Design Methodology in United States

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our IP delivery timelines are set as much by flow maturity as by design work. This role develops, deploys, and owns the RTL-to-GDSII methodology the IP physical design team runs on, so a new block, node, or customer variant starts from a working flow instead of a cold start. This role is hybrid, based out of Toronto, ON; Austin, TX, or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A physical design or CAD methodology engineer who has built flows that production teams depend on daily. Automation-minded, happiest when you are removing manual steps and making PPA exploration repeatable. Building with AI as part of how you develop flows, and opinionated about where LLMs and ML-driven optimization genuinely help versus where they do not. An effective partner to design teams and EDA vendors, and a clear writer who documents flows well enough that others can run them without you. What We Need An Engineer with 5+ years developing and supporting physical design methodology or CAD flows in production use. Expertise with industry-standard tools (FusionCompiler/ICC2, Innovus/Genus, PrimeTime, RedHawk) and scripting languages (T

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a software engineer to help build the design methodology, software abstractions, and infrastructure that enable a small silicon team to develop complex chips rapidly and with high confidence. You will turn evolving architecture and design needs into reusable tools and workflows that improve iteration speed, quality, and then apply those tools to help construct world-class silicon. You’ll work closely across architecture, design, verification, performance modeling, and systems software. This role is well suited for an engineer who enjoys building high quality software and is motivated by the challenge of improving velocity and quality of the silicon development process. In this role, you will: Develop and scale design methodologies for rapid first-party chip development and apply them to construct complex custom chips Create abstractions that allow hardware structures, configurations, experiments, and results to be represented consistently across tools. Automate high-value engineering workflows and improve their reproducibility, observability, testability, and ease of use. Partner with architects, RTL designers, verification engineers, compiler engineers, and systems software engineers to gather requirements and then implement solutions. Use methodology and tooling to identify design risks early, accelerate iteration, and improve confidence in performance and implementation tradeoffs. Contribute across multiple aspects of software and hardware

Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are looking for a talented engineer to join our CPU design team and lead the front-end RTL physical implementation team. Drive CAD flows on multiple process technologies while working closely with core micro-architects to refine CPU core configurations and optimizing PPA. You’ll work on a CPU based on RISC-V ISA, collaborating with DV, PD, RTL and performance teams to deliver a functional, timing, and power-converged design. This role is hybrid, based out of Austin, TX or Santa Clara, CA. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An expert in physical design practices used to optimize PPA Experienced in high-performance physical design. Proficient in RTL coding (Verilog/VHDL) and familiar with industry-standard tools for simulation and power analysis. Skilled in synthesis, place and route tools including flows and physical design methodology. Background in CPU micro-architecture. What We Need Own front‑end physical implementation and PPA definition for a high‑performance RISC‑V CPU and CPU subsystem Work closely with microarchitects and RTL designers to “make the IP better” by optimizing frequency, power, and area

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

Role Summary The Director, Consumer Products & Surfaces leads the product-specific strategy, development, and delivery of Pfizer’s branded and select unbranded digital properties. This individual will act as the product lead for all branded websites and owns the product execution of how brand content connects to the external surfaces where patients and consumers increasingly encounter it — search, AI assistants and answer engines, and syndication partners. This is an individual contributor role for someone who can think in big-picture product strategy and drive hands-on execution. Working from the business case and strategy set by the Ecosystem Strategy team, the Director defines what branded surfaces should become as content consumption shifts from destinations to sources and delivers the roadmap that gets them there. Role Responsibilities Product Strategy & Definition Leads branded website development end-to-end, determining what a successful branded experience looks like and how it is measured. Decide which features and capabilities branded surfaces should prioritize, translating the ecosystem strategy, business case, consumer insight, and performance data into a coherent roadmap. Translate the ecosystem strategy for branded and unbranded surfaces into product decisions, partnering with Ecosystem Strategy on roles, audience handoffs, and journey logic across properties. Own the product execution of brand content connectivity to external surfaces — the content structures, infrastructure, and integrations that make branded content machine-readable and discoverable — partnering with Strategy on which surfaces to prioritize and the portfolio posture toward each. Champion human-centered design methodology to ensure product decisions are grounded in real consumer needs rather than assumption or internal preference. Produc

At Snowflake, we are powering the era of the agentic enterprise. To usher in this new era, we seek AI-native thinkers across every function who are energized by the opportunity to reinvent how they work. You don’t just use tools; you possess an innate curiosity, treating AI as a high-trust collaborator that is core to how you solve problems and accelerate your impact. We look for low-ego individuals who thrive in dynamic and fast-moving environments and move with an experimental mindset — who rapidly test emerging capabilities to discover simpler, more powerful ways to deliver results. At Snowflake, your role isn't just to execute a function, but to help redefine the future of how work gets done. Snowflake is seeking a Field Enablement Business Partner to serve as the Chief Activation Officer for both our Account Executive and Customer Experience organizations. Embedded within key field leadership teams, you operate as a strategic partner who diagnoses capability gaps tied to business outcomes, translates complex technical and product knowledge into compelling learning experiences, and designs programs that make the field more capable, whether that means closing a deal or architecting a technical solution. This role sits at the intersection of technical depth and sales craft. You build hands-on labs and technical content that SEs can use the next day, and you design methodology-grounded sales training that sharpens AEs' sales skills. You are the connector between Product, Marketing, Field Engineering, and Field Sales, and the person who makes sure capability actually changes. In this role, you will Act as a strategic enablement business partner for Sales, Services Delivery, and Sales Engineering leadership alike, diagnosing skill gaps tied to business outcomes, prescribing targeted interventions, and measuring whether capability actually changed Own programs end-to-end , spanning ideation, content creation, delivery, measurement, and iteration. This includes program

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are seeking a highly skilled Physical Design Engineer with deep expertise in physical design and methodology. This individual contributor role sits within our physical design team and is central to delivering power, performance, and area (PPA) optimized datapath and interconnect solutions for next-generation AI accelerators. You’ll work closely with RTL designers to define and execute on physical design strategies. You will develop tools, flows and methodologies to increase team productivity. Your work will directly impact silicon’s performance and cost efficiency, as well as the team’s execution velocity and quality. In this role, you will: Develop, build and own tools, flows and methodologies for physical implementation Own physical implementation of floorplan blocks from floorplanning to final signoff Collaborate with RTL designers to drive optimal block implementation solutions Analyze and optimize design for timing, power, and area trade-offs, working in collaboration with EDA vendors and ASIC partners Qualifications: BS w/ 4+ or MS with 2+ years or PhD with 0-1 year(s) of relevant industry experience in physical design and methodology development Demonstrated success in taping out complex silicon designs Hands-on experience with block physical implementation and PPA convergence Strong coding experience with python, bazel, TCL Strong experience building physical design tools, flows and methodologies Strong understanding of microarchitecture, RTL design,

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an Physical Design Engineer to lead cross-functional efforts to solve complex physical design challenges and develop end-to-end RTL-to-GDS methodologies across advanced nodes, with a strong focus on PPA and runtime improvements. The engineer will architect, integrate, and deploy AI/ML-driven solutions into production physical design flows, creating custom CAD tools and partnering with internal teams and EDA vendors to drive next-generation, ML-enabled capabilities. This role is hybrid, based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who you are BS in Electrical or Computer Engineering (or equivalent experience) with 5+ years in Physical Design CAD methodology at advanced nodes. Proven track record improving PPA and/or runtime on high-performance, low-power taped-out designs. Hands-on with industry-standard EDA tools (e.g., Fusion Compiler) across synthesis, P&R, STA, signoff, and hierarchical flows. Strong Python/Tcl and data skills, with interest or experience in ML frameworks (PyTorch, TensorFlow), and the ability to drive complex projects independent

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today. Design-for-X Engineering at NVIDIA works on groundbreaking innovations involving crafting creative solutions in AI for Chip Design and AI for Predictions in various use cases in manufacturing testing on some of the industry's most complex semiconductor chips. What you'll be doing: As a senior member in our team, you will work on innovating in the DFT Power, Thermal & Voltage Noise Methodology areas. This will include working on groundbreaking low power & thermal solutions for our manufacturing tests to be enabled at conditions that push the boundaries for our datacenter GPUs. You will work with multi-functional teams including Product Development & Power Architecture, implementing brand-new methodologies on hard-to-solve problems for improving our outgoing quality of chips. You will work on post-silicon data analysis for power to architect the next-gen solutions. In addition, you will help develop and deploy DFT methodologies for our next generation products using Applied ML & Gen AI solutions. You will also help mentor junior engineers on test designs and trade-offs including cost and quality. What we need to see: BSEE (or equ

About the Team OpenAI’s Forward Deployed Engineering team partners with leading semiconductor companies to deploy production-grade AI systems across the entire chip design lifecycle: design, verification, and physical design. We operate at the intersection of customer delivery and core platform development, embedding deeply with customers to translate frontier model capabilities into systems that materially improve engineering workflows and accelerate innovation. Our work turns early, high-touch deployments into repeatable solution patterns, reference architectures, and evaluation practices that scale across the semiconductor ecosystem. About the Role We are seeking a highly skilled Physical Design Engineer to join our semiconductor-focused Forward Deployed Engineering team. This is a senior IC role that will begin with a strong emphasis on physical design expertise, technical judgment, advisory leverage, and customer credibility, with the expectation that the person will grow into a broader Forward Deployed Engineering role over time. In the near term, you will serve as the team’s physical design SME across semiconductor deployments: helping FDEs, Product, and Research understand backend implementation workflows, pressure-test AI-assisted solution ideas against real physical design constraints, and raise the quality of our customer-facing technical work. You will help the broader team build fluency in implementation flows, EDA tooling, signoff methodology, and the trade-offs that shape physical design decisions in practice. Over time, we expect this role to expand beyond SME support into broader FDE ownership: partnering directly with customers, shaping deployment strategy, building and iterating production-grade AI systems, driving technical workstreams, and helping turn high-touch semiconductor deployments into repeatable solutions. This is a strong fit for someone who brings deep physical design expertise today and is excited to grow into a customer-facing, syst

NVIDIA has continuously reinvented itself over two decades. Our invention of the GPU in 1999 sparked the growth of the PC gaming market, redefined modern computer graphics, and revolutionized parallel computing. More recently, GPU deep learning ignited modern AI — the next era of computing. NVIDIA is a “learning machine” that constantly evolves by adapting to new opportunities that are hard to solve, that only we can address, and that matter to the world. This is our life’s work, to amplify human creativity and intelligence. Make the choice to join us today. Design-for-Test Engineering at NVIDIA works on groundbreaking innovations involving crafting creative solutions for DFT architecture, verification and post-silicon validation on some of the industry's most complex semiconductor chips. What you'll be doing: As a senior member in our team, you will work with pre-silicon and post-silicon data analytics - visualization, insights and modeling. Design and uphold sturdy data pipelines and ETL processes for the ingestion and processing of DFX Engineering data from various origins Lead engineering efforts by collaborating with cross-functional teams (execution, analytics, data science, product) to define data requirements and ensure data quality and consistency You will work on hard-to-solve problems in the Design For Test space which will involve application of algorithm design, using statistical tools to analyze and interpret complex datasets and explorations using Applied AI methods. In addition, you will help develop and deploy DFT methodologies for our next generation products using Gen AI solutions. You will also help mentor junior engineers on test designs and trade-offs including cost and quality. What we need to see: BSEE (or equivalent experience) with 5+, MSEE with 3+, or PhD wi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s High‑Bandwidth Memory (HBM) Digital Design organization is seeking a Digital Physical Design Engineer to drive backend implementation of high‑performance, low‑power digital logic used in advanced memory products. This role spans backend implementation from Netlist to GDSII, with a strong focus on timing closure, power integrity, and manufacturability in advanced process technologies. The successful candidate will work closely with RTL, DFT, CAD, and verification teams to deliver high‑quality physical designs, contribute to methodology improvements, and help push performance, power, and area (PPA) targets in complex, multi‑hierarchy designs. Key Responsibilities: Own and execute physical design implementation from synthesized netlist through GDSII, including floorplanning, placement, clock tree synthesis, routing, and physical signoff Utilize AI-Enabled tools in the Netlist to GDS flow Perform and drive timing closure across multiple modes, corners, and scenarios using industry‑standard STA tools Analyze and resolve congestion, timing, IR drop, EM, and power integrity issues Develop and refine floorplans, power grids, and clocking strategies for high‑performance designs Work with placement and timing closure of custom analog hard IP macros in a digital-on-top design flow Collaborate closely with RTL designers to influence partitioning, constraints, and micro‑architecture decisions early in the design cycle Implement and va

Senior Systems Design & Integration Specialist Company: The Boeing Company The Boeing Company is currently seeking a Senior Systems Design & Integration Specialist to join the team in Seal Beach, CA; Berkeley, MO; Hazelwood, MO; Chicago, IL; or Everett, WA. The System Design & Integration Specialist will work proactively, while being a customer-obsessed problem solver with a true "find a way" attitude — someone who champions customer needs and owns solutions from concept through implementation. If you thrive collaborating across globally dispersed teams and vendors, lead meetings with confidence, and enjoy using strong analytical skills and Boeing in-house tools to tackle challenging problems independently, you'll excel here. Bring your detail-oriented, organized approach and ability to juggle multiple projects and deadlines and join us to make a measurable impact on high-value customer outcomes. Position Responsibilities: Act as workload manager for consultation requests submitted through any means (official Service Now requests, email requests, shoulder taps, etc.) with goal of having customers be comfortable with researching self-help articles and submitting requests through correct channels Gather customer feedback on processes and find ways to improve overall time to complete requests Incorporate feedback into regular daily activities utilizing Agile methodology, or Product Lifecycle Management processes Consult with customers (end-users) to gather requirements and identify if needs could be met with existing solutions or not Prioritize those requests to design, test, and implement a solution Work with appropriate product supplie

The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. NVIDIA’s Silicon Co-Design Group is hiring a Chip Lead to serve as the technical lead for one of our most consequential silicon programs! This is not project management, and it is not a senior IC role. You are the person the program partners with on its hardest technical questions — when the right answer is not obvious, and when leadership needs a single technical perspective to align on direction. You are accountable for the technical integrity of the chip end-to-end. You guide co-design feature integration, help resolve the toughest multi-functional bugs, and serve as the project-specific custodian of the qualification playbook. The program runs cleaner because you are on it! What you’ll be doing: You will partner across design, validation, software, and manufacturing to keep the program’s technical narrative clear and on track. Day to day, you will: Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs. Co-lead program-level feature integration from chip to system, surfacing inter-function dependencies and guiding them to resolution. Help resolve the program’s hardest multi-functional bugs by translating ambiguous, multi-team symptoms into root-cause closure on areas such as HBM, power and thermal, high-speed I/O, and packaging. Steward the qualification playbook. When the playbook does not fit a situation, guide the mitigations and capture the lessons as reusable methodology for other SSG programs. Shape the program’s technical narrative by surfacing key risks, trade