Dram Device And Process Modeling Engineer in Boise

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Realtime Defect Analysis (RDA) Yield Technology team supports advanced DRAM research and development by identifying, analyzing, and reducing manufacturing defects that impact yield and product performance. The team partners closely with engineers across R&D and High Volume Manufacturing to improve process stability, accelerate learning cycles, and drive continuous improvement through data-driven decision making. As an RDA Yield Technology Intern, you will gain hands-on experience with innovative semiconductor processing, defect inspection systems, and advanced analytical techniques. You will contribute to projects focused on experimentation, defect detection, data analysis, and process optimization while collaborating with multi-functional engineering teams. This role is ideal for individuals who are passionate about problem solving, root-cause investigation, and leverausingology to improve manufacturing performance. Responsibilities Analyze experimental process flows and defect inspection data to identify anomalies, investigate root causes, and support corrective actions. Partner with R&D and manufacturing teams to improve yield performance through defect detection, process monitoring, and continuous improvement initiatives. Leverage Artificial Intelligence (AI) and data analytics tools to accelerate defect detection, identify yield-impacting trends, automate routine analysis workflows, and generate actionable insights. Use inline defect signals, statistical analys

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop