Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of
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Design Technologist in United States
2,348 active opportunities · Updated October 2026
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Explore current design technologist jobs across United States. Filter by work mode, employment type, experience, department, date posted and distance.
Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre
Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will be joining a brilliant team to collaborate with Micron’s various design and verification teams all over the world, support the efforts of design verification flow development, optimization, and implementation and work with cross-functional team to assure the best cost, quality, reliability, time-to-market, and customer satisfaction As Memory Design Group CAD Engineer at Micron Technology, Inc., you will be working in a collaborative, production support role evaluating, developing enhancing and debugging both in-house and commercial Electronic Design Automation (EDA) tools and flows for the physical layout and design of CMOS integrated circuits. You will work closely with the Design, Layout teams, supporting their use of electronic design automation tools and methodologies to increase design and layout productivity and work efficiency. Responsibilities : Develop tools, flows, and methodologies to increase the productivity and reliability of our Memory designs Integrate commercial EDA (Electronic Design Automation) tools into design flows Provide training, documentation, and support to end users on new tools and method. Work closely with design, layout, verification and process teams. Undertake independent research and development of ne
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l
Experienced or Senior Digital Design Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital Design Engineer to join our team in Huntsville, AL and play a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Design high speed digital circuits and perform signal integrity analysis Focus on electronic systems and electrical design, simulation and verification/validation testing of high-speed printed circuit boards (PCB) throughout full product development cycle Providing design guidelines and support for system architecture design, board layout, product bring-up, debug, validation, and factory builds This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement 3 or more years of related work experience Experience in digital circuit design Preferred Qualificatio
Early Career Mechanical Design Engineer Company: The Boeing Company Boeing Test & Evaluation (BT&E) is looking for an Early Career Mechanical Design Engineer to support the Environmental Test Design Engineering team in Berkeley, MO. The primary focus of this position is to support St. Louis Environmental Lab testing for local Boeing Defense & Space (BDS) programs. The design team works in partnership with the lab test teams to provide the designs and hardware needed to complete testing. Test capabilities within the Environmental labs include vibrational/structural dynamics, acoustic, airflow systems, fuel flow systems, high temperature flow impingement, and environmental control chambers, where temperature, humidity, and pressure are varied. Mechanical Design Engineers on the team design and modify test articles, fixtures, and support structures that integrate with our lab facilities. Design work ranges from adapters and fixtures to full test rigs and complete aircraft subsystems with their support structures. Responsibilities include designing interfaces to facility infrastructure such as supplied pressure, heating/cooling, power, hydraulics, and a full suite of instrumentation. Design Engineers support fabrication, installation, connection, and acceptance/check-out to deliver test-ready hardware. Boeing St. Louis is building the future ‒ creating innovative solutions that will define the next generation of aerospace. As part of this team, you will have the opportunity to work on the latest military aircraft and weapons programs such as T-7A, F-15, F/A-18, MQ-25, JDAM, SDB, in addition to Phantom Works proprietary efforts. Position Responsibilities: Develop mechanical design criteria from
The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. NVIDIA’s Silicon Co-Design Group is hiring a Chip Lead to serve as the technical lead for one of our most consequential silicon programs! This is not project management, and it is not a senior IC role. You are the person the program partners with on its hardest technical questions — when the right answer is not obvious, and when leadership needs a single technical perspective to align on direction. You are accountable for the technical integrity of the chip end-to-end. You guide co-design feature integration, help resolve the toughest multi-functional bugs, and serve as the project-specific custodian of the qualification playbook. The program runs cleaner because you are on it! What you’ll be doing: You will partner across design, validation, software, and manufacturing to keep the program’s technical narrative clear and on track. Day to day, you will: Serve as the single technical point of contact for multi-functional decisions, issues, and trade-offs. Co-lead program-level feature integration from chip to system, surfacing inter-function dependencies and guiding them to resolution. Help resolve the program’s hardest multi-functional bugs by translating ambiguous, multi-team symptoms into root-cause closure on areas such as HBM, power and thermal, high-speed I/O, and packaging. Steward the qualification playbook. When the playbook does not fit a situation, guide the mitigations and capture the lessons as reusable methodology for other SSG programs. Shape the program’s technical narrative by surfacing key risks, trade
The SCG Architecture team is hiring a Senior Power Integrity Co-Design Engineer to architect and deliver di/dt mitigation across silicon, package, board, and platform. This role bridges architecture, silicon, and platform — translating product noise targets into shipped specifications, and feeding silicon findings back into the next generation's build. Success in this role requires strong systems thinking and a willingness to accept ambiguity. It also requires the ability to apply AI as a force multiplier while maintaining rigorous engineering judgment. What you'll be doing: Architect voltage-noise mitigation across the full stack — silicon, package, board, platform — and own the codesign trade-offs between them. Co-design noise features with Speed, Power, Reliability, Circuit Design , Power-Arch, ASIC, and platform teams. You're the connective tissue across the codesign web. Work with other team members to define product-level voltage noise targets, drive them to closure, and sign them off at shipment. Build and take ownership of the Sim-to-Si correlation methodology for noise. You know when a model is lying and when silicon is. Model and prototype next-gen noise features — transient sense, droop response, mitigation IP, and codify them so every future program inherits them. Lead show-stopper noise bugs during bringup. The critical issues stop with you. Drive architecture-level codesign tradeoffs across V/F Power Noise Reliability Thermal (Noise-Variation) and (Noise-to-Closure) boundary work, where the highest-leverage innovation lives. What we need to see: BS / MS / PhD in EE, CE, or related (or equivalent experience). 5+ years in silicon power integrity, voltage noise, or PDN. Deep expertise in at least one of
The Silicon Co-Design Group (SCG) sits at the crossroads of architecture, design, marketing, operations, and productization. Our work spans early architecture through final product delivery across Datacenter, Gaming, Robotics, Automotive, and Embedded markets. We work closely across functions to deliver chips that change what is possible. System Integration sits at the intersection of all of them. It is the layer where every architecture, design, software, and manufacturing decision meets reality. When something breaks late in a program, it usually breaks here first. We are hiring a Senior Manager to lead this team in the US and partner closely with teams globally. Your work will sit on the critical path of every NVIDIA silicon program, and the bar you set for system integration is the bar we ship to! The two hardest, highest-leverage problems in this seat: Find critical silicon issues earlier — often before software is production-ready. Left-shifting post-silicon coverage is the highest-value thing System Integration can do. Standing up wide-area testing as a repeatable capability is a core part of the role. Keep programs on milestone when upstream dependencies slip. Validation plans collide with reality every program! The team needs new strategies, not just contingency plans, to keep moving when software, firmware, or methodology slip. You will design and run those strategies. What you’ll be doing: Plan and execute post-silicon feature integration, PVT validation, and wide-area testing across NVIDIA’s GPU, SoC, and CPU programs. Build wide-area and in-system test as a repeatable capability that shifts post-silicon coverage left, so issues surface before we are production-ready. Lead resolution of the most complex system-level issues, RMAs, and HW/SW interaction problems with creative workarounds and focused lab experimentation. Deve
Are you ready to contribute to world-class innovation and push the boundaries of what's possible? At NVIDIA, you'll have the opportunity to be part of a team that is driving groundbreaking impacts across various markets. As a Thermal Solutions Development Engineer, you will play a pivotal role in our Silicon Codesign Group, transforming thermal solution concepts into lab-ready builds and beyond. What you will be doing: Build thermal solutions for engineering characterization and validation of next-gen GPU/SOC products, ensuring flawless delivery from concept to lab. Drive end-to-end development and deployment of thermal solutions, collaborating with internal teams and external vendors on build requirements, prototype evaluation, test system integration, and software automation. Improve thermal design processes by incorporating feedback and findings, developing workflow and maintaining our world-class standards. Work closely with system architects, chip and board designers, and software/firmware engineers in a dynamic and high-energy environment to bring industry-defining products to market. Apply AI-enabled approaches and AI tools to accelerate design iteration, test planning, and characterization/validation triage (e.g., requirements/spec summarization, experiment prioritization, log/telemetry summarization, anomaly/outlier detection), improving cycle time, coverage, and traceability while validating outputs against physics, specs, and lab measurements. Partner with AI/tooling teams as the thermal domain SME to define use-cases, success criteria, and evaluation methods; provide feedback to improve tool reliability and usability. What we need to see:
$98.4K – $147.6K/yr
What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support
Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans the entire quantum compute stack while harnessing the power of Intel's 18A process and design infrastructure. We are seeking an exceptional Quantum Design Engineer to join our pioneering quantum computing team. In this position, you will be joining a team of incredibly talented engineers focused on the challenging task of scaling our quantum computing chips to millions of qubits. Here you will be involved in all aspects of the qubit chip process from initial conception through Process-Design-Kit definition, design execution and tapeout, along with ensuring silicon runs smoothly in fab and final system integration. You'll work closely not only with our qubit, control, system integration, and software/algorithms teams, but also with teams in Foundry lithography, process and design. You'll be working at the intersection of cutting-edge semiconductor technology and quantum physics, creating solutions that push the boundaries of what's possible in computing. Ready to help build the future of quantum computing? Apply now and be part of this extraordinary journey Key Responsibilities • Work alongside lithography, process integration, measurement, and PDK engineers to establish qubit processes and design rules • Architect qubit and readout element standard cell design and autom
NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It’s a unique legacy of innovation that’s fueled by great technology—and amazing people. Today, we’re tapping into the unlimited potential of AI to define the next era of computing. An era in which our GPU acts as the brains of computers, robots, and self-driving cars that can understand the world. Doing what’s never been done before takes vision, innovation, and the world’s best talent. As an NVIDIAN, you’ll be immersed in a diverse, supportive environment where everyone is inspired to do their best work. Come join the team and see how you can make a lasting impact on the world. NVIDIA is seeking best-in-class ASIC Verification Engineers to verify the design and implementation of the world’s leading inference accelerator. This position offers the opportunity to have real impact in a dynamic, technology-focused company impacting product lines ranging from consumer graphics to self-driving cars and the growing field of artificial intelligence. We have crafted a team of outstanding people around the globe. Their mission is to push the frontiers of what is possible today and define the platform for the future of computing. In this position, you will help to build the high-performance processor elements that implement programmable compute and graphics functionality. What you'll be doing: As a key member of our ASIC Verification team, you will verify the design and implementation of inference accelerator You will be responsible for verification of the ASIC design, architecture, reference models and micro-architecture using advanced verification methodologies Understand the design and implementation of your unit, define the verification scope, develop the verification infrastructure and verify the correctness of the design Collaborate with architects, designers, and pre and post silicon verifi
$155.6K – $233.4K/yr
What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. Responsibilities: Drive staff results by communicating job expectations, planning, monitoring and appraising job results, coaching and counseling employees, recognizing performance issues and driving improvement, developing, coordinating and enforcing systems, policies, procedures and productivity standards Establish strategic goals by gathering pertinent business, financial, service and operations information, choosing a course of action, defining objectives, and evaluating outcomes Maintain staff by recruiting, selecting, orienting and training employees; maintaining a safe, secure and legal work environment; developing personal growth opportunities Ensure validation program meets requirements of FDA (21 CFR Part 11 and Part 820), ISO 9001/13485, IEC 62304 and MDSAP Identify differences between ISO and FDA requirements and their applicability to products targeting different markets Report broadly through the organization on validation activities and instrument manufacturing audit readiness Estimate timelines and budgeting for validation engineering development efforts Formaliz
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