Electrical Design Engineer in United States

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a Rack Power Engineer with deep expertise in high-power conversion and distribution to design, qualify, and support power systems for AI supercomputers. You will own rack power solutions—including power shelves, AC/DC rectifiers, power supply units (PSUs), power management controllers (PMCs), and high-current distribution—from requirements and supplier development through deployment. You will also monitor fleet rack power health, lead debugging and root-cause investigations, and drive improvements into hardware, firmware, and qualification coverage. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own rack power architecture and requirements for high-power AI supercomputing systems, including power budgets, AC input interfaces, DC distribution, redundancy, efficiency, serviceability, and integration with data center infrastructure. Drive the design and supplier development of power shelves, rectifiers, PSUs, PMCs, busbars, connectors, and protection circuits. Review electrical designs and control behavior, and evaluate performance, cost, reliability, and availability trade-offs. Define and execute component, shelf, and rack qualification plans covering load transients, current sharing, hot-swap, startup and shutdown, redundancy failover, fault protection and recovery, thermal limits, and AC disturbances and ride-through

About the Team The Consumer Devices team at OpenAI builds end-to-end hardware and software systems that bring AI into the physical world. We work at the intersection of custom silicon, embedded systems, operating systems, cloud services, mechanical engineering, electrical engineering, and product design to deliver reliable, production-ready devices at scale. Within Consumer Devices, Hardware Engineering eXperience, or HEX, is a new bootstrapped team building the environments, applications, compute, product-data systems, and workflows that let hardware engineers do their work without needing to troubleshoot the machinery underneath. HEX owns virtual engineering environments, HPC/GPU compute, storage, networking, licensing, MCAD/ECAD/CAE applications, PLM, product data, automation, validation, and support as one connected system. About the Role As a Staff PLM & Engineering Applications Engineer, you will be one of the first technical builders of HEX and the primary counterpart to the HEX lead. You will own the engineering-application and product-data side of the hardware engineering experience, with an initial focus on NX, Teamcenter, licensing, parts import, integrations, packaging, validation, and user workflows. This is not a traditional Teamcenter administration role and not a Corporate IT application-support role. You will take complex, fragile workflows and turn them into reliable engineering systems. This role is highly hands-on and systems-oriented. You will not inherit a mature environment and support queue. You will help build a fresh one, replacing manual setup guides, tribal knowledge, repeated support issues, and team handoffs with tested automation and reliable workflows. In This Role, You Will Own the technical architecture, deployment, configuration, integration, validation, and long-term operation of NX and Teamcenter. Build reliable workflows for parts import, product-data migration, metadata quality, BOMs, revisions, lifecycle states, and releas

We are now looking for a Senior SRAM Engineer within our Full Custom Memory (FCM) team! The FCM team designs specialized RAM implementations across NVIDIAs wide array of processing chips. Be it high speed, low power, multiport, we engage closely with processor architecture teams to build custom solutions across the entire NVIDIA silicon portfolio. Are you interested in designing circuits for the next generation of AI chips? Join a team of dedicated engineers developing the custom SRAM circuits that help power these chips. What you'll be doing: Design best-in-class SRAM circuits using state-of-the-art technology processes Optimize circuits for performance, area, and power Collaborate with mask designers to craft high quality and dense pitch-matched layout Verify functionality, electrical integrity, and robustness Improve/develop flows and methodologies to streamline design automation, data collection, and analysis to ensure working silicon What we need to see: BS/MS/PhD (or equivalent experience) in Electrical or Computer Engineering Minimum 12 years of circuit design experience Strong understanding of SRAM and memory design techniques and macro/block development Ways to stand out from the crowd: Self-motivation, attention to detail, clear data analysis and presentation skills Familiarity with industry tools such as Cadence Virtuoso for schematic and layout, SPICE simulators, waveform viewers Background with developing and using various flows and methodologies, in

About the Team OpenAI's mission is to ensure that artificial general intelligence benefits all of humanity. The Consumer Devices team is building a new generation of AI-powered products that seamlessly integrate hardware and software to create intuitive, transformative experiences. We bring together experts across embedded systems, machine learning, hardware, design, and product engineering to develop products at the intersection of AI and consumer technology. About the Role OpenAI is seeking a System Power Engineer to characterize, measure, and optimize power consumption across our embedded hardware products. In this role, you will work closely with Electrical Engineering and system software teams to build power test automation, measure subsystem-level power usage, and drive improvements that directly impact battery life, thermal behavior, charging performance, and system reliability. You will help establish the methodologies and metrics used to understand and improve power efficiency across real-world product experiences, from controlled lab environments to representative day-in-the-life usage scenarios. This role requires hands-on experience with embedded hardware platforms, power instrumentation, and the analysis of power profiles and system behavior. This role is based in San Francisco, CA. We use a hybrid work model of four days per week in the office and one day working remotely. Relocation assistance is available for new hires. In this role, you will: Define and develop power testing automation to evaluate system behavior across a range of workloads and operating conditions. Measure subsystem-level power consumption using power breakout probes and other lab instrumentation. Develop and execute power characterization tests spanning basic workloads, complex mixed-use scenarios, and representative day-of-use experiences. Partner closely with Electrical Engineers to identify opportunities to improve system power efficiency. Collaborate with software engineering

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

Job Details: Job Description: The world is transforming - and so is Intel. Intel is a company of bold and curious inventors and problem solvers who create some of the most astounding technology advancements and experiences in the world. With a legacy of relentless innovation and a commitment to bring smart, connected devices to every person on Earth, our diverse and brilliant teams are continually searching for tomorrow's technology and revel in the challenge that changing the world for the better brings. We work every single day to design and manufacture silicon products that empower people's digital lives. Come join us and do something wonderful. Join us as a Manufacturing Failure Analysis Engineer, where you'll play a pivotal role in ensuring the quality and reliability of Intel's next-generation silicon, product, package, platforms, and board process technologies. You will identify failures, conduct root cause analyses, and develop innovative methodologies to enhance performance and yield. By leveraging your expertise, you'll contribute to driving manufacturing innovation and supporting the delivery of world-class products. The ideal candidate brings hands-on experience in probing, strong understanding of device behavior, and the ability to independently execute complex debug workflows. Business group You will be part of Intel's manufacturing organization, a cornerstone of our operations that focuses on advancing semiconductor process technologies and ensuring product excellence. This team is dedicated to delivering high-quality solutions that support Intel's broader mission to create groundbreaking technologies that power the future. Key Responsibilities: • Operate general failure analysis tools in the labs, such as TEM, SEM, optical scopes. • Perform electrical probing an

We are seeking a detail-oriented PCB Layout Engineer to maintain electronic component libraries and develop printed circuit board layouts. This role works closely with electrical engineering, mechanical engineering, procurement, and NPI to ensure component data and PCB designs are accurate, consistent, and ready for production. This position is in Austin, Texas. Key Responsibilities Create, verify, and maintain schematic symbols, PCB footprints, and associated 3D models. Validate component pin assignments, dimensions, land patterns, and library attributes against manufacturer documentation. Maintain library naming conventions, revision control, and component approval processes. Develop PCB layouts from approved schematics, including component placement, routing, stackup coordination, and design rule setup. Collaborate with engineers to address electrical, mechanical, thermal, and manufacturing requirements. Run design rule checks, resolve layout issues, and participate in design reviews. Prepare fabrication and assembly deliverables, including Gerber or ODB++ files, drill files, drawings, and pick-and-place data. Coordinate with PCB fabricators and assembly suppliers to resolve manufacturing questions. Support engineering changes and maintain accurate release documentation. Work with procurement and engineering to identify obsolete components and evaluate suitable alternatives. Required Qualifications Experience with setting up PCB design and electronic component library management. Proficiency in Cadence Allegro/OrCAD. Ability to interpret schematics, component datasheets, and mechanical drawings. Working knowledge of PCB fabrication, assembly processes, and design for manufacturability. Familiarity with relevant IPC standards for PCB design and component land patterns. Strong attention to detail, documentation skills, and ability to manage competing priorities. Experience with multilayer, high-density, mixed-signal, and high-speed PCB designs. Familiarity w

Hyliion is committed to creating innovative solutions that enable clean, flexible and affordable electricity production. The Company’s primary focus is to develop distributed power generators that can operate on various fuel sources to future-proof against an ever-changing energy economy. Job Purpose The Mechanical Engineer is responsible for end-to-end hardware ownership of components and sub-systems for the KARNO generator, taking designs from CAD through prototype, test, and validation. Working across mechanical, electrical, software, and performance teams, this role designs and troubleshoots complex thermal and mechanical systems that must perform reliably across extreme operating environments and a wide range of fuels. The position exists to advance the development of Hyliion's fuel-agnostic power generation technology through hands-on, test-driven engineering and disciplined design execution. Duties and Responsibilities Own hardware components and sub-systems end-to-end—from concept through durability, manufacturability, serviceability, cost, weight, and validation—taking designs from CAD to hardware running on a test stand. Design components and sub-systems that must survive extreme thermal environments, perform across a wide range of fuels (20+), and push the boundaries of metal additive manufacturing. Create 3D models in NX and generate 2D prints with full GD&T per ASME Y14.5. Perform design checking and print review to ensure tolerances, processes, and material specifications align with Hyliion's GD&T standards (ASME Y14.5). Conduct fluid and thermal systems design and optimization. Perform structural and thermal FEA (ANSYS or equivalent). Install, calibrate, and read instrumentation for pressure, temperature, flow, strain, and acceleration in lab environments. Execute prototype build, test, and validation cycles early and often to identify and resolve issues in the lab rather than the field. Collaborate cross-functionally

1743 - This position is in Austin, Texas. Position Summary We are seeking an experienced Board-Level Hardware Validation Engineer to define and execute the validation and verification of complex electronic systems throughout the product lifecycle. This role is responsible for defining validation strategies, developing test plans, executing hands-on testing, analyzing failures, and working directly with ODM partners to ensure products meet performance, reliability, quality, and compliance requirements before mass production. The ideal candidate combines strong electrical engineering fundamentals with practical lab expertise and is comfortable personally performing validation activities while coordinating with cross-functional teams and manufacturing partners. Key Responsibilities Validation Strategy & Planning Define comprehensive board-level and inter-board validation plans based on product requirements, design specifications, and customer use cases. Develop validation methodologies covering functional, electrical, thermal, power, signal integrity, reliability, and stress testing. Establish test coverage, acceptance criteria, qualification requirements, and release gates. Review hardware architecture, schematics, component specifications, and interface topologies to identify validation risks early in the design cycle. Define incremental validation and regression coverage for component substitutions, design changes, and firmware updates. Hands-On Validation Execution Develop, automate, and execute validation tests on prototype and production-intent hardware. Perform board bring-up, functional verification, electrical characterization, and system-level integration testing. Validate communication interfaces, control signals, and timing requirements. Verify power sequencing, reset behavior, leakage current, and recovery across operating states. Execute temperature and voltage corner testing against approved operating limits. Use oscilloscopes, logic an

We're looking for a Senior Mechanical Engineer for Midjourney Medical — from precision electromechanical assemblies up to the large-scale structures and mechanisms that hold everything together and make it move. This role spans the full range of scale: one week you might be refining a compact transducer mount, the next you're architecting a structural frame or designing the motion system that positions hardware within it. This is a hands-on role on a small cross-functional team. You'll take problems from whiteboard sketch to working hardware yourself — designing in CAD, prototyping in the shop, testing, iterating, and integrating with research teams, electrical and software engineers along the way. We move fast and expect you to drive your own work: identifying what needs to happen next, making sound engineering calls without waiting for permission, and shipping hardware that works. What you'll do Own parts of the mechanical systems end to end — structures, mechanisms, and electromechanical integration Design large-scale structures: frames, weldments, enclosures, and support systems, with attention to stiffness, weight, manufacturability, and serviceability Design mechanisms: linkages, motion stages, actuation systems for precise, reliable positioning and articulation Integrate transducers, electronics, cabling, and thermal management into large physical systems Perform engineering analysis (tolerance stack-ups, structural/FEA, mechanism kinematics) to de-risk designs before committing to hardware Build and test relentlessly — 3D printing, rapid prototyping, and hands-on fabrication are core to how you'll validate designs Select parts and materials for system-level integration, balancing performance, cost, and lead time Drive projects independently from concept through validation, and collaborate closely with a small cross-disciplinary team to hit project goals What we're looking for Bachelor's degree in Mechanical Engineering or a related field 5+ years of experien

About the Team OpenAI is building the infrastructure foundation for the next generation of AI. The Data Center Engineering team defines the strategy, reference architectures, technical requirements, and delivery standards for the large-scale data centers that support OpenAI research, products, and infrastructure partners. As a Data Center Controls Network Engineer, you will design, validate, and scale the controls and OT network architectures that support high-density AI data centers. You will work across controls systems, OT infrastructure, telemetry, commissioning, deployment, and operations, partnering with mechanical, electrical, IT/networking, security, and external delivery teams. About the Role We are seeking a mid to senior OT Network Engineer with a strong controls systems background to lead the design and operation of resilient, secure, and scalable OT network architectures for high-density AI data centers. This role translates compute, power, cooling, and operational requirements into practical OT network designs, evaluates vendor solutions, and drives technical decisions across controls infrastructure, telemetry, commissioning, and operations. The ideal candidate has strong hands-on experience in mission-critical OT environments, including industrial networking, virtualized infrastructure, and OT network operations, with expertise in routing, switching, segmentation, firewall policy, time synchronization, monitoring, and network lifecycle support. Key Responsibilities Define controls, automation, and OT network requirements for AI data center campuses. Develop reference architectures, engineering standards, and reusable design templates. Review and develop basis-of-design and functional design documents, including OT network diagrams, IP/VLAN schemes, telemetry architectures, data flow diagrams, and commissioning requirements. Design OT and infrastructure network architectures, including physical topology, logical topology, IP addressing, subnetting, VLA

Vehicle Management System (VMS) Hardware Engineer (Experienced) Company: The Boeing Company Boeing Defense, Space & Security (BDS) Flight Systems Engineering Capability is currently seeking an Experienced Vehicle Management Systems Hardware Engineer to join the Air Dominance Vehicle Management System (VMS), Hardware team located in Berkeley, MO. You will work across engineering disciplines to help us design elements of the Vehicle Management Systems (VMS) hardware. You will collaborate with our requirements and labs teams to implement and test your designs. Mechanical, Electrical, Aerodynamics, and other engineers are all welcome – to succeed in this role, you will need to leverage your area of expertise and quickly learn on the job about other areas to develop capabilities for our Vehicle Management System Computer. You will get to see tangible results of your efforts as you contribute to exciting aircraft development programs in St. Louis. Develops and documents moderately complex electronic and electrical s system requirements. Design hardware, and interfaces specifications. Test and validates to ensure designs meet operational and functional requirements Assist in monitoring supplier performance to ensure integration and compliance with requirements Solves problems concerning fielded hardware over the entire product cycle Researches specific technology advances for potential application to company business Analyze solutions to ensure ongoing operation of products thru life cycle Position Responsibilities: Lead requirements decomposition and traceability from customer need to testable design Develop, document,

Radiation Environmental Test Engineer (Mid-Level or Senior) Company: The Boeing Company Boeing Missile & Weapons Systems is seeking a Radiation Environmental Test Engineer (Mid-Level or Senior) to lead radiation and environmental test efforts supporting ICBM modernization at the Little Mountain Test Facility in Hill Air Force Base, UT. This hands-on role combines test design, execution, data analysis, and facility/test-stand maintenance. The position supports ongoing modernization efforts to enhance current test capabilities and new developing capabilities—identifying, designing, managing, and integration of new test stands, diagnostics, and data systems to meet evolving mission requirements. Position Responsibilities: Lead and execute complex radiation and environmental test machine design and facility integration Identify interface requirements, CDRLs, configuration control documentation, and change orders Design, specify, and integrate test hardware, sub-assemblies, fixtures, and instrumentation Assist in configuring, validating, and operating data acquisition systems and custom software (LabVIEW) for diagnostics and event capture Support pulse power and flash X-ray systems: theory, operation, diagnostics, and data capture Perform technical evaluation of subcontractors Basic Qualifications (Required Skills and Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Science, Data Science, Mathematics, Physics, Chemistry or non-US equivalent qualifications directly related to the work statement Level 3: 5+ years of related work experience and a bachelor’s degree or an equivalent combination of related work

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

The DFP Engineer – Manufacturing role defines and implements the validation and screening of new silicon features within high‑volume manufacturing flows. You will translate product requirements into executable test methodologies, infrastructure, and detailed manufacturing test plans that ensure quality, yield, and efficiency at scale. This role sits at the intersection of multiple multi-functional teams to make manufacturing test an outstanding part of the overall codesign and DFP lifecycle. What you will be doing: Own end-to-end manufacturing test methodology across all test stages. Translate system specs and product POR into DFP requirements, test content, coverage, and flows. Define and maintain the DFP roadmap, including infrastructure and turning point planning. Partner multi-functionally to implement test content, debug hooks, and coverage improvements. Drive alignment on manufacturability, test time, binning strategies, and cost vs. coverage trade-offs. Embed testability requirements into design to enable robust screening and debug. Define data and analytics frameworks to support yield analysis and continuous improvement. Lead DFP documentation as the single source of truth and feed findings into future methodologies. What we need to see: MS in Electrical Engineering, Computer Engineering, or related field (or equivalent experience) 6&#43; years in silicon post‑silicon validation and/or high‑volume manufacturing test for complex SoCs, GPUs, CPUs, or similar. Hands‑on experience with test content bring‑up, limit setting, correlation to characterization, and yield/coverage optimization. Proficiency with scripting and data analysis (e.g., Python, MATLAB, R, SQL) for test data analytics, limit tuning, and yield/debug analysis. <