Packaging Module Development Engineer in United States

Define the physical limits of what a chip can do, then break them! NVIDIA's Silicon Co-Design Group sits at the crossroads of architecture, silicon, systems, and manufacturing, where first principles thinking translates directly into product outcomes at scale. As GPU power density and thermal limits approach physical boundaries, the gap between system architecture needs and manufacturable, testable capabilities widens with every generation, and this role exists to close it. You wouldn't be maintaining existing solutions, you'd be identifying where physical constraints will erode NVIDIA's competitive edge before anyone else sees it coming, then building the cross-domain responses that ensure the next generation leapfrogs those limits entirely. The problems here don't have known answers yet: Every generation of NVIDIA silicon pushes closer to the limits of physics. The Co-Design Architect role isn't about optimizing within known bounds; it's about redrawing those bounds entirely. If you want your work to shape what's physically possible in the world's most demanding computing products, this is where that work happens. What you'll be doing: Power, Thermal & Packaging Limits Analysis: Gather and analyze the hard constraints of packaging, power delivery, and thermal dissipation against roadmap demands, predicting when those constraints will reduce competitiveness and acting before they do. Cross-Domain Solution Development: Develop solutions that span silicon features, packaging innovation, firmware and hardware co-design, and DFX updates, ensuring future products are not only performant but testable to the highest quality and reliability standards. Packaging Technology Evaluation: Assess emerging packaging technologies for their voltage/frequency, noise, reliability, and testability implications, determining which are worth adopting an

At Gilead, we’re creating a healthier world for all people. For more than 35 years, we’ve tackled diseases such as HIV, viral hepatitis, COVID-19 and cancer – working relentlessly to develop therapies that help improve lives and to ensure access to these therapies across the globe. We continue to fight against the world’s biggest health challenges, and our mission requires collaboration, determination and a relentless drive to make a difference. Every member of Gilead’s team plays a critical role in the discovery and development of life-changing scientific innovations. Our employees are our greatest asset as we work to achieve our bold ambitions, and we’re looking for the next wave of passionate and ambitious people ready to make a direct impact. We believe every employee deserves a great leader. People Leaders are the cornerstone to the employee experience at Gilead and Kite. As a people leader now or in the future, you are the key driver in evolving our culture and creating an environment where every employee feels included, developed and empowered to fulfil their aspirations. Join Gilead and help create possible, together. Job Description As a Senior Manager, Supplier Strategy and Management, Parenteral Packaging, at Gilead you will own business relationships with assigned suppliers of Parenteral Packaging components used with any Gilead branded product. This includes ownership of the strategy, selection, risk, and performance management of suppliers providing Parenteral Packaging components for development or commercial products. This role is responsible for both the strategic and tactical business management of these supplier relationships. You will have responsibility for indirectly leading and influencing others, bidding, selecting and managing multiple components. This position is based at the Gilead site in Foster City, C

TaylorMade Golf is seeking a highly creative Graphic Designer to visualize original graphic design work across golf accessories, packaging, and soft and hard goods products, then execute the technical files needed for vendor development. This role demands a high level of detail and technical precision, delivered in a fast-paced environment. Essential Functions and Key Responsibilities: Visualize and design original graphic concepts for golf accessories, packaging, and soft and hard goods products. Design and develop original logos, brand marks, and identity guidelines. Concept and create graphic designs for golf ball packaging. Execute detailed, production-ready technical files and tech packs for vendor development. Partner with hard goods, soft goods, and accessories teams to ensure design intent translates accurately to manufacturing. Research and ideate creative concepts for Ecommerce and accessories projects. Performs other related duties and assignments as required. Knowledge and Skills Requirements: Advanced skills in Adobe Illustrator, Photoshop, InDesign, and Acrobat, with the ability to learn new industry-standard software. Strong illustrative ability with a keen sense of color, visual layout, and typography. Ability to translate creative concepts into precise, production-ready technical files and tech packs. Understanding of materials, fabrics, and textures as they apply to soft goods execution. Clear communicator who collaborates effectively with peers and cross-functional teams, and is receptive to constructive feedback. Highly organized with strong attention to detail and a consistent ability to meet deadlines. Comfortable managing multiple projects at once in a fast-paced, global environment. Passion for and knowledge of golf pr

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by adjusting work hours and working overtime when necessary to support organizational priorities and ensure successful completion of business objectives. Preferred Qualifications & Experience: High school or GED Preferred 1 year manufacturing experience Preferred Physical & Mental Requirements: May involve prolonged periods of sitting or standing, as appropriate. May be required to reach, push, or pull to accomplish job accountabilities. Requires the use of safety glasses in designated areas.

Account Manager - FlexPack Description - This Account Manager role is responsible for understanding and promoting HP's FlexPack (Flexible Packaging) organization's products, using consultative selling techniques to engage with clients, and creating customized solutions. The role manages the sales pipeline, crafts competitive sales strategies, and handles challenging situations in collaboration with account managers. The role stays updated on industry trends and mentors junior team members to enhance their sales and consulting skills. Responsibilities • Demonstrates a deep understanding of the organization’s products and services while explaining product features and benefits to potential customers. • Offers technical expertise and support to the account managers in identifying potential clients, nurturing leads, and driving revenue growth. • Utilizes various sales and marketing techniques to identify and engage with potential clients and helps in tailoring sales pitches and solutions. • Creates and presents customized solutions or proposals that address the client's needs and demonstrate the alignment of the organization’s offerings with the client’s business objectives. • Maintains strong relationships with existing clients providing ongoing support, addressing client concerns, and actively seeking opportunities for upselling or cross-selling. • Develops pursuit plans and manages the sales pipeline to ensure alignment with account managers and overall sales objectives by setting clear goals and strategies for each opportunity. • Utilizes domain-specific knowledge to craft competitive sales strategies to better position the organization’s offerings in the market. • Handles challenging situations like negotiations, and client escalations to resolve issues in a professional and timely manner. • Attends industry events and

NVIDIA’s Executive Briefing Center (EBC) Solutions Architect (SA) team is looking for a highly hands-on Solutions Architect with exemplary communication skills. The role involves developing, demonstrating (in the NVIDIA EBC), and packaging agentic AI systems. Partnering with account SAs you will co-develop proof of concepts (POC) and "uplift" their presentation quality to match the NVIDIA branding and messaging used with Executive meetings. This is a builder’s and presenter's role! You will spend time architecting and writing code. You will develop multi-agent systems, retrieval pipelines, and optimized inference stacks on NVIDIA’s full-stack accelerated computing platform. We want a creative, diligent, and curious engineer energized by agentic AI and ready to make significant change. If that’s you, join us! What you’ll be doing: Architect, build, and ship end-to-end Agentic AI applications for a variety of use cases—spanning multi-agent coordination, long-horizon reasoning, planning, and tool use. Act as Technical Advisor alongside fellow Subject Matter Experts (SME) in Executive Briefings. Creating and presenting demos that are used at Trade Shows or Customer Meetings. Partner with NVIDIA engineering, product, and sales teams to secure build wins, translate customer feedback into actionable product and roadmap insights, and scale global expertise through technical collateral, workshops, and developer communities. What we need to see: BS/MS/PhD in Computer Science, Electrical/Computer Engineering, Physics, Mathematics, AI/ML, or a related field (or equivalent experience) 2+ years as an ML/Software Engineer or Solutions Architect writing production-level code in Python and/or C/C++ in Linux environments. Validated experience building sophisticated agentic and multi-agent AI sy

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

As a Product Marketing Manager for NVIDIA NIM, you will play a pivotal role in helping enterprises deploy AI. NVIDIA NIM is revolutionizing AI from experimentation to production, packaging optimized, production-ready models for rapid deployment. Our product marketing team operates at the intersection of developer tooling and enterprise go-to-market, ensuring that our narrative resonates with ML engineers and CTOs alike. If you relish diving into technical depth and translating it into compelling stories, this is the perfect opportunity! What you will be doing: Launching products: You'll build and manage launch plans for high-visibility NIM releases, coordinating assets, timelines, keynote slides, demos, and press materials while driving cross-functional execution with product management, engineering, technical marketing, and PR or equivalent experience. You'll align the team on messaging and positioning for NIM across developer and enterprise audiences. You will develop messaging docs, sales enablement materials, customer presentations, solution overviews, and web content. Driving awareness: You'll identify target audiences and content gaps, then build the assets that fill them — blogs, webinars, demos, solution briefs, and more. Crafting the ecosystem story: You'll drive co-marketing engagements with NVIDIA's model providers, cloud partners, and ISV ecosystem to showcase the full range of possibilities with NIM. Collaborating with PR: You'll work with PR on press launches to ensure the NIM story is accurate, compelling, and consistent across every channel. What we need to see: Excellent written and verbal communication skills, with a proven track record of articulating technical value to both developer and executive audiences. College degree or equivalent experience. More t

About the Team OpenAI’s Financial Engineering (FinEng) team powers how revenue flows through our products—pricing & packaging, checkout, payments, subscriptions, and the financial infrastructure behind them. We partner with Product, Engineering, Risk, Finance, and Go-to-Market to make paying for OpenAI products seamless, reliable, and efficient worldwide. About the Role As a Data Scientist on FinEng, you’ll own the analytics and experimentation that improve our checkout and payments , subscriptions , and pricing & monetization systems. You’ll define the metrics that matter, build the source-of-truth data assets, and design experiments that increase conversion, reduce churn and payment failures, and expand global payment method coverage. Your work will directly influence revenue, customer experience, and how we scale internationally. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will Own checkout & payments analytics and experimentation across methods and locales (e.g., bank transfers, emerging rails), improving conversion while monitoring risk and latency. Build and run the experimentation program for in-house checkout—define success metrics and guardrails, execute staged rollouts, and use offline incrementality when online tests aren’t feasible. Create operational visibility and source-of-truth data with FinEng Data Engineering—land team-level metrics, SLAs, and self-serve dashboards that drive proactive action. Lead subscription, retention, and monetization analytics—ship launch-readiness for new subscription features, reduce involuntary churn (e.g., targeted retrials/nudges), and develop elasticity/FX frameworks toward pricing optimality. You might thrive in this role if you have 5+ years in a quantitative role (data science, product analytics, or experimentation) in high-growth or fintech environments Fluency in SQL and Python ,

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing The Graphics Technician plays an important role in bringing custom golf ball and packaging designs to life while ensuring the highest standards of quality and accuracy. In this fast-paced position, you will create, maintain, and prepare production-ready graphic files for custom golf ball orders and packaging, supporting customers from proof creation through final production. Working closely with Customer Service, Quality, Production, and external packaging vendors, you will troubleshoot artwork issues, prepare logos and graphics for manufacturing, and help ensure flawless order execution. This role combines technical expertise, attention to detail, and collaboration to deliver exceptional custom products that enhance customer experience and uphold the brand's premium standards. This is a seasonal position with a flexible timeline based on business demands. There is no set start or end date, as employment duration and scheduling are determined by workload, production volumes, and overall business need s. What You Bring High school diploma or equivalent required 1-2 years of Graphic Arts education preferred Minimum of 2 years of graphic design experience Intermediate proficiency with Adobe Illustrator Basic experience with Adobe Photoshop and Adobe InDesign Experience with Adobe Dimension is a plus Strong attention to detail and ability to maintain accur

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive