Executive Transport in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Films, Metals, and Implant, you will play a critical role in supporting 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will serve as the primary off-hours technical resource for development activities, helping ensure uninterrupted execution of development experiments and rapid technology learning. This position operates in a dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. You will apply sound engineering judgment to disposition development wafers, respond to process and equipment challenges, support experimental execution, and balance development priorities with operational requirements. You will also apply advanced analytics, automation, and AI-enabled technologies to improve engineering decisions, increase learning velocity, and support Micron's digital manufacturing initiatives. Responsibilities Serve as the primary off-hours technical resource for development activities, making decisions on wafer disposition, tool release, process deviations, execution risks, and development priorities. Partner with Films, Metals, and Implant Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to resolve process and equipment issues, remove output constraints, and support experimental processing. Apply Statistical Process Control (SPC), E3, Fault Detection (FD)

About Hexnode Hexnode, the Enterprise software division of Mitsogo Inc., was founded with a mission to simplify the way people work. Operating in over 100 countries, Hexnode UEM empowers organizations in diverse sectors. Fueling the transformation to a seamless ecosystem of connected tools, Hexnode is revolutionizing the enterprise software and cybersecurity landscape. Role Overview We are seeking a AWS Operations Specialist to manage and maintain our cloud infrastructure and device ecosystems. This is a highly operational, execution-focused role—not an architecture position. The ideal candidate has 2 to 4 years of experience executing infrastructure as code, monitoring environments, and following documented playbooks to keep our systems secure and resilient. Because this role handles secure environments, candidates must be US Citizens and capable of passing a comprehensive federal background check. Key Responsibilities Infrastructure Execution: Run, maintain, and execute existing Terraform and Ansible scripts to deploy and update infrastructure. GovCloud Monitoring: Actively monitor our AWS GovCloud dashboards, keeping a close eye on system health, performance metrics, and security baselines. Mobile Device Management: Manage Android Enterprise kiosk configurations, ensuring secure deployments and smooth device operations. Incident Response & Triage: Respond swiftly to operational alerts by strictly following our documented team playbooks. Escalation: Identify anomalies or issues that fall outside established, documented procedures and escalate them accurately to the engineering team. Required Qualifications & Profile Citizenship: Must be a US Citizen (required for GovCloud infrastructure management). Background: Must be able to successfully clear a rigorous federal background investigation. Experience: 2 to 4 years of hands-on experience in a technical operations, DevOps, or SysAdmin role. Technical Familiarity: Comfort executing/running Terraform and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Principal Analog Design Engineer to lead the design, integration, and delivery of advanced analog and mixed-signal IPs for High Bandwidth Memory (HBM) products. This role is critical in developing and integrating high-performance analog subsystems within the HBM logic die, enabling industry-leading bandwidth, power efficiency, and reliability. As a principal engineer, you will provide deep technical leadership across analog design, IP integration, system alignment, and silicon execution, driving end-to-end success of HBM solutions. Responsibilities will include, but are not limited to: Lead the d esign and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Strategy & Innovation Define and execute the technical roadmap for Advanced DRAM Films development. Provide technical leadership across Epi, device films, hardmask technologies, HAR deposition, and diffusion processes. Drive innovative process solutions that enable future technology nodes while meeting manufacturability, yield, reliability, and cost objectives. Partner with Process Integration and cross-functional teams to resolve critical technology challenges. Leverage Artificial Intelligence to enhance problem solving across technical and logistical spaces. Organizational Leadership & Team Development Lead, coach, and develop a growing organization of engineers, technical leads, and future managers. Foster a culture of technical excellence, innovation, accountability, collaboration, and ownership. Develop talent through mentoring, succession planning, talent management, and strategic hiring. Create an environment that accelerates learning, encourages technical curiosity, and enables career growth for engineers at all levels. Drive high levels of team member engagement by cultivating an inclusive, supportive, and high-performing culture where employees feel valued, empowered, and connected to Micron's mission and business objectives. Champion employee development, recognition, feedback, and wellbeing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Wet Etch/CMP/Bond , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies within the Wet Etch/CMP/Bond Process Areas. This position operates on a 12-hour rotating shift schedule and serves as the primary engineering decision-maker for development activities occurring during off-hours for one of the three listed areas while also supporting the other two areas as needed. You will work closely with Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to ensure uninterrupted development execution, increase learning velocity, and support technology roadmap objectives. Unlike traditional manufacturing shift engineering roles, this MDE Shift Engineer operates in a highly dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. This role requires strong engineering judgment to disposition development wafers, make real-time process decisions, troubleshooting process and equipment issues, and appropriately balance execution needs with development objectives. Responsibilities Serve as the primary off-shift engineering decision-maker for development activities, using sound engineering judgment to disposition wafers, release or hold tools, define actions on development targets, respond to process deviations, handle execution risk

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about driving innovation for next-generation memory solutions powering AI/ML and high-performance computing systems. As a Director of HBM RTL Design and Integration, you will lead a team responsible for the design, integration, and delivery of next-generation HBM SoC logic die, with a strong focus on RTL development and IP integration. You will drive technical strategy and execution across multiple product generations, working closely with architecture, verification, physical design, firmware, and product engineering teams. Key Responsibilities Lead SoC RTL design and integration for HBM logic die, including subsystem partitioning, IP integration, and SoC-level design convergence. Drive translation of architectural and micro-architectural specifications into robust, high-quality RTL implementations across multiple teams. Oversee SoC integration aspects, including clocking, reset, power intent, configuration infrastructure, and system-level design correctness. Establish design methodologies and best practices to improve quality, reuse, and development efficiency across HBM programs. Partner with SoC Architecture, Verification, Physical Design, Firmware, and System teams to ensure successful end-to-end product execution. Work closely with Product Engineering, Test, Probe, Process Integration, Assembly, and Manufacturing to ensure robust, manufacturable HBM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron Technology’s Enterprise Infrastructure & Security (EIS) organization, where we build and run the platforms that power Micron’s global business. Within EIS, the PMO drives how complex technology initiatives come to life; raising delivery standards, strengthening execution, and enabling transformation at scale. We work across regions and subject areas, and we are deeply invested in modern delivery and AI-enabled ways of working. This IT Project Manager role is a critical addition to the EIS PMO. You will lead high-impact initiatives that support AI transformation, operational excellence, and a future ready workforce. This role brings experienced leadership, structure, and critical thinking to complex programs, while also uplifting delivery capability across the PMO through example and mentorship. Responsibilities: Lead complex Infrastructure and Security projects through initiation, planning, execution, and closeout, ensuring projects are delivered on time, within scope, and within budget, with measurable business impact Manage scope, schedule, budget, risks, dependencies, and change with transparency Convert strategic priorities, including AI enablement, into actionable delivery plans Establish governance, execution rigor, and delivery structure across projects Align project delivery with Micron’s strategic roadmap, including AI enablement and operational excellence priorities Mentor PMO team members and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Site Inventory Control (SIC) team is at the forefront of our ambitious expansion efforts. SIC plays a pivotal role in connecting wafer starts, inventory strategy, cycle time management, output delivery, and factory execution. As a Senior Engineer for Fab 4 HVM SIC, you will be the operational hub, driving alignment between Technology Development (TD), High Volume Manufacturing (HVM), Probe, Supply Chain, Planning, and Engineering organizations. This outstanding opportunity allows you to lead the charge in optimizing inventory and cycle time performance while ensuring flawless factory execution! We are looking for individuals who thrive on collaboration and tackling complex operational challenges. You'll have the chance to bring to bear data to drive decisions and implement AI-enabled solutions to improve speed, accuracy, and decision-making. Responsibilities: Lead multi-functional initiatives for wafer starts, inventory, cycle time, and output performance to support business commitments Develop and improve inventory control methodologies, business processes, and operational metrics and recommend corrective actions Develop and implement inventory, priority, and capacity strategies for New Product Introduction (NPI) programs Foster coordination between Technology Development, High Volume Manufacturing, Supply Chain, Planning, and Engineering teams to optimize inventory positions and factory flow Identify and mitigate constraints, risks, and op

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: The ID1 Facilities Electrical team supports the safe, reliable, and compliant operation of electrical systems critical to high-volume semiconductor manufacturing. The team coordinates maintenance, repairs, installations, documentation, and service-provider activities that support dependable site operations. The Facilities Electrical Coordinator plans, schedules, and tracks electrical maintenance and project activities across facilities operations. This role coordinates technicians, contractors, vendors, materials, documentation, and site partners to help ensure work is prepared, communicated, and completed safely with minimal impact to operations. Responsibilities Coordinate schedules, priorities, resources, and site access for electrical maintenance, repairs, installations, and minor system modifications. Serve as a primary coordination point for technicians, contractors, vendors, operations, engineering, and other business partners. Confirm work packages, permits, materials, documentation, and required support are ready before scheduled execution. Track work status, action items, service requests, documentation, and completion requirements. Coordinate outsourced electrical services and verify vendor activities align with safety, LOTO, quality, and operational requirements. Identify scheduling conflicts, coordination gaps, and execution risks; escalate issues and support timely resolution. Support asset information, maintenance records, reporting,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Expansion Construction team is driving some of the most significant semiconductor manufacturing projects in the United States, including two high-volume manufacturing facilities in Boise, Idaho (ID1 and ID2) and a greenfield manufacturing facility in Clay, New York. Our team partners across engineering, construction, commissioning, and operations to deliver world-class facilities that support the future of technology and innovation. As the ID Quality Assurance Lead, you will be a key member of the US Expansion Strategic Programs team, reporting to the ID Sr. Commissioning Manager. In this highly visible role, you will lead quality governance across major capital projects, ensuring compliance, commissioning readiness, documentation integrity, and operational turnover excellence. You will serve as the primary owner-side quality leader, collaborating with contractors, vendors, inspection agencies, operations teams, and regulatory stakeholders to deliver successful project outcomes. Responsibilities: Lead quality governance, performance metrics, audit programs, reporting, and continuous improvement initiatives across Idaho capital projects Oversee contractor and vendor quality execution, including quality plans, inspections, testing, material verification, hold points, and compliance with project requirements Manage special inspection programs, testing agency coordination, regulatory interfaces, and turnover-ready quality documentation Align construction quality activities with co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a Facilities Water Services UPW and Wastewater Coordinator to support wafer manufacturing by coordinating daily work, maintenance, vendors, contractors, and projects for ultrapure water, process water, reclaim, and wastewater systems. This role partners with Operations, Engineering, Maintenance, Construction, Procurement, EHS, vendors, and leadership to plan, implement, document, and align work with production needs. Success requires strong organization, technical understanding, communication, attention to detail, and the ability to lead priorities across operations, maintenance, projects, and production schedules. Ideal candidates are proficient with SAP or other CMMS tools, Microsoft Office, trackers, dashboards, drawings, and documentation systems. They coordinate schedules, track action items, communicate status, support scope development, identify gaps, and improve safety, reliability, documentation, cost control, and execution quality. This role helps maintain critical facility systems while demonstrating Micron’s core values of People, Innovation, Tenacity, Collaboration, and Customer Focus. Responsibilities: Coo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive