Fab Engineer in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Metrology Overlay Process Development Engineer you will be primarily responsible for starting up, developing, and optimizing the overlay metrology processes used for DRAM photolithography process flows. Overlay metrology is a critical need within the semiconductor industry, and in this position your responsibilities will include, but are not limited to: · Driving the understanding of new metrology technology and measurement techniques to ensure that our overlay measurement capabilities meet the precision, accuracy, and throughput required to meet our device overlay roadmaps · Partnering with metrology equipment vendors on continuous improvement of software/hardware and development of overlay techniques to support lithography process characterization, process optimization, and process control · Optimizing and maintaining the calibration of metrology systems that support our technology development · Working closely with process development and process integration engineers to optimize measurements for multiple device process flows and layer stacks · Developing applications on next generation processes and technologies within Fab 4 and qualification for tech

Experienced Low Observables Mission Systems Integration Engineer Company: The Boeing Company We are seeking a Low Observables (LO) Design & Integration Engineer to support design and analysis activities for stealth/low-signature systems. The engineer will perform LO material and structure design, electromagnetic analysis, integration and test support, data processing, and technical reporting. The role requires practical experience with LO materials and technologies, solid electromagnetics knowledge, and hands-on expertise with computational electromagnetic (CEM) solvers used to design and optimize LO solutions. Key Responsibilities Perform design and analysis tasks for LO materials, coatings, treatments, and structural treatments to minimize radar, infrared, and other signatures. Develop and validate LO integration concepts for aircraft/vehicle structures and subsystems, including manufacturability and testability considerations. Use CEM solvers to model, simulate, and optimize LO components and systems (e.g., surface treatments, RAM, apertures, seams, RAM-structure interactions). Perform sensitivity studies and trade-offs across materials, geometry, and integration approaches to meet system-level LO requirements. Process and analyze measured test data from laboratory and flight/field tests; compare test results to simulation and iterate designs. Produce technical documentation: detailed analysis reports, integration guidance, test plans, and summaries suitable for engineering and program management audiences. Communicate technical results and recommendations to multidisciplinary teams and support design reviews. Support manufacturing and test engineering to ensure LO design intent is preserved through fab

NVIDIA has transformed computer graphics, PC gaming, and accelerated computing for more than 25 years through exceptional technology and the people who build it. In semiconductor manufacturing, our role is to enable the ecosystem, not compete within it. We partner with fabs, equipment manufacturers, and software providers to make inspection, metrology, and manufacturing intelligence dramatically faster on the NVIDIA platform. Our team builds the software that makes this possible: models, adaptation and evaluation workflows, and deployable inference capabilities that partners integrate into their own tools. We work in environments where labeled data is limited and proprietary, distributions shift across tools and fabs, production budgets are tight, and software must operate inside air-gapped facilities. We’re seeking a Principal Systems Software Engineer for Semiconductor Inspection in Santa Clara. This is a hands-on architect role: you will define the approach, build it, evaluate it, and demonstrate the results. You will work across computer vision, time-series modeling, multimodal AI, anomaly detection, model adaptation, evaluation, and production inference. Success means technology that a fab or equipment vendor can integrate, operate, and trust—not only a successful internal demonstration. What you’ll be doing: Define and prototype AI system architectures spanning optical and e-beam inspection, wafer and mask inspection, metrology, defect review, equipment signals, and process data. Advance world foundation model capabilities for semiconductor manufacturing, including vision, time-series and multimodal representation learning, model adaptation, domain transfer, and data-scarce defect understanding. Develop workflows for defect detection, classification, localization, segmentation, nuisance filtering, ADC, AD

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,

Job Details: Job Description: As a Material Analysis (MA) Technician, you will be part of a Technology Development (TD) and High-Volume Manufacturing (HVM) lab responsible for performing material analysis and failure analysis in support of Intel's silicon process development and high-volume production. You will work on developing imaging, composition analysis and sample preparation techniques, and best-known methods (BKMs) to improve lab analysis quality, efficiency and output. You will directly interface with TD and HVM fab customers and quality/reliability engineers to develop solutions to problems by utilizing lab capabilities. The scope may include wafer and unit level, front-end modules and back-end/far back-end modules. Responsibilities may include but not be limited to: • Conducting hands-on analysis by effectively utilizing lab techniques, from sample prep micro-cleaver, ion mill etcher, mechanical polish to SEM/EDX, Dual beam FIB, TEM techniques to characterize Si fabricated structures at nanometer scales and integrated circuit device to improve process, performance and reliability; and to identify physical failure mode toward the root-cause identification. • Conducting hands-on data collection with various lab equipment’s, and assisting engineers to implement materials characterization techniques to determine fundamental thin film material structure/properties and to collaborate with process development engineers across functional areas and organizations to improve process performance and reliability. • Supporting and sustaining lab equipment. Ensuring that lab analytical capabilities needed to support advanced transistor and interconnect technology and/or product development are in place. Cooperating with other lab areas beyond local MA/FA (Failure Analysis) labs to achieve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron's Equipment Engineering organization is at the forefront of enabling advanced semiconductor manufacturing at scale within the newest U.S. memory fabrication facility. The CMP team collaborates closely with Manufacturing, Technology Development, Procurement, Facilities, and global engineering partners to drive equipment performance, innovation, and operational excellence. This team plays a meaningful role in delivering world-class yield, throughput, and cost performance. As the CMP Equipment Manager , you will lead and develop a high-performing team responsible for CMP equipment engineering . This role is accountable for setting the strategic vision, optimizing manufacturing performance, and aligning execution to Micron's global business objectives. You will partner internally and externally to enable best-in-class equipment capability while fostering a culture of collaboration, innovation, and continuous improvement. Responsibilities Lead and develop an elite CMP equipment engineering team, establishing clear performance targets aligned to fab output, yield, and cost objectives. Drive manufacturing optimization through equipment performance improvement, yield enhancement, throughput maximization, and cost reduction using data-driven methodologies. Partner cross-functionally (Manufacturing, TD, ATE, Procurement, Facilities) and globally to depl

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Advanced Facilities operations Maintenance and Repair Process Technician Description - At HP, we exist to amaze. Through the people we hire, the experiences we enable, the way we treat our customers and each other—and ultimately through the technology we create. HP’s Corvallis site is a hybrid development and manufacturing factory, supporting advanced R&D, prototype manufacturing, and low‑volume production in a semiconductor cleanroom environment. Our technicians work on cutting‑edge equipment and processes that directly enable next‑generation printing and manufacturing technologies. Responsibilities The primary function of this role is the day-to-day operations and maintenance of the facilities equipment that supports business needs. Knowledge of RODI/IWW systems, chemical handling and delivery systems, troubleshooting and repair and maintenance of systems. Knowledge of operations and repair for chemical dispense systems that support fab wafer manufacturing. Willingness to be on call and wear full face respirators while performing chemical duties. Streamlines activities under common initiatives, managing achievements and touchpoints to ensure alignment and unity. Executes design work that consistently meets defined quality standards within specified timelines. Identifies team needs regarding processes, tools, documentation, and asset management, and drives necessary changes to enhance efficiency. Conducts design reviews of blocks with peers and management to demonstrate that designs meet specification targets and requirements. Develops design systems and standards that can scale across organizations and can be deployed across various global businesses. Collaborates with platform architects and systems groups to define overall specifications based on system requirements. Acts as the

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Summary: Micron Yield Improvement Failure Analysis Shift Technician that performs Electrical and Physical Failure Analysis (EFA/PFA) investigative work for defect issues identified by YE and Fab customers. Monitors recently probed material and categorizes dead die into known defect issue categories and investigates new or unknown defect issues. This position requires a strong sense of responsibility and passion, reflecting Micron’s core values: People, Innovation, Tenacity, Teamwork, and Customer Focus. Responsibilities: Performs initial data analysis on new issues, conducts failure analysis, documents findings, and summarizes investigation results—including potential root cause—into a single report for stakeholders. Efficiently operates all lab equipment in compliance with safety guidelines, with a strong understanding of equipment functionality and ability to perform basic troubleshooting. Supports Company and Department Objectives Works to support company and department objectives and vision plans Open to suggesting new ideas and participates in projects and teams in support of department and company objectives Minimum Requirements: Associates degree in Electronics, AC/DC Electronics Technology or equivalent Flexibility to work 12-hour shifts (3 on/4 off and 4 on/3 off) and be willing to move to different shifts and work overtime to support business operations. The ability to always wear lab-specific clean room garme

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric