Devsecops Engineer Ai Labs in United States

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for an embedded engineer to help build firmware and associated modeling software for OpenAI’s in house AI accelerator. This role involves designing and developing drivers and functional models for a large array of HW components, writing high throughput and low latency firmware code, investigating bring-up and production issues. Responsibilities Design and implement drivers for hardware peripherals, including those related to AI chips. Design and implement functional software models to simulate SoC uncore logic and enable FW testing against the model Design and implement low-latency and high throughput embedded SW to manage HW resources. Work with adjacent software and hardware teams to implement requirements, debug issues and shape future generations of the hardware. Collaborate with vendors to integrate their technologies within our systems. Bring up and debug firmware/driver on new platforms. Come up with processes and debug issues raised in the field. Set up monitoring, integration testing and diagnostics tools. Qualifications 5+ years of experience working in embedded SW space. Ability to thrive in ambiguity and learn new technologies. Strong programming skills in C/C++ and/or Rust. Experience developing high throughput, low latency and multi-threaded code. Experience working with real time operating systems (RTOS). Experience developing hardware drivers and working with hardware Experience with HW/SW co-design Knowledge of common embedded pr

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for signal integrity (SI) system design engineers who have a deep expertise in the SI area, and hold strong system level design knowledge This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead system signal integrity (SI) design for AI supercomputer product in the data center application. Collaborate with chip, package, boards, rack and system engineers, design partners to drive system SI design and develop innovative interconnect and high-speed technologies Identify and evaluate new technologies and methodologies to improve signal and power integrity in product design, and contribute to the development of new products and technology by providing expertise in signal integrity Perform simulation and modeling to identify and troubleshoot signal integrity issues Lead system interconnect design, bring up and qualification As the scope of the role and team grows, understand and influence roadmaps for hardware partners for our datacenter networks, racks, and buildings. You might thrive in this role if you: Have at least 10 years of industry experience, including experience design hardware system and SerDes testing for data center applications Have a strong bias toward action, and won’t take no for an answer. Have experience and good knowledge of system design experience in the SI areas, from chip, SerDes, board, rack level Have ex

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI is developing custom silicon to power the next generation of frontier AI models. We’re looking for experienced Design Verification (DV) Engineers to ensure functional correctness and robust design for our cutting-edge ML accelerators. You will play a key role in verifying complex hardware systems—ranging from individual IP blocks to subsystems and full SoC—working closely with architecture, RTL, software, and systems teams to deliver reliable silicon at scale. In this role you will: Own the verification of one or more of: custom IP blocks, subsystems (compute, interconnect, memory, etc.), or full-chip SoC-level functionality. Define verification plans based on architecture and microarchitecture specs. Develop constrained-random, directed, and system-level testbenches using SystemVerilog/UVM or equivalent methodologies. Build and maintain stimulus generators, checkers, monitors, and scoreboards to ensure high coverage and correctness. Drive bug triage, root cause analysis, and work closely with design teams on resolution. Contribute to regression infrastructure, coverage analysis, and closure for both block- and top-level environments. You might thrive in this role if you have: BS/MS in EE/CE/CS or equivalent with 3+ years of experience in hardware verification. Proven success verifying complex IP or SoC designs in industry-standard flows Proficient in SystemVerilog, UVM, and common simulation and debug tools (e.g., VCS, Questa, Verdi). Strong knowledge

About the team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the role: We are seeking an experienced Optical Network Engineer to lead Laser related work within our optical interconnect efforts for large-scale compute systems. The role also requires broad, hands-on optical validation experience across IM/DD-based interconnects, working from lab characterization through production readiness and scaled deployment. In this role you will: Drive laser-focused requirements and technical direction within the broader optical interconnect roadmap. Lead evaluation and validation of optical components and subsystems, including laser-based elements, in lab and production-representative environments. Support end-to-end optical testing for IM/DD interconnects (e.g., module/system bring-up, characterization, debug, and readiness for scale). Work with external partners to align on development milestones, performance targets, and quality expectations. Own technical issue triage and resolution across performance, reliability, and manufacturability topics. Collaborate across internal teams to support integration, rollout, and operational success at scale. You might thrive in this role if you have: Strong experience in laser-focused optical engineering (development, validation, manufacturing readiness, or field support). Broad hands-on background with IM/DD optical technologies and optical test/debug workflows. Experience working with external suppliers/manufacturing partners and production-oriented execution. Demonstrated ability to debug complex t

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing & quality engineer, who will be responsible for driving technical initiatives related to the manufacturing, quality and reliability of our AI supercomputer hardware systems to ensure product success from concept to launch and through mass production. You’ll have the opportunity to coordinate with functional SMEs and work with a wide range of stakeholders, from design engineering and operations teams, TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees In this role, you will: Own the integrated manufacturing and quality readiness for a product across L6, L10, and L11, with clear gates, milestones, deliverables, owners, and closure criteria. Lead readiness of process flows, tooling, fixtures, assembly operations, test interfaces, and production controls. Review and contribute to work instructions. Translate product requirements into qualification plans, process controls, test requirements and acceptance criteria with design engineering and Area SMEs Coordinate and drive execution of product and process qualification, reliability testing, and validation with the relevant SMEs. Maintain traceable evidence that assigned products and processes meet agreed performance, reliability,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for an experienced systems software engineer to help define and build the host software stack for our custom next-generation AI systems. You will work close to the hardware on performance-critical software, including Linux kernel drivers, high-throughput I/O paths, and system-scale networking and RDMA. This role spans architecture, implementation, platform bring-up, debugging, and performance optimization. You will work across hardware and software boundaries to make new systems usable end to end, from low-level device interfaces through userspace tooling and production validation. In this role you will: Design, implement, and debug host-side systems software for AI infrastructure, including Linux kernel drivers and supporting userspace components. Build and optimize software paths for high-throughput, low-latency communication, including RDMA and related networking functionality. Develop software around PCIe, DMA, NICs, accelerators, memory movement, and device interaction. Bring up new hardware platforms and diagnose complex issues across kernel, firmware, networking, and hardware boundaries. Build tooling for integration, testing, diagnostics, observability, qualification, and performance characterization. Collaborate with hardware, networking, and platform teams to define interfaces and integrate new capabilities. Work with external vendors where needed to integrate technologies and drive issues to resolution. Contribute across the systems sof

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role summary We are seeking a Networking Operating System Firmware Engineer to help bootstrap and scale the switching layer of our AI supercomputers. In this role, you will build and maintain custom NOS images from scratch, using open source components from SONiC, SAI, FRR, and related networking stacks while working across the Linux kernel, switch ASIC SAI/SDKs, platform drivers, control-plane services, and orchestration layers. This is a software engineering role that requires a deep understanding of networking, NOS internals, switch hardware, and production systems. You will design, implement, test, and debug production NOS software across platform drivers, routing and control-plane state, ASIC programming, observability, and fleet integration. The engineer in this role should be able to work through ambiguous, open-ended technical problems and drive feature development across software, hardware, and vendor boundaries. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will Design, develop, and maintain custom NOS images for large-scale AI fabrics, using open source components from SONiC, FRR, and related networking stacks. Integrate, build and configure Linux kernel components, device drivers, switch ASIC SDKs, and SAI layers. Bring up new switch platforms, including thermal and fan control, power monitoring, transceiver management, watchdogs, OSFP CMIS, L

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About the Team OpenAI’s Hardware organization develops system and infrastructure solutions designed for the unique demands of advanced AI workloads. We work closely with architecture, infrastructure, and vendor teams to evaluate system performance and guide critical design decisions. Our team focuses on building and applying performance modeling frameworks to understand system behavior, quantify tradeoffs, and support next-generation infrastructure design. About the Role We are seeking an Performance Modeling Engineer to support the development and application of modeling tools used to evaluate AI system performance and inform architectural decisions. In this role, you will partner closely with Senior Performance Modeling Engineers and the Performance Modeling Lead to analyze system behavior, run simulations and analytical models, and help evaluate tradeoffs across compute, memory, networking, and storage. You will contribute to building modeling frameworks while developing a strong foundation in system architecture and AI infrastructure. This role is ideal for early-career engineers with 1–2 years of experience in software engineering, systems analysis, or performance modeling who are excited to grow in large-scale infrastructure and hardware/software systems. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Support the development and maintenance of performance modeling tools and frameworks Assist in building models to evaluate system behavior across compute, memory, networking, and interconnect subsystems Help analyze distributed system scaling behavior and identify performance bottlenecks Run simulations and analytical models to support architecture and infrastructure decisions Partner with senior engineers to evaluate design tradeoffs across hardware and system components Interpret modeling outputs and help translate findings into clear recommendations Vali

About the Team OpenAI’s Hardware organization develops system and infrastructure solutions designed for the unique demands of advanced AI workloads. We work closely with architecture, infrastructure, and vendor teams to evaluate system performance and guide critical design decisions. Our team focuses on building and applying performance modeling frameworks to understand system behavior, quantify tradeoffs, and inform next-generation infrastructure design. About the Role We are seeking Performance Modeling Engineers to develop and apply modeling tools that evaluate AI system performance and inform architectural decisions. In this role, you will work closely with the Performance Modeling Lead and partner teams to analyze system behavior, run simulations or analytical models, and help quantify tradeoffs across compute, memory, networking, and storage. You will contribute to building modeling frameworks and applying them to real-world questions that impact system design and vendor decisions. This role is well-suited for engineers with strong software or modeling backgrounds who are interested in developing deeper expertise in system architecture and AI infrastructure. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Develop and maintain performance modeling tools and frameworks. Build models to evaluate system behavior across: compute, memory, and interconnect subsystems distributed system scaling and bottlenecks. Run simulations and analytical models to support architectural tradeoff analysis. Collaborate with performance modeling lead and system architects to answer forward-looking design questions. Analyze and interpret modeling outputs, translating results into actionable insights. Validate models against real system measurements and workload behavior. Contribute to improving modeling fidelity, usability, and scalability. Qualifications Strong software engineeri

Our Purpose Mastercard powers economies and empowers people in 200+ countries and territories worldwide. Together with our customers, we’re helping build a sustainable economy where everyone can prosper. We support a wide range of digital payments choices, making transactions secure, simple, smart and accessible. Our technology and innovation, partnerships and networks combine to deliver a unique set of products and services that help people, businesses and governments realize their greatest potential. Title and Summary Lead Workday Engineer - Integrations and Extend Overview The P&C Engineering team designs, develops, and implements technology solutions that improve and engage Mastercard employees across the globe. • Do you enjoy building enterprise applications that solve complex business challenges at global scale? • Do you have a passion for architecting innovative Workday solutions that improve employee experiences? • Do you thrive in environments where modernization, automation, AI, and continuous improvement are strategic priorities? • Can you connect business strategy with technical architecture and guide engineering teams toward the right solution? This role serves as a Lead Integration Engineer, responsible for architecting enterprise applications, modern employee experience, and scalable platform capabilities. You will lead the evolution of Mastercard's Workday platform through Workday Extend, AI, automation, APIs, and modern application development. Role • Lead the architecture, design, development, testing, implementation, documentation, and support of enterprise applications using Workday Extend. • Architect scalable solutions leveraging Workday Extend, Orchestrate, APIs, Studio, Core Connectors, EIBs, and Workday Web Services. • Design reusable application frameworks, s

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma