Engineer 3 in United States

Job Requisition ID # 26WD95847 Position Overview Autodesk is seeking a motivated, experienced, and skilled engineer to join our Connected Delivery platform team. This platform is responsible for enabling the discovery, download, and install of all the Autodesk products, services, and third-part apps. You'll be responsible for building a full-stack application that is resilient, scalable, and highly available. As an ideal candidate, you’ll have led teams developing modern web experiences with cloud services in a fast-paced, agile environment. Responsibilities Lead, design, and develop high-quality, secure, performant applications Provide project and team leadership to break down, estimate, and organize work Participate in agile ceremonies of the scrum team Work closely with the product manager and team to understand and elaborate on the requirements Provide guidance to own team and others on software development best practices Work with the team to troubleshoot code-level problems quickly and efficiently Identify risk and propose mitigation strategies associated with the design Participate in code reviews to ensure new code conforms to the highest standards Interact with internal and external customers to identify and resolve product defects Mentor and develop junior developers Respond on a rotation basis to escalated incidents after hours or on weekends to ensure 24/7 availability of our platform Minimum Qualification BS in computer scie

Job Title Remote Service Engineer Job Description Serve as the frontline remote technical expert, delivering rapid diagnostics and issue resolution for healthcare customers and field teams while minimizing onsite service through advanced troubleshooting and escalation management. Your role: Provide remote technical support and diagnostics to healthcare customers and field partners using advanced remote access technologies. Respond to customer inquiries as a Philips representative, delivering timely and accurate troubleshooting support. Resolve service issues by leveraging internal tools, systems, and knowledge resources. Escalate complex product issues to higher-level support for further evaluation and resolution. Utilize remote capabilities to efficiently resolve issues and reduce the need for onsite service dispatch. You're the right fit if: You’ve acquired 5+ years of remote software system experience along with a solid background in structured query language (SQL) and Windows server environments. Your skills include computer networking, technical solutions authoring, and the ability to solve mechanical and electrical issues. You have an associates degree or higher, technical discipline preferred. You must be able to successfully perform the following minimum Physical, Cognitive and Environmental job requirements with or without accommodation for this Field Service position. You’re a team player who is versatile and keen to work with a variety of Philips products. How we work together We believe that we are better together than apart. For

We are seeking a detail-oriented PCB Layout Engineer to maintain electronic component libraries and develop printed circuit board layouts. This role works closely with electrical engineering, mechanical engineering, procurement, and NPI to ensure component data and PCB designs are accurate, consistent, and ready for production. This position is in Austin, Texas. Key Responsibilities Create, verify, and maintain schematic symbols, PCB footprints, and associated 3D models. Validate component pin assignments, dimensions, land patterns, and library attributes against manufacturer documentation. Maintain library naming conventions, revision control, and component approval processes. Develop PCB layouts from approved schematics, including component placement, routing, stackup coordination, and design rule setup. Collaborate with engineers to address electrical, mechanical, thermal, and manufacturing requirements. Run design rule checks, resolve layout issues, and participate in design reviews. Prepare fabrication and assembly deliverables, including Gerber or ODB++ files, drill files, drawings, and pick-and-place data. Coordinate with PCB fabricators and assembly suppliers to resolve manufacturing questions. Support engineering changes and maintain accurate release documentation. Work with procurement and engineering to identify obsolete components and evaluate suitable alternatives. Required Qualifications Experience with setting up PCB design and electronic component library management. Proficiency in Cadence Allegro/OrCAD. Ability to interpret schematics, component datasheets, and mechanical drawings. Working knowledge of PCB fabrication, assembly processes, and design for manufacturability. Familiarity with relevant IPC standards for PCB design and component land patterns. Strong attention to detail, documentation skills, and ability to manage competing priorities. Experience with multilayer, high-density, mixed-signal, and high-speed PCB designs. Familiarity w

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Mech/Thermal Platform team as a Graduate Mechanical Engineer. You will contribute to the mechanical design, thermal validation, and verification of advanced AI hardware and data center systems. You will work with experienced mechanical, thermal, hardware, and systems engineers throughout the development lifecycle. The role combines 3D computer-aided design, prototype evaluation, lab testing, data analysis, troubleshooting, and clear engineering documentation. What You Will Do Create and update mechanical parts, assemblies, and drawings using Creo or comparable 3D CAD software. Take ownership of defined mechanical design tasks from requirements and concepts through detailed design, review, release, and verification. Apply mechanical design, materials, manufacturing, heat transfer, and thermodynamics principles to engineering decisions. Develop mechanical and thermal test plans and procedures for prototypes and development systems. Set up and operate laboratory equipment, collect accurate data, analyze results, and document conclusions. Evaluate prototypes and identify mechanical, thermal, assembly, or manufacturability issues. Support design verification, troubleshooting, root-cause analysis, and implementation of verified design improvements. Maintain accurate engineering documentation, including design notes, drawings, test procedures, results, and change r

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a SoC Power Thermal Performance Validation and Optimization Engineer, you will play an essential role in ensuring Intel's products achieve optimal power, thermal, and performance benchmarks at the system-on-chip (SoC) level. In this position, you will develop and execute validation methodologies, optimize hardware/software solutions, and perform SoC-level debugging to address power, thermal, and performance challenges. Your contribution will directly impact Intel's ability to deliver competitive, high-performing products to market. Business Group This role is part of Intel's Data Center Group (DCG), which focuses on designing innovative solutions to power the next generation of computing platforms for data centers. As a member of the PTP PreSi Correlation Solution team, you will contribute to shaping the development and validation processes for cutting-edge technologies, ensuring Intel meets and exceeds industry standards for performance and efficiency. Key Responsibilities: Develop and execute SoC-level power, thermal, and performance validation and

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. POSITION SUMMARY CVS Health is seeking a Senior Full Stack Engineer, Agentic AI Platform to join and lead engineering efforts for Lumina, CVS Health's enterprise knowledge and agentic AI platform. The Senior Full Stack Engineer, Agentic AI Platform will provide both technical and people leadership while driving the evolution of a platform that delivers trusted, secure, and governed AI experiences across the enterprise. As a Senior Full Stack Engineer, Agentic AI Platform, you will own the technical direction, architecture, scalability, and operational excellence of Lumina while leading a team of engineers and data scientists responsible for building and supporting the platform. This is a hands-on leadership role requiring active contribution to production code, architectural decision-making, code reviews, and engineering best practices, while simultaneously coaching and developing team members. The Senior Full Stack Engineer, Agentic AI Platform will play a critical role in advancing agentic AI capabilities, retrieval-augmented generation (RAG) systems, Model Context Protocol (MCP) integrations, enterprise search, knowledge ingestion, and AI governance. You will drive platform enhancements that improve retrieval quality, strengthen security and access controls, expand automation capabilities, and ensure the platform remains reliable, observable, and scalable as adoption accelerates across CVS

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Engineer is responsible for leveraging area knowledge to optimize area performance and reduce cycle time. A Manufacturing Engineer collaborates with PD, ATE, PEE, ME and IE teams to expedite product movement and reacts to process issues that could impact quality. Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Leidos is seeking a Test and Integration Engineer to lead cutting-edge testing and validation efforts within the Undersea Systems Division (USD) . This role is a unique opportunity to drive innovation in testing underwater vehicle systems, maritime sensors, subsea telemetry, and ISR solutions that support critical defense and national security missions. You'll contribute to a multidisciplinary team focused on testing, integrating, and validating advanced maritime technologies, ensuring system reliability and performance from prototype design to full-scale system deployment for ongoing Navy missions. Leidos’ Undersea Systems Division is a recognized leader in C4ISR technologies, delivering innovative, mission-critical solutions across sensor networks, unmanned systems, and tactical platforms . We’re known for achieving “industry firsts” in the most challenging maritime domains. Join us and be part of a world-class team delivering unmatched solutions for today's most pressing maritime missions. Why Join Us? Make an Impact : Your work will directly support U.S. maritime dominance and national security. Lead Innovation : Be at the forefront of applying innovative technology and autonomy to real-world maritime systems. Work with Experts : Collaborate with a top-tier team of engineers, scientists, and technicians located across the U.S. Shape the Future : Influence both the strategic and tactical direction of next-generation subsea technologies. What You’ll Do Test and Validate: Write, develop and execute comprehensive test plans, procedures, and protocols to ensure system functionality, reliability, and compliance with requirements. Integrate systems and conduct hands-on testing: Write, develop, and execute integration plans to bring complex systems together. Perform field</b

Experienced Electrical & Test Engineer Company: The Boeing Company Boeing Defense, Space & Security (BDS) seeks an Experienced Electrical and Test Engineer to serve as an Automated Test Equipment Engineer to join our Patriot Advanced Capability-3 (PAC-3) Electrical Engineering Capability Team in Huntsville, AL . We design, sustain, and upgrade next generation electronics concepts and support production and special test equipment design for increasing capacity requirements. Position Responsibilities: Support design of automated test equipment, development of engineering documentation, and hardware fabrication, integration, and validation testing Develop, document, and maintain electronic and electrical system requirements according to customer desires and contract requirements Create and implement overall Test Equipment Design strategies Review and apply real-time test anomaly troubleshooting and resolution of issues encountered during hardware validation and verification testing Support fielded test equipment hardware and software over the entire product lifecycle Research emerging technologies for potential applications to meet projected requirements Perform Root Cause Corrective Action (RCCA) investigations, troubleshooting, and resolutions This position requires the ability to get a U.S. Security Clearance for which the U.S. Government requires U.S. Citizenship. An interim U.S. secret clearance Pre Start and final U.S. secret clearance Post Start is required. Basic Qualifications (Required Skills/Experience): Bachelor of Science degree in Engineering (with a focus in Electrical, Mechanical or Aeronautical), Computer Sc

Satellite Systems Engineer (Associate) Company: The Boeing Company Boeing Defense, Space, and Security (BDS) seeks a seeks a Satellite Systems Engineer to serve as Global Positioning System (GPS) Satellite Bus Systems Engineer to serve on the Global Positioning System (GPS) IIF program, within our Space, Intelligence & Weapon Systems (SI&WS) division located at El Segundo, CA. GPS is a satellite-based radio-navigation system owned by the United States government and operated by the United States Space Force and is the world's first global utility. GPS provides position, navigation, and timing (PNT) data to military and civilian users globally with countless applications and an unlimited number of users. Boeing has over 45 years of history in GPS, including achieving full system capability in 1995. The current Boeing team supports the US Space Force by sustaining and monitoring the health and capabilities of the 12 GPS Block IIF satellites in the GPS constellation, launched from 2010 to 2016. The Boeing GPS sustainment team also provides support to our U.S. Space Force customer with reports and expertise on all aspects of the GPS system. Sustainment efforts will continue through the life of the Block IIF satellites, with a design life expectancy to 2031 and beyond. The program currently operates under a 10-year sustainment contract, from 2022 to 2031. As GPS Satellite Bus Systems Engineer , you will be a key member of a high-performing team engaged in critical projects related to the GPS IIF satellite constellation. You will train to become a subject matter expert for satellite Bus subsystems on the GPS Block IIF satellites and for GPS performance trending and analysis. You will also work closely with the spacecraft payl