Manufacturing Tech in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a global leader in innovative memory and storage solutions that accelerate the transformation of information into intelligence. As part of Micron’s historic investment in Boise, Idaho, we are building the future of semiconductor manufacturing with a new leading-edge DRAM fab and expanded manufacturing capabilities. About the Role As a Process Quality Engineer, you will drive the strategic direction of front-end wafer quality across the local site and Micron's global organization. You will support the development and execution of strategies that enable future technology requirements while ensuring robust contamination control across the fab environment. You will actively monitor, assess, and reduce airborne and surface contamination risks to protect wafer quality, yield, and reliability. Working closely with process, facilities, equipment, and integration teams, you will investigate contamination-related issues, implement corrective actions, and prevent recurrence. You will also evaluate contamination risks associated with new materials, processes, and technologies, ensuring effective controls are in place to support successful technology development and manufacturing. Additional responsibilities include, but are not limited to: Responsibilities may include (but not limited to) Support the development and execution of contamination control progr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a US Expansion TIQ Program Manager , you will own key projects within the US Expansion Tool Install and Qual (TIQ) Program for our new US based High-Volume Manufacturing (HVM) sites. Your areas of ownership will include multiple of the following: Fab Support (FS) and Main Tool Auxiliary (MTA) enablement. Root Cause Analysis, Corrective and Preventative Actions, and Schedule execution; enable systems and processes to drive delays to zero (D2Z). Resource Leveling, Modeling, and Validation. Support TIQ Change Control Board (CCB): Management of a high-volume of change requests, mitigate cost and schedule impacts. Risk-Build and Disruptive change avoidance and management. Process Qualification for Tool Releases to enable capacity scale and speed. Construction, Facilities, and Layout engagement. Tool Install SPMO champion support for multiple Fab Process Areas. The ideal candidate must be willing to work as a TIQ Program Manager on site in Boise, Idaho to initially support the ID1/ID2 Fab Startup for approximately 18 months before permanently transitioning to the New York SPMO organization at the Clay, New York US Expansion HVM Site. Responsibilities: Own assigned projects and programs, drive execution to plan, and enable successful outcomes. TIQ business process execution, project tracking that includes driving Performance-to-Plan (P2P), and reporting Key Performance Indicator (KPI) metric

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Films, Metals, and Implant, you will play a critical role in supporting 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will serve as the primary off-hours technical resource for development activities, helping ensure uninterrupted execution of development experiments and rapid technology learning. This position operates in a dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. You will apply sound engineering judgment to disposition development wafers, respond to process and equipment challenges, support experimental execution, and balance development priorities with operational requirements. You will also apply advanced analytics, automation, and AI-enabled technologies to improve engineering decisions, increase learning velocity, and support Micron's digital manufacturing initiatives. Responsibilities Serve as the primary off-hours technical resource for development activities, making decisions on wafer disposition, tool release, process deviations, execution risks, and development priorities. Partner with Films, Metals, and Implant Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to resolve process and equipment issues, remove output constraints, and support experimental processing. Apply Statistical Process Control (SPC), E3, Fault Detection (FD)

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Fab Engineer in the RDA & Metrology Team , you will collaborate with other equipment engineers, technicians, and application owners. Your responsibilities include overseeing the installation, modification, upgrade, and maintenance of manufacturing equipment, providing technical support to manufacturing equipment repair and process engineering organizations. You will define and write preventative maintenance schedules, maintain records on technical notices, upgrades, and safety issues, and study equipment performance to establish solutions that improve tool uptime. Responsibilities: Drive performance standards, critical measures, and accountability for operational decisions and results. Lead equipment issue resolution, troubleshooting efforts, and root cause investigations. Manage project priorities and recommend changes, continuation, or cancellation to meet fab objectives. Collaborate daily with Equipment Leads to align priorities, resolve issues, and optimize resource utilization. Plan for capacity and product mix requirements while enhancing equipment flexibility and performance. Maintain and improve equipment reliability through maintenance procedures, best-known methods (BKMs), program monitoring, and documentation updates. Partner with vendors and multi-functional teams to implement continuous improvement initiatives that enhance throughput, productivity, and equipment health. Leverage AI, analytics, and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Government and Public Affairs Intern , you will be responsible for providing support to Micron’s U.S. based Government & Public Affairs team, working on initiatives important to advancing Micron’s position as a world technology leader. You will conduct daily monitoring of political and policy developments, intelligence gathering, and analysis as issues emerge and evolve. This analysis will contribute to how the company understands, navigates, and shapes the policy & legislative systems in the United States at the federal level. You will ideally have knowledge or an interest in the areas of politics, technology, industrial policy and manufacturing, trade, foreign relations, and issues facing global companies. We seek a proactive problem-solver who excels in a fast-paced environment and is ready to dive in. This position will be based in Washington, D.C. Responsibilities include, but not limited to: Work closely with the Global Policy & Business Partnership team, as well as across the broader Government & Public Affairs team, on projects, events, and research to advance the team’s strategic objectives. Develop an understanding of Micron’s current and future potential issues and assess key policy, regulatory risks and opportunities. Conduct

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for understanding the processes used to assess and mitigate risks related to the introduction of new package technologies so that you can improve efficiency and effectiveness by implementing automation, data analysis and machine learning/AI solutions. Set up data bases, develop data ingestion pipelines, and implement automated data analysis and reporting tools. Support problem solving and risk assessment for internal or customer quality issue by pulling and analyzing data. Contribute to the advancement of technology at Micron through mentoring, publishing technical papers (internal and external), and developing innovative solutions to challenging problems. Implement Automation, Data Analysis, and AI Solutions. Collaborate with Engineering teams to Map Package DDQA processes and data streams. Set up and optimize databases and develop solutions to improve efficiency and effectiveness. Understand the needs of internal customers and develop solutions. Support Problem Solving and Risk Assessment for Quality Issues. Pull relevant product information, manufacturing data, and reliability data based on given problem statements. Determine the appropriate dataset and treatment required to answer questions posed by problem solving teams. This could include producing data visualizations, machine learning models, statistical inferences, and web applications. Provide recommendations about root cause findings and product risk, based on data analysis. Collaboratively Communicate Findings and Best Practices. Share best practices with global teams to enable a cultur

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

About the Team OpenAI, in close collaboration with our capital partners, is building the world’s most advanced AI compute infrastructure ecosystem. The InfraDev team is central to this mission, setting the strategy and executing the roadmap to scale our supercomputing footprint globally. From site planning to system integration, this team operates at the intersection of commercial, technical, and operational excellence, partnering with leaders across OpenAI and the industry. About the Role We are seeking a Strategic Sourcing Manager who is ready to take on global-scale challenges in AI compute supply and manufacturing — an opportunity to shape the future of supercomputing. As part of the Infrastructure Strategy & Delivery organization supporting Industrial Compute, OpenAI’s next-generation supercomputing platform, you will lead sourcing and strategic supplier engagements for compute infrastructure at hyperscale. This role will drive commercial strategy and supplier accountability across server platforms, accelerators, rack systems, and associated thermal & power delivery components. This is not traditional procurement — it is foundational work enabling OpenAI to deploy compute faster and more efficiently than anyone in the world, while building deeply-integrated partnerships with the global compute supply chain. Key Responsibilities Develop and execute sourcing strategies for the next generation of AI compute infrastructure in partnership with engineering and program leadership. Stay at the leading edge of industry and supply-chain trends to inform category strategy and long-range planning. Initiate, negotiate, and manage commercial agreements across OEM/ODM/JDMs for accelerators, GPUs/CPUs, server platforms, rack systems, liquid-cooling components, PSUs, and supporting mechanical/electrical subsystems. Secure capacity and optionality across a rapidly scaling compute supply chain while mitigating risk and ensuring manufacturing readiness. Partner cross-funct

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron's Equipment Engineering organization is at the forefront of enabling advanced semiconductor manufacturing at scale within the newest U.S. memory fabrication facility. The CMP team collaborates closely with Manufacturing, Technology Development, Procurement, Facilities, and global engineering partners to drive equipment performance, innovation, and operational excellence. This team plays a meaningful role in delivering world-class yield, throughput, and cost performance. As the CMP Equipment Manager , you will lead and develop a high-performing team responsible for CMP equipment engineering . This role is accountable for setting the strategic vision, optimizing manufacturing performance, and aligning execution to Micron's global business objectives. You will partner internally and externally to enable best-in-class equipment capability while fostering a culture of collaboration, innovation, and continuous improvement. Responsibilities Lead and develop an elite CMP equipment engineering team, establishing clear performance targets aligned to fab output, yield, and cost objectives. Drive manufacturing optimization through equipment performance improvement, yield enhancement, throughput maximization, and cost reduction using data-driven methodologies. Partner cross-functionally (Manufacturing, TD, ATE, Procurement, Facilities) and globally to depl

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is building high-performance AI systems and the supply chain required to deliver them at scale. We are looking for a Global Supply Chain Manager to own OSAT partnerships, backend manufacturing execution, and supply continuity from wafer-out through final shipment. This role is based in Santa Clara, CA; Austin, TX, or Toronto, ON, with regular travel to Taiwan and other Asia-based partner sites, approximately 25-30%. Candidates should be located near one of these hubs and able to work effectively across North American and Asia-Pacific time zones. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Bring 7+ years of experience in semiconductor supply chain, manufacturing, or supplier management, along with a bachelor’s degree in Supply Chain, Engineering, or a related discipline. Have a strong understanding of OSAT workflows, including flip-chip, wire bond, and wafer-level packaging, with hands-on experience working with Taiwan-based OSAT partners. Are comfortable negotiating complex supplier agreements, pricing, tooling, or NRE costs and managing relationships across technical, commercial, and operational issues. Are a clear, direct, a