Integration Reliability Engineer Intern in Boise

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview The Probe Equipment Engineering team is responsible for ensuring the performance, reliability, and continuous improvement of probe manufacturing equipment within Micron's semiconductor operations. The team partners closely with Manufacturing, Process Integration, Facilities, Quality, and Supplier Engineering organizations to support world-class operational excellence, equipment availability, and product quality while enabling advanced technology node development. Position Overview As a Probe Equipment Engineer at Micron Technology in Boise, Idaho, you will coordinate the installation, modification, upgrade, qualification, and advanced maintenance of manufacturing equipment. You will collaborate with cross-functional teams to increase tool availability, optimize equipment performance, and ensure manufacturing outputs meet or exceed quality standards. In this role, you will leverage data analytics, automation, AI, and machine learning technologies to improve equipment reliability, accelerate problem-solving, and drive manufacturing efficiency. Your work will help enable smarter factory operations and support Micron's continued advancement of AI-driven semiconductor manufacturing capabilities. Responsibilities Drive improvements in equipment availability, relia

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible! We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the DRAM organization, you will be part of a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology which enables future memory scaling. You will focus on the performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to DRAM technology. In addition to a broad basis of process integration knowledge, this position will require a strong background in semiconductor device physics. Role interacts significantly with the process development, simulation, modeling, characterization, and reliability groups. Responsibilities include, but not limited to: Lead technology integration activities in enabling manufacturability of state-of-the-art DRAM technology Engage with numerous cross-functional teams including process development, product engineering, design, yield improvement, advanced mask and probe to arrive at solutions to

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. As part of Micron’s historic investment in Boise, Idaho, we are building the future of semiconductor manufacturing with a new leading-edge DRAM fab and expanded manufacturing capabilities. About the Role As a Process Quality Engineer, you will drive the strategic direction of front-end wafer quality across the local site and Micron's global organization. You will support the development and execution of strategies that enable future technology requirements while ensuring robust contamination control across the fab environment. You will actively monitor, assess, and reduce airborne and surface contamination risks to protect wafer quality, yield, and reliability. Working closely with process, facilities, equipment, and integration teams, you will investigate contamination-related issues, implement corrective actions, and prevent recurrence. You will also evaluate contamination risks associated with new materials, processes, and technologies, ensuring effective controls are in place to support successful technology development and manufacturing. Additional responsibilities include, but are not limited to: Responsibilities may include (but not limited to) Support the development and execution of contamination control progr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Introduction The Systems Integration Group (SIG) develops advanced test solutions that support semiconductor manufacturing and product quality. The team partners across engineering, operations, procurement, and external suppliers to design, build, and deploy innovative hardware platforms that enable reliable testing and validation of semiconductor devices. Join the team building semiconductor memory test platforms for tomorrow’s AI infrastructure. Position Overview As an Electrical Design Engineer, you will design and develop electronic hardware used in advanced semiconductor test systems. You will apply electrical engineering principles to create analog, digital, and mixed-signal solutions that support manufacturing and product development. This role spans the full hardware development lifecycle, from concept and design through validation, deployment, and sustaining support. You will collaborate with cross-functional teams around the world to deliver reliable, high-quality test solutions. Responsibilities Design analog, digital, and mixed-signal electronic circuits from concept through implementation and validation Evaluate and select electronic components to meet system performance, reliability, and cost objectives Develop schematics and collaborate with PCB designers to create optimized board layouts Perform circuit simulation, analysis, and design verification using industry-standard tools Debug, test, and val

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Position Overview: As a Staff/Principal Equipment Engineer within PROCT ADT, you will provide technical leadership to improve equipment performance, capability, and global manufacturing outcomes. You will lead complex, multi-site initiatives to resolve equipment challenges, enable technology node readiness, and drive yield and defectivity improvements. This role requires deep expertise, strong ownership, and the ability to influence across teams and suppliers to deliver measurable impact in cost, performance, and scalability. Responsibilities Lead global ownership of equipment performance across toolsets, driving improvements in stability, availability, matching, and efficiency. Direct complex, multi-fab root cause analysis for equipment-driven yield, defectivity, and reliability issues using data-driven and physics-based approaches. Provide technical leadership in tool hardware and chamber behavior to expand process capability and improve performance limits. Partner with Technology Development, integration, and process teams to enable node readiness, volume ramp, and disciplined change control. Influence equipment supplier strategy by leading technical engagements, driving design improvements, and aligning roadmaps to business needs. Drive global standardization through development, validation, and deployment of Best Known Methods (BKMs) across sites. Lead initiatives to improve cost of ownership, reduce variation,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Technical Strategy & Innovation Define and execute the technical roadmap for Advanced DRAM Films development. Provide technical leadership across Epi, device films, hardmask technologies, HAR deposition, and diffusion processes. Drive innovative process solutions that enable future technology nodes while meeting manufacturability, yield, reliability, and cost objectives. Partner with Process Integration and cross-functional teams to resolve critical technology challenges. Leverage Artificial Intelligence to enhance problem solving across technical and logistical spaces. Organizational Leadership & Team Development Lead, coach, and develop a growing organization of engineers, technical leads, and future managers. Foster a culture of technical excellence, innovation, accountability, collaboration, and ownership. Develop talent through mentoring, succession planning, talent management, and strategic hiring. Create an environment that accelerates learning, encourages technical curiosity, and enables career growth for engineers at all levels. Drive high levels of team member engagement by cultivating an inclusive, supportive, and high-performing culture where employees feel valued, empowered, and connected to Micron's mission and business objectives. Champion employee development, recognition, feedback, and wellbeing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Identify, diagnose and resolve DRAM (Dynamic Random Access Memory) process integration related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC. Employer will accept a Master’s degree in Mechanical Engineering, Electrical Science, Material Science, Physics, Chemical Engineering, or related field. Position requires: 1. Validate and qualify processes, tools, and materials for product introduction 2. Manage and audit material suppliers to meet quality, cost, and risk objectives 3. Support internal and external audits 4. Sustain fab healthiness with daily monitoring 5. Drive effective process technology improvement that enables best-in-class yield, quality and cost As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that b

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Wet Etch/CMP/Bond , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies within the Wet Etch/CMP/Bond Process Areas. This position operates on a 12-hour rotating shift schedule and serves as the primary engineering decision-maker for development activities occurring during off-hours for one of the three listed areas while also supporting the other two areas as needed. You will work closely with Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to ensure uninterrupted development execution, increase learning velocity, and support technology roadmap objectives. Unlike traditional manufacturing shift engineering roles, this MDE Shift Engineer operates in a highly dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. This role requires strong engineering judgment to disposition development wafers, make real-time process decisions, troubleshooting process and equipment issues, and appropriately balance execution needs with development objectives. Responsibilities Serve as the primary off-shift engineering decision-maker for development activities, using sound engineering judgment to disposition wafers, release or hold tools, define actions on development targets, respond to process deviations, handle execution risk