Development Engineer 3 in United States

About the team OpenAI’s Forward Deployed Engineering team partners with customers to turn research breakthroughs into production systems. We operate at the intersection of customer delivery and core platform development. About the Role We are looking for customer-focused software engineers to build effective custom software that leverages OpenAI’s APIs to solve real customer problems. As an FDSWE, you will work with our customers and OpenAI Forward Deployed Engineers to design and implement scalable solutions that solve their most difficult problems. You will design abstractions to solve customer problems, and then use them to scale our speed and quality of delivery across all Forward Deployed engagements. You will collaborate closely with Sales, Solutions Engineering, Solutions Architects, and Customer Success Managers who work on the same account. You will also work with our Research and Applied Product and Engineering teams to provide insightful customer feedback. This role is based in Seattle. We use a hybrid work model of 3 days in the office per week. We offer relocation assistance. Travel up to 50% is required. In this role, you will: Embed deeply with strategic customers to understand their business challenges and technical requirements in detail. Design, architect, and develop full-stack solutions using an experiment-driven, iterative approach. Prepare detailed scopes of work and project plans for both proof-of-concept prototypes and full production deployments. Work hands-on with customers' technical teams as a technical expert and trusted advisor, coding side-by-side to drive projects to completion on their infrastructure. Collaborate with Product, Research and Applied teams to ensure seamless customer experiences, project success and actionable product feedback Contribute to internal knowledge bases, codifying best practices and sharing insights gained from customer engagements to scale the Forward Deployed Engineering function. You’ll thrive in this rol

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing Help shape the future of golf innovation as a CAD/CAM Programmer and Prototype Engineer . In this highly hands-on role, you will partner closely with R&D and engineering teams to transform new product concepts into functional prototypes that support next-generation golf equipment development. Using CAD/CAM software and advanced CNC machining technologies, you will design, program, machine, and refine prototype club heads, components, and precision fixtures. You will play a key role in bringing ideas from concept to physical reality by developing machining strategies, optimizing designs for manufacturability, and solving complex manufacturing challenges throughout the product development process. This role combines CAD/CAM programming, prototype machining, fabrication, and product development collaboration. Successful candidates enjoy working both at the computer and on the shop floor, building and improving prototypes while contributing to innovative product solutions. What You Bring Bachelor's degree in Mechanical Engineering or a related field, or equivalent professional experience in CAD/CAM programming, CNC machining, and prototype development. 3&#43; years of CAD/CAM programming experience, preferably with Siemens NX, Mastercam, Fusion 360, or similar CAD/CAM platforms. Experience with other advanced CAM systems will also be considered. <

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your Role at Baxter As a Principal DevOps Engineer, you will provide technical leadership in the design, implementation, deployment, and support of cloud and platform engineering solutions that enable product development teams. You will partner across engineering functions to build scalable, reliable, and secure infrastructure while helping drive operational excellence through automation, observability, and continuous improvement. What You'll Do: Design, implement, and support cloud infrastructure solutions that enable the development and operation of Baxter products and applications. Manage infrastructure, platform, and deployment processes for product teams to ensure reliability, scalability, and performance. Deploy, manage, and troubleshoot containerized applications using Kubernetes and cloud-native technologies. Develop and maintain Infrastructure as Code (IaC) solutions using Terraform to automate infrastructure provisioning and management. Implement and support observability, monitoring, and alert

This is where your work makes a difference. At Baxter, we believe every person—regardless of who they are or where they are from—deserves a chance to live a healthy life. It was our founding belief in 1931 and continues to be our guiding principle. We are redefining healthcare delivery to make a greater impact today, tomorrow, and beyond. Our Baxter colleagues are united by our Mission to Save and Sustain Lives. Together, our community is driven by a culture of courage, trust, and collaboration. Every individual is empowered to take ownership and make a meaningful impact. We strive for efficient and effective operations, and we hold each other accountable for delivering exceptional results. Here, you will find more than just a job—you will find purpose and pride. Your Role at Baxter This role involves collaborating with clinicians, engineers, and cross-functional partners to improve usability, safety, and efficiency for hospital beds, mobile and overhead patient lift systems, and other product portfolios. Your efforts will directly support developing new products and sustaining engineering initiatives. When you come on board at Baxter as a Principal Engineer, Human Factors, you will apply your analytical methodology to pinpoint risks and opportunities for innovation promptly. Nimble and ready to act, you maintain composure in high-pressure situations. What you'll be doing Lead and drive implementation of training, continuous improvement efforts, and overall initiatives to improve functional outcomes. Conduct user research, usability testing, and user-centered development activities to ensure our products meet customers' needs and mitigate risk effectively. Develop and maintain human fact

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Rack Power Engineer with deep expertise in high-power conversion and distribution to design, qualify, and support power systems for AI supercomputers. You will own rack power solutions—including power shelves, AC/DC rectifiers, power supply units (PSUs), power management controllers (PMCs), and high-current distribution—from requirements and supplier development through deployment. You will also monitor fleet rack power health, lead debugging and root-cause investigations, and drive improvements into hardware, firmware, and qualification coverage. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own rack power architecture and requirements for high-power AI supercomputing systems, including power budgets, AC input interfaces, DC distribution, redundancy, efficiency, serviceability, and integration with data center infrastructure. Drive the design and supplier development of power shelves, rectifiers, PSUs, PMCs, busbars, connectors, and protection circuits. Review electrical designs and control behavior, and evaluate performance, cost, reliability, and availability trade-offs. Define and execute component, shelf, and rack qualification plans covering load transients, current sharing, hot-swap, startup and shutdown, redundancy failover, fault protection and recovery, thermal limits, and AC disturbances and ride-through

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Experienced or Senior Digital Design Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks a Digital Design Engineer to join our team in Huntsville, AL and play a vital role in the Patriot Advanced Capability-3 (PAC-3) program, one of the world's most advanced air and missile defense systems. This is your opportunity to work in a dynamic environment where your skills will directly contribute to protecting critical assets and ensuring mission success. If you are passionate about defense technology and want to make a real impact, we want to hear from you! Position Responsibilities: Design high speed digital circuits and perform signal integrity analysis Focus on electronic systems and electrical design, simulation and verification/validation testing of high-speed printed circuit boards (PCB) throughout full product development cycle Providing design guidelines and support for system architecture design, board layout, product bring-up, debug, validation, and factory builds This position requires obtaining a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement 3 or more years of related work experience Experience in digital circuit design Preferred Qualificatio

Experienced Electrical & Test Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks an Experienced Electrical and Test Engineer to serve as an Automated Test Equipment Engineer to join our Patriot Advanced Capability-3 (PAC-3) Electrical Engineering Capability Team in Huntsville, AL . We design, sustain, and upgrade next generation electronics concepts and support production and special test equipment design for increasing capacity requirements. Position Responsibilities: Support design of automated test equipment, development of engineering documentation, and hardware fabrication, integration, and validation testing Develop, document, and maintain electronic and electrical system requirements according to customer desires and contract requirements Create and implement overall Test Equipment Design strategies Review and apply real-time test anomaly troubleshooting and resolution of issues encountered during hardware validation and verification testing Support fielded test equipment hardware and software over the entire product lifecycle Research emerging technologies for potential applications to meet projected requirements Perform Root Cause Corrective Action (RCCA) investigations, troubleshooting, and resolutions This position requires the ability to get a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Sc

About the Role Discover your future at Citi Working at Citi is far more than just a job. A career with us means joining a team of more than 230,000 dedicated people from around the globe. At Citi, you'll have the opportunity to grow your career, give back to your community and make a real impact. Job Overview Citi's Integrated Digital Assets Platform (CIDAP) is at the vanguard of institutional blockchain adoption — and security is its foundation. As digital assets move from innovation to regulated infrastructure, the cryptographic integrity of every transaction, wallet, and key lifecycle operation becomes mission-critical. We are building the security layer that the world's most sophisticated financial institution can trust. We are seeking a Senior Security Engineer (VP) to join our New York-based Digital Assets Platform engineering team. This is a hands-on, Java-focused backend engineering role for a security-minded engineer who understands both the craft of secure software development and the cryptographic primitives that underpin digital asset custody, signing, and key management. You will sit inside the core engineering team — writing production code every day — while being the resident authority on cryptographic design patterns, HSM integration, MPC protocols, and security architecture. Your work will directly protect billions of dollars of digital asset infrastructure used by institutional clients worldwide. Key Responsibilities Design, develop, and maintain security-critical backend services in Java — including cryptographic libraries, key management APIs, signing wor

NVIDIA has been transforming computer graphics, PC gaming, and accelerated computing for more than 25 years. It's a unique legacy of innovation that's fueled by great technology and amazing people. Today, we're harnessing the boundless possibilities of AI to build the next era of computing. An era in which our GPU acts as the brain of computers, robots, and self-driving cars that can understand the world. Accomplishing unprecedented goals calls for imagination, inventiveness, and exceptional talent from around the world. As a NVIDIAN, you'll be immersed in a diverse, encouraging environment where everyone is inspired to do their best work. Join our team and discover how you can build a lasting impact on the world. NVIDIA's Silicon Co-Design Group (SCG) leads the full product development lifecycle, from early architecture definition through silicon bringup to product release. The ArchDev team is the hub for silicon and system-level feature development, driving tradeoff analysis, system integration, and POR alignment across the entire organization. This is where ideas become chips, and chips become products that define the state of the art — and we're building that future with some of the most motivated engineers in the industry. We're looking for a Senior Memory Systems Engineer to own HBM and LPDDR integration in sophisticated SoCs. This role covers the full stack, including silicon, package, embedded software, testing, and product development. The engineer will resolve the toughest system-level memory challenges throughout the process, building solutions that hold up at scale. What you'll be doing: HBM & LPDDR System Integration and Bringup: Drive HBM and LPDDR system integration, bringup, characterization, and debug for next-generation SoCs — taking memory subsystems through the full arc from first silicon to production-ready at scale. Full-Stack Memory Closure: <s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon