Collaborate with SI/PI engineers to refine layouts based on simulation results. Implement high-speed routing, controlled impedance, power distribution, decoupling, grounding, EMI/EMC, thermal, and mechanical-integration requirements. Work directly with fabricators and assembly partners to define stack-ups, establish design rules, drive DFM/DFA/DFT reviews, and close findings before release. Prepare fabrication and assembly documentation, including drawings, ODB++, drill files, stack-up tables, and manufacturing notes. Inspect newly received PCBAs and participate in board-level manufacturing failure analysis. Contribute to reusable design constraints and layout workflows, and maintain component-library assets such as symbols, footprints, and 3D models. You might thrive in this role if you: Have 6+ years of experience designing complex, multilayer PCBs. Are fluent in Cadence Allegro PCB Designer and Constraint Manager. Have strong HDI design experience, including fine-pitch BGAs, microvias, blind and buried vias, via-in-pad, and sequential lamination.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

NVIDIA is seeking an a PCB Library Engineer to join our PCB Design Infrastructure team. In this role, you will help develop and maintain the PCB library assets used across NVIDIA's Data Center, AI, Networking, Automotive, and Graphics products. Working alongside experienced PCB designers, library engineers, mechanical engineers, manufacturing engineers, and component engineers, you will create and validate component footprints, schematic symbols, mechanical components, panel definitions, and other critical design assets that enable successful product development. This position provides an excellent opportunity to build expertise in PCB design, manufacturing, component engineering, and design automation while supporting some of the most advanced computing platforms in the world. What you'll be doing: Develop PCB footprints, padstacks, schematic symbols, and mechanical library content using Cadence PCB design tools. Review component datasheets, package drawings, and engineering specifications to create accurate design libraries. Support library verification, release, and documentation processes. Partner with PCB design, mechanical engineering, manufacturing engineering, and operations teams to resolve library-related issues. Learn and apply industry standards, including IPC requirements, DFM, DFA, and DFT principles. Support quality initiatives to ensure library content is accurate, manufacturable, and scalable. Participate in continuous improvement and automation efforts within the library environment. Develop a strong understanding of PCB fabrication, assembly, and component technologies. What We Need to See: BS degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, Manufacturing Engineering, or a related field or equivalent experience. <p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about driving innovation for next-generation memory solutions powering AI/ML and high-performance computing systems. As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams. Key Responsibilities Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence. Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams. Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness. Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs. Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution. Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your Role at Baxter This is where my hands make life-sustaining products The responsibility of the Welder is to set-up and perform a variety of welding, (GMAW, GTAW, brazing etc.) finishing operations and processes on piece parts, sub-assemblies and assemblies. Move stock and completed parts to and from workstations, stock racks and holding areas. May be required to rack and un-rack parts. Work according to instructions and procedures to weld various parts and components in prescribed sequences and locations. Your Team Nestled in the scenic hills of Southeastern Indiana, Batesville is more than a great place to live—it’s home to Baxter’s thriving facility, where purposeful work meets a supportive community. Since 1956, our 765,000 sq. ft. site has grown to over 700 employees united by a mission: to save and sustain lives. What You'll Be Doing Check during assembly for proper weld location and size, proper fit, and operation of sliding or rotating parts. Make repairs when necessary. Ch

About Team Our Robotics team is focused on unlocking general-purpose robotics and advancing toward AGI-level intelligence in dynamic, real-world environments. Working across the full model and systems stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the physical constraints of real-world systems to improve people’s lives. About the Role We are looking for a TPM to drive development and integration of a range of sensor systems for robotics. This role will drive cross-functional alignment across requirements, engineering design, integration, validation, manufacturing, supply chain, and release processes, helping turn complex sensor-system needs into clear plans, decisions, and milestones. Location and in-person expectations: This role is based in San Francisco, CA and requires in-person presence 4 days a week. In this role you will: Drive requirements alignment across engineering design, integration, testing, and validation for camera modules, LiDAR, IMUs, RADAR, proximity sensors, audio components and the systems they interact with. Coordinate the integration of modules including electrical, mechanical, harnessing, and software interfaces with the full robotic system with deep understanding of timelines to drive the respective PCBAs, enclosures, build and test fixtures, connectors and cables. Establish effective cadences for technical reviews, BOM readiness, change management, production releases, approvals, and decision tracking. Align harnesses, fasteners, assembly fixtures, test fixtures, and documentation so cross-functional teams can execute against a clear plan. Lead validation planning around functional, reliability, NVH failure modes, including testing needs, schedules, and exit criteria. Partner with manufacturing and supply chain to manage handoffs, lead times, dependencies, and production readiness. Drive tradeoff decisions across cost, qua

ABOUT BASETEN Baseten powers mission-critical inference for the world's most dynamic AI companies, like Cursor, Notion, OpenEvidence, Abridge, Clay, Gamma and Writer. By uniting applied AI research, flexible infrastructure, and seamless developer tooling, we enable companies operating at the frontier of AI to bring cutting-edge models into production. We're growing quickly and recently raised our $1.5B Series F , led by Altimeter Capital, Conviction Partners, and Spark Capital. Join us and help build the platform engineers turn to to ship AI products. THE ROLE We’re seeking a GPU Kernel Engineer to join our team at the cutting edge of AI acceleration, where your code directly impacts the performance of state-of-the-art machine learning models. As a GPU Kernel Engineer, you'll craft the foundation that powers modern AI workloads, optimizing every microsecond of computation to enable breakthrough applications. You'll work in a fast-paced, intellectually stimulating environment where technical excellence is paramount and your contributions directly influence production systems serving millions of users across numerous products. This role offers exceptional growth potential for engineers passionate about low-level optimization and high-impact systems work. EXAMPLE INITIATIVES You'll get to work on these types of projects as part of our Model Performance team: Baseten Embeddings Inference: The fastest embeddings solution available The Baseten Inference Stack Driving model performance optimization RESPONSIBILITIES Core Engineering Responsibilities Design and implement high-performance GPU kernels for key ML operations, including matrix multiplications, attention mechanisms, and mixture-of-experts routing Write and optimize code using CUDA, PTX assembly, and architecture-specific techniques Apply advanced performance optimization methods such as memory coalescing, warp-level programming, tensor core acceleration, and compute/memory overlap Performance & Innovation Impl

At ClickUp, we're building the future of work: the first truly converged AI workspace unifying tasks, docs, chat, calendar, and enterprise search, all supercharged by context-driven AI. We are an AI-native company. Every team member is expected to leverage AI daily, and we evaluate AI fluency as part of our hiring process. Join us and help redefine what's possible. 🚀 The Mission The Foundry is ClickUp's internal AI innovation lab — embedded inside GTM Systems and accountable for turning AI capabilities into production-grade, internally deployed products that make every GTM function faster and smarter. We build the infrastructure that powers AI-first work across Sales, Marketing, Post-Sales, and Revenue Operations. As the Senior Software Engineer on this team you will own the technical delivery of our MCP server platform, agent orchestration layer, and internal tooling — shipping production systems used daily by hundreds of ClickUp employees, and scaling your own throughput by treating AI tools as first-class engineering collaborators. What You'll Own MCP Server Platform Design, build, and operate Model Context Protocol servers that expose CRM, ticketing, analytics, and communication data to AI agents across the GTM stack Implement Okta PKCE authentication flows and RBAC policy enforcement so agents access only the data they're authorized to touch Maintain deployment infrastructure on AWS (Bedrock, Lambda, ECS, API Gateway) and contribute to GCP workloads where applicable Own observability: structured logging, distributed tracing, latency SLOs, and on-call runbooks for every production server Agent Orchestration & AI-Native Products Build and maintain multi-step autonomous agents that execute end-to-end GTM workflows — lead qualification, deal room assembly, onboarding automation, support triage, and more Architect prompt engineering frameworks, tool-call schemas, and agent evaluation harnesses that make AI behavior predictable and auditable Integrate with LLM p

About Sentry Software runs the world and the pace is faster than ever. Sentry helps developers fix errors and performance issues before users notice, so teams can spend less time firefighting and more time building. Trusted by 200,000+ organizations, Sentry is today’s application monitoring standard and our team is building its AI-native future. About the role Sentry provides developer-first observability to over 4 million developers worldwide. The Events Analytics Platform (EAP) team is at the heart of that mission: it powers how all of Sentry's event data, such as errors, transactions, spans, profiles, replays, and metrics, is stored, queried, and analyzed. It also powers Sentry's latest AI push, Seer. The EAP team makes it possible for developers to efficiently search and debug across massive volumes of data, providing the context needed to understand and fix issues quickly. This team is also a cornerstone of Sentry's long-term strategy to become a context assembly and telemetry platform that unifies different signals so developers can see the complete picture. As an engineering manager on the EAP team, you will lead a group of engineers building and scaling one of Sentry's most critical data platforms. You will be responsible for driving architectural evolution, ensuring system stability, and mentoring a talented team. This is a highly visible leadership role with direct ties to Sentry's long-term product and platform strategy. What you'll do Grow and develop a team of engineers with high expectations for ownership and impact Set the technical and strategic direction for the team, balancing short-term stability with long-term architectural evolution Drive development of core EAP features, including support for complex analytical queries, dynamic routing logic across fidelity levels, storage and compute separation, and modern patterns for analytical storage Ensure EAP can support the workload demands of AI agents and MCP servers that unlock new AI capabilities fo

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

About the Team The Integrity team builds the systems OpenAI uses to understand, prevent, and respond to misuse across our products. We partner with Product, Policy, Safety Systems, User Operations, Security, Legal, Privacy, OpenAI for Government, and research teams to turn policy and threat models into product controls, review workflows, measurement systems, and enforcement paths. About the Role We are hiring a Product Manager to own Integrity's product strategy for sensitive deployments: contexts where model capability, customer or deployment setting, privacy constraints, and misuse potential make the operating bar unusually high. This includes government and other high stakes deployments, regulated or high-trust enterprise contexts, zero data retention and privacy-constrained environments, and agentic workflows where harm can unfold across many steps rather than a single prompt. The Sensitive Deployments PM will focus on high-consequence use cases relevant to government deployments and broader deployment-readiness questions for high-risk domains (e.g., healthcare), while building reusable Integrity capabilities for agentic detection and enforcements in these environments. This position is based in San Francisco, CA, with relocation assistance available. In this role, you will: Own the roadmap for sensitive deployment Integrity controls and readiness criteria. Define how we measure residual risk, decision quality, review quality, and mitigation effectiveness. Build agentic investigation and context-assembly workflows for complex, multi-step misuse patterns. Partner with Policy, Legal, Privacy, Safety Systems, User Ops, Government, and product teams to build shared capabilities. Create launch and deployment playbooks for sensitive customer, capability, and product contexts. You might thrive in this role if you: Have shipped complex product systems in AI, integrity, trust and safety, security, privacy, risk, government, regulated enterprise, or AI safety. Can turn am

Work Flexibility: Onsite Schedule - Friday–Saturday: 5:00 a.m. – 7:00 p.m. Sunday: 5:00 a.m. – 6:30 p.m. Important: Candidates must be able to attend Youniversity training on the weekday their first week. What you will do - As an Assembler I, you will assemble mechanical units, fabricated parts/components and/or electrical/electronic systems to make subassemblies, assemblies or complete units using hand tools, power tools, jigs, fixtures and miscellaneous equipment. Under general supervision, assembles components that may include sub-assemblies, manual components and electrical components and all other related components to contribute to completion of a variety of products. Work from process work instructions and test procedures to complete tasks along with monitoring and recording related documentation to meet quality requirements Follow production build rates, schedules and meet required cycle times Assemble cartons and containers and prepare products for shipment in accordance with domestic, international and/or customer specifications Uses a variety of tools that may include, but are not limited to: manual and power hand tools, pneumatic tools, test equipment, presses, and measuring and cutting devices Responsible for set-ups, work preparation, clean up, and quality assurance of own work and work-area Meet work schedule and overtime requirements, including weekends Medium work: Exerting up to 50 pounds of force occasionally and/ or up to 20 pounds of force constantly to move objects What you need: Preferred Qualifications: High School or GED Manufacturing Experience $20.25/hr. &#43; $2.00 Shift Premium