Modeling And Simulation Engineer in United States

Systems Engineer (Modeling & Simulation) (Associate or Mid-Level) Company: The Boeing Company Boeing Defense & Security (BDS) is looking for an Associate or Mid-Level Systems Engineer (Modeling & Simulation) (Level 2 or 3) to join our multi-disciplined engineering team in Albuquerque, New Mexico designing and developing advanced concepts on a DOD propriety program . This position will join a multi-disciplined team of engineers and scientists to develop and test advanced concepts for the Department of Defense. Work could include such things as image processing and analysis, radiometry, modeling and simulation, evaluation of field data to anchor models, and wherever the data may lead throughout the program. The ideal candidate will have strong MATLAB or Mathematic skills, an interest in data analysis; modeling and simulation; and some knowledge of optics and electro-optics. Position Responsibilities: Assists in developing and validating requirements for various electro-optical systems and components Uses data analysis results and output of mod/sim tools to assist in the development and validation of requirements for electro-optical systems, mechanical systems, interconnects and structures Works with engineering teams to collect and analyze data used to anchor models Performs complicated trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts critical analyses of various kinds to validate performance of designs to requirements Defines and conducts tests to validate performance of designs to requirements and anchor models to fi

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Signal/Power Integrity (SI/PI) Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Modeling and simulation of packaging hardware including redistribution layers (e.g., interposers, RDLs), IC substrates, and silicon testchip routing - Work closely with stakeholders to meet design requirements - requirements come from both theory and hardware teams. In some pathfinding projects, you will be asked to participate in creating requirements and novel packaging hardware. - System-level modelling and simulation; end-to-end simulations to ensure designs meet system-level requirements - Deliver and disseminate design milestones to stakeholders - Communicate designs in pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Design Engineering Group (DDEG) is where innovation meets excellence. We are advancing memory and storage technologies through collaborative engineering and creative problem-solving. Our team works at the forefront of semiconductor design, developing solutions that shape the future of memory products in a fast-paced, learning-focused environment. As a Design Verification Engineer, you will help develop next-generation memory technologies by verifying and optimizing digital and analog circuit designs. In this role, you will work closely with global multi-functional teams across the product lifecycle to deliver high-quality, manufacturable memory solutions that meet performance, reliability, cost, and customer requirements. Your work will directly contribute to bringing advanced memory products from concept to production. Responsibilities: Verify circuit functionality, reliability, power, and compliance with product specifications Drive verification planning, coverage closure, circuit debug, and design improvements Perform circuit modeling and simulation using industry-standard tools Support silicon validation, reticle experiments, and tape-out activities Partner with engineering, manufacturing, and product teams to deliver manufacturable designs Minimum Qualifications: Bachelor’s degree in Electrical Engineering or a related field 4+ years of semiconductor design, verifi

Systems Software Engineer, Missile Defense National Team (Associate, Experienced, Senior) Company: The Boeing Company The Boeing Company is looking for a Systems Software Engineer, Missile Defense National Team (Associate, Experienced or Senior level) to join our Missile Defense National Team in Colorado Springs, CO or Huntsville, AL. This position requires an active U.S. Secret Security Clearance for which the U.S. Government requires U.S. Citizenship. The Missile Defense National Team (MDNT) was established in 2004 to develop and deploy the Missile Defense Agency’s (MDA) Command, Control, Battle Management, and Communications (C2BMC) system. This system ingests data from sensors around the globe to create a single source of information for the warfighter to enable engagements. The C2BMC Program is a full lifecycle defense contract providing solutions across the engineering capability to include system architecture, development, deployment, operations and maintenance, and sustainment of the Missile Defense System (MDS). This work integrates efforts from multiple companies (teammates) with systems engineering experience in model-based systems engineering (MBSE), requirements development, modeling and simulation (M&S), network design, integration and test, and analysis. This position will focus on supporting the Ballistic Missile Defense System (BMDS). The Boeing Missile Defense Programs support the Missile Defense Agency's (MDA) mission to develop and deploy a layered Missile Defense System to defend the United States, its deployed forces, allies, and friends from missile attacks in all phases of flight. Be a part of our passionate and highly motivated team who are excited to be on the forefront of defense of

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Packaging Modeling Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for thermal modeling and simulation of various packaging solutions from silicon redistribution layers to IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Thermal modeling and simulation of packaging hardware to understand how heat flows from silicon test chips through various heat spreader hardware - Manage the overall integration of the packaging hardware and enable co-design between relevant stakeholders - Work closely with mechanical designers to define heat spreaders for optimal performance - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and rea

Job Overview : Seeking Technical Electronic Intelligence (TechELINT) Analyst. Become a member of a highly accomplished ELINT team providing direct support to geographically dispersed USAF Wing and Squadron-level organizations. Perform interpretive pulse-level and P-Cubed analysis of ELINT data, in-depth radar and weapons systems studies, and cutting-edge modeling and simulation efforts. The TechELINT analyst will leverage their aviation, Electronic Warfare experience, and critical-thinking prowess to develop tactics and techniques to counter emerging threats. The analyst will also work and coordinate with DoD entities and agencies to facilitate cutting-edge product development to ensure client capabilities meet current and future objectives. The analyst must possess an in-depth understanding of the key factors in aircraft survivability and combat mission planning to ensure client objectives are met. Primary Responsibilities : Support the collection, documentation, and post-test analysis of ELINT to evaluate programming effectiveness. Use specialized tools to ingest intel data and program ELINT, ensuring integration with EW systems. Work with a team of engineers to collaborate on ELINT products and ensure proper programming in alignment with mission objectives. Design procedures to analyze testing results, ensuring accurate validation and effectiveness of systems. Utilize the latest intel databases to perform detailed analysis and research, identifying potential threats and solutions. Basic Qualifications : Bachelor's degree (or 2-4 additional years of experience) in Intelligence or Information Operations and minimum of 8 years ofTechnical Signals Analysis experience. Experience with intel tools such as ASPEN, WILLOW, MARTES, THRESHER, and GALE. Former Military Experience in Technical Signals Analysis. Active TOP SECRET clearanc

About the Team Our Robotics team is focused on unlocking general-purpose robotics and pushing towards AGI-level intelligence in dynamic, real-world settings. Working across the entire model stack, we integrate cutting-edge hardware and software to explore a broad range of robotic form factors. We strive to seamlessly blend high-level AI capabilities with the constraints of physical systems to improve people's lives. About the Role We are seeking a lead thermal simulation engineer to help accelerate the design and development of next-generation robotic systems through modeling, simulation, and analysis. You will work closely with mechanical, electrical, controls, and robotics engineers to evaluate designs before hardware is built, identify risks early, and guide critical architecture decisions. This role spans structural and thermal analysis and design across robotic subsystems including actuators, mechanisms, structures, electronics, and integrated systems. You will develop simulation workflows that improve engineering velocity, increase confidence in design decisions, and help us build more capable, reliable, and manufacturable robotic platforms. This role is based in San Francisco, CA. This role will be expected to be in office 4 days per week and offer relocation assistance to new employees. In this role, you will: Perform thermal simulations to assess heat generation, cooling strategies, thermal interfaces, and system-level thermal performance Partner with mechanical, electrical, and controls engineers to influence design decisions early in development Build simulation models to evaluate robotic actuators, transmissions, mechanisms, structures, soft goods, and integrated assemblies Correlate simulation results with physical testing and develop methodologies to improve model accuracy Support architecture trade studies by evaluating design concepts before hardware is built Develop simulation workflows, standards, and best practices that scale across the robotics o

NVIDIA Architecture Modeling group is looking for Architects, Functional Modeling Engineers, and Simulation experts to join various architecture efforts across GPU/ SOC Architecture teams. A key part of NVIDIA's strength is to innovate in parallel computing fields, delivering the highest performance in the world for high-performance computing. We are constantly looking for ways to improve our SoC and Systems architecture and maintain our leadership. In this position, you will be working with other world-class architects on modeling, analysis and validation of chip & system architectures and features that advance the state of art in performance and efficiency. What you'll be doing: Modeling and analysis of SoC & Systems algorithms and features, across datacenter, automotive, and client products Build and deliver platforms for SOC's that enable left shift for the SW teams aligned with project milestones Work closely with the SOC architects and guide modeling teams to deliver high-quality functional models that involve SOC+GPU use cases Collaborate with our EDA partners to align on customer-facing technologies Develop tests, test plans, and testing infrastructure for new architectures/features and code coverage analysis and reporting Ensure alignment between the various modeling teams at NVIDIA, GPU modeling teams, and modeling teams overseas What we need to see: Master’s or PhD in Computer Science, Electrical Engineering, Computer Engineering, or a related relevant field (or equivalent experience) with 5+ years of relevant work experience. Strong programming ability: C++, C along with a good understanding of build systems (CMAKE, make) , toolchains (GCC, MSVC) and libraries (STL, BOOST) Computer Architecture background with experience in modelling wit

Job Details: Job Description: In this role, you will lead cross-functional collaboration to advance circuit simulation and modeling capabilities for advanced foundry technologies. Your responsibilities will include: Vendor collaboration: Partnering with EDA vendors to enhance and validate industry-standard simulation tools and design flows. Technology alignment: Working closely with technology leaders, VLSI physical design teams, and PDK teams to ensure simulation and modeling capabilities are aligned with roadmap needs. PDK readiness: Driving readiness of high quality simulation and modeling solutions so they are available in time for PDK delivery. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Minimum Qualifications: Bachelor’s degree in electrical engineering or computer engineering or related engineering discipline with 12&#43; years or master’s degree in electrical engineering or a related discipline and at least 10 years of industry experience in the semiconductor field; or Ph.D. in Electrical Engineering or a related discipline with a minimum of 8 years of industry experience in the semiconductor field. 5&#43; years supporting circuit simulation tools and working with circuit simulation vendors to develop solutions. 5&#43; years collaborating with EDA vendors on optimizing circuit simulation and modeling for advanced technology nodes. 3&#43; years of hands-on experience with BSIM or other compact models for transistor modeling at advanced nodes (e.g., FinFET, GAA).</

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for signal integrity (SI) system design engineers who have a deep expertise in the SI area, and hold strong system level design knowledge This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead system signal integrity (SI) design for AI supercomputer product in the data center application. Collaborate with chip, package, boards, rack and system engineers, design partners to drive system SI design and develop innovative interconnect and high-speed technologies Identify and evaluate new technologies and methodologies to improve signal and power integrity in product design, and contribute to the development of new products and technology by providing expertise in signal integrity Perform simulation and modeling to identify and troubleshoot signal integrity issues Lead system interconnect design, bring up and qualification As the scope of the role and team grows, understand and influence roadmaps for hardware partners for our datacenter networks, racks, and buildings. You might thrive in this role if you: Have at least 10 years of industry experience, including experience design hardware system and SerDes testing for data center applications Have a strong bias toward action, and won’t take no for an answer. Have experience and good knowledge of system design experience in the SI areas, from chip, SerDes, board, rack level Have ex

Propulsion Engineer (Experienced or Senior) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is seeking a Propulsion Engineer to contribute to the development and qualification of a new propulsion system for a cutting-edge fixed-wing program in the St. Louis, MO , area. In this role, you will be an integral part of a larger Flight Sciences team consisting of propulsion, aerodynamics, and guidance, navigation and controls. As part of the propulsion team you will contribute to inlet development, engine integration and controls, testing, and qualification efforts. Come join the Boeing team as we develop next generation airplanes that will make aviation history Our teams are currently hiring for a broad range of experience levels including; Experienced and Senior Level Propulsion Engineer. Position Responsibilities: Defines requirements for propulsion systems within a model-based engineering environment Defines, coordinates and controls the functional and physical interfaces between the propulsion system and the vehicle Configures or designs propulsion sub-systems and components to meet all vehicle design and performance specifications Contributes to or leads a range of testing, analysis, modeling, and simulation activities aimed at predicting and validating system performance Defines and performs verification tests for propulsion sub-systems and components Review, processing and approval of engine and component qualification documentation Assist with propulsion ground and flight test planning Propulsion vendor management and coordination This position is expected to be 100% onsite. The selected candidate will b

As a Research Scientist on our team, you will partner with Research Engineers, working on fundamental research problems and collaborating with Datadog's product and engineering teams to translate research advances into products. Building on our track record of AI-powered solutions (e.g., Bits AI , Bits Evolve , and our time series foundation model ), Datadog AI Research tackles high-risk, high-reward problems grounded in real-world challenges in cloud observability and security. We are focused on two research areas: World Models for Observability -- Training multimodal foundation models that learn the joint dynamics of distributed systems across metrics, traces, logs, topology, and events. These models power advanced forecasting, anomaly detection, root cause analysis, counterfactual simulation ("what if?"), and provide a learned planning backbone for our autonomous agents. Trained Agents for Observability -- Post-training models to operate autonomously across Datadog's domain. SRE incident response is our first target, with a clear path to code repair, security response, and infrastructure optimization. We build the simulation environments, RL training loops, and evaluation infrastructure needed to train agents that match or surpass frontier models at a fraction of the cost. What You'll Do: Conduct research in generative AI and machine learning, building specialized foundation models and trained agents for observability Train multimodal models on large-scale, diverse telemetry data (metrics, logs, traces, topology, events) using distributed training infrastructure Design and build simulated environments and RL training loops for on-policy agent training and evaluation Collaborate with cross-functional teams (Product, Engineering) to integrate capabilities like multimodal world modeling and autonomous agents into Datadog's products Stay at the forefront of foundation models, world models, and RL-based agent research Contribute to r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Overlay Strategy, Roadmap & Technical Leadership Own the overlay roadmap including bond overlay technologies. Serve as the technical authority for overlay, defining overlay specifications, error budgets, mark strategies, technical signoff criteria, and scaling requirements for future technology nodes. Develop innovative overlay solutions that enable advanced bonding while meeting performance, yield, manufacturability, and scaling objectives. Drive advancement of overlay metrology, automation, process control, modeling, and analytics capabilities in partnership with Process and Metrology teams. Apply advanced analytics, Artificial Intelligence, simulation, and experimental methodologies to accelerate learning, identify root causes, and improve overlay performance. Technology Development & Problem Solving Lead simulation and experimental process development activities, balancing modeling with hands-on characterization and technology development. Develop and maintain overlay error budgets, validation plans, experiments, and technical assessments that connect process behavior to device and integration requirements. Solve complex overlay challenges involving alignment, distortion, deformation, process interactions, and bonded wafers. Translate technical findings into actionable process improvements, technology decisions, and roadmap recommendations. <

About the Team OpenAI’s Industrial Compute team is building and productizing infrastructure capabilities that help organizations deploy and operate advanced AI systems at scale. The team works across AI hardware, systems engineering, physical infrastructure, and customer delivery to turn emerging technologies into reliable, repeatable infrastructure solutions. Our work sits at the intersection of technical strategy, product development, engineering, and deployment. We partner closely with customers and internal engineering teams to solve complex infrastructure challenges spanning compute, power, cooling, controls, and facility efficiency. About the Role We are seeking a senior, hands-on Data Center Infrastructure Architect to develop and optimize the physical infrastructure required for large-scale AI deployments. This is a broad technical role spanning data center architecture, electrical and mechanical systems, high-density compute, controls, telemetry, and digital modeling. You will use simulation, operational data, and digital-twin approaches to evaluate infrastructure designs, identify system-level constraints, and improve efficiency, reliability, cost, and speed of deployment. The ideal candidate can move fluidly between first-principles analysis, facility and equipment design, computational modeling, engineering review, and real-world implementation. You should be comfortable working across disciplines rather than operating solely within electrical, mechanical, or software boundaries. Key Responsibilities Define system-level architectures for high-density AI data centers across power, cooling, IT equipment, controls, and facility infrastructure. Develop digital twins and other computational models that represent the behavior of data center systems under changing workloads, environmental conditions, equipment configurations, and failure scenarios. Use design and operational data to identify constraints, improve PUE and related efficiency metrics, and optimize