Packaging Module Development Engineer Salary India in United States

NVIDIA’s Executive Briefing Center (EBC) Solutions Architect (SA) team is looking for a highly hands-on Solutions Architect with exemplary communication skills. The role involves developing, demonstrating (in the NVIDIA EBC), and packaging agentic AI systems. Partnering with account SAs you will co-develop proof of concepts (POC) and "uplift" their presentation quality to match the NVIDIA branding and messaging used with Executive meetings. This is a builder’s and presenter's role! You will spend time architecting and writing code. You will develop multi-agent systems, retrieval pipelines, and optimized inference stacks on NVIDIA’s full-stack accelerated computing platform. We want a creative, diligent, and curious engineer energized by agentic AI and ready to make significant change. If that’s you, join us! What you’ll be doing: Architect, build, and ship end-to-end Agentic AI applications for a variety of use cases—spanning multi-agent coordination, long-horizon reasoning, planning, and tool use. Act as Technical Advisor alongside fellow Subject Matter Experts (SME) in Executive Briefings. Creating and presenting demos that are used at Trade Shows or Customer Meetings. Partner with NVIDIA engineering, product, and sales teams to secure build wins, translate customer feedback into actionable product and roadmap insights, and scale global expertise through technical collateral, workshops, and developer communities. What we need to see: BS/MS/PhD in Computer Science, Electrical/Computer Engineering, Physics, Mathematics, AI/ML, or a related field (or equivalent experience) 2+ years as an ML/Software Engineer or Solutions Architect writing production-level code in Python and/or C/C++ in Linux environments. Validated experience building sophisticated agentic and multi-agent AI sy

Job Details: Job Description: Join Intel's Advanced Packaging Technology Development - Substrate and Wafer Assembly (ATPD: SWA) team and help us fulfill our mission to be the supplier of choice for leading-edge, cost-effective substrate packaging. As a Manufacturing Equipment Technician, you will support critical manufacturing equipment and drive continuous improvement in a highly technical, cleanroom production environment. Shift 5: Shift 5: (days frontend) AM-PM Sun-Tues and alternating Wednesday days / Hours: 6:00 a.m.-6:00 p.m. Manufacturing Equipment Technicians in Advanced Packaging Technology Development: Substrate and Wafer Assembly are responsible for: Performing electrical and/or mechanical troubleshooting to diagnose issues with non-functioning electromechanical equipment used in semiconductor manufacturing. Dismantling, adjusting, repairing, and assembling equipment according to layout plans, blueprints, operating or repair manuals, rough sketches, or engineering drawings. Performing setup, calibration, and preventive maintenance on production equipment, with a focus on wet chemistry, plating, and dry high-vacuum toolsets. Documenting maintenance activities, repairs, parts usage, and findings in accordance with established procedures and systems. Collaborating with engineering, process, and support teams to improve tool performance, reduce equipment downtime, and enhance process capability and reliability. Leading or contributing to continuous improvement projects, including root cause analysis, yield and uptime improvement initiatives, and optimization of maintenance practices. Assignments are semi-routine in nature and performed within generally defined parameters. Employees normally receive general instructions on most work and are expected to exer

As a Product Marketing Manager for NVIDIA NIM, you will play a pivotal role in helping enterprises deploy AI. NVIDIA NIM is revolutionizing AI from experimentation to production, packaging optimized, production-ready models for rapid deployment. Our product marketing team operates at the intersection of developer tooling and enterprise go-to-market, ensuring that our narrative resonates with ML engineers and CTOs alike. If you relish diving into technical depth and translating it into compelling stories, this is the perfect opportunity! What you will be doing: Launching products: You'll build and manage launch plans for high-visibility NIM releases, coordinating assets, timelines, keynote slides, demos, and press materials while driving cross-functional execution with product management, engineering, technical marketing, and PR or equivalent experience. You'll align the team on messaging and positioning for NIM across developer and enterprise audiences. You will develop messaging docs, sales enablement materials, customer presentations, solution overviews, and web content. Driving awareness: You'll identify target audiences and content gaps, then build the assets that fill them — blogs, webinars, demos, solution briefs, and more. Crafting the ecosystem story: You'll drive co-marketing engagements with NVIDIA's model providers, cloud partners, and ISV ecosystem to showcase the full range of possibilities with NIM. Collaborating with PR: You'll work with PR on press launches to ensure the NIM story is accurate, compelling, and consistent across every channel. What we need to see: Excellent written and verbal communication skills, with a proven track record of articulating technical value to both developer and executive audiences. College degree or equivalent experience. More t

About the Team OpenAI’s Financial Engineering (FinEng) team powers how revenue flows through our products—pricing & packaging, checkout, payments, subscriptions, and the financial infrastructure behind them. We partner with Product, Engineering, Risk, Finance, and Go-to-Market to make paying for OpenAI products seamless, reliable, and efficient worldwide. About the Role As a Data Scientist on FinEng, you’ll own the analytics and experimentation that improve our checkout and payments , subscriptions , and pricing & monetization systems. You’ll define the metrics that matter, build the source-of-truth data assets, and design experiments that increase conversion, reduce churn and payment failures, and expand global payment method coverage. Your work will directly influence revenue, customer experience, and how we scale internationally. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will Own checkout & payments analytics and experimentation across methods and locales (e.g., bank transfers, emerging rails), improving conversion while monitoring risk and latency. Build and run the experimentation program for in-house checkout—define success metrics and guardrails, execute staged rollouts, and use offline incrementality when online tests aren’t feasible. Create operational visibility and source-of-truth data with FinEng Data Engineering—land team-level metrics, SLAs, and self-serve dashboards that drive proactive action. Lead subscription, retention, and monetization analytics—ship launch-readiness for new subscription features, reduce involuntary churn (e.g., targeted retrials/nudges), and develop elasticity/FX frameworks toward pricing optimality. You might thrive in this role if you have 5+ years in a quantitative role (data science, product analytics, or experimentation) in high-growth or fintech environments Fluency in SQL and Python ,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) HBM Architecture team develops next-generation High-Bandwidth Memory (HBM) solutions that power AI, high-performance computing, cloud infrastructure, and advanced networking systems. The team works across architecture, design, verification, packaging, product engineering, and technology development to evaluate innovative memory architectures and deliver scalable, high-performance semiconductor solutions. As an HBM Design Architect, New College Graduate, you will contribute to the evaluation and development of future HBM and DRAM architectures. Working with experienced architects and engineering teams, you will analyze system and block-level design tradeoffs related to performance, power, area, thermal behavior, reliability, and manufacturability. This role provides an opportunity to leverage AI, Large Language Models (LLMs), and data-driven engineering methodologies to accelerate architecture exploration and improve decision-making. Responsibilities Analyze HBM and DRAM architectures using analytic

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as needed Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibil

Work Flexibility: Onsite Schedule: Monday - Friday 5:00am-1:30pm, OT as neede Position Summary: The Production Tech I position is responsible for issuing materials to manufacturing orders; packaging operations including blister packaging, pouch sealing, cartooning and shrink wrapping; and making and checking labels, as well as operating digital scales and cleaning various components/products. This position could either focus in SJO, Biologics, Augment, or Xerogel operations. Essential Duties & Responsibilities Issues materials to manufacturing orders. Performs packaging operations (blister, pouch, carton, shrink wrap). Makes labels. Fills out routers correctly in Device History Record Management. Performs all preventive maintenance on time. Operating miele washer and cleaning components. Operate digital scales. Data entry - correctly entering required production data into systems for business purposes. Perform daily, weekly, monthly, quarterly, and annual cleanings as required. Participate in daily management activities. Maintains a dependable work schedule through regular attendance and punctuality. Demonstrates flexibility by

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

JLL empowers you to shape a brighter way . Our people at JLL are shaping the future of real estate for a better world by combining world class services, advisory and technology for our clients. We are committed to hiring the best, most talented people and empowering them to thrive, grow meaningful careers and to find a place where they belong. Whether you’ve got deep experience in commercial real estate, skilled trades or technology, or you’re looking to apply your relevant experience to a new industry, join our team as we help shape a brighter way forward. Mechatronics & Robotics Technician - JLL What this job involves: As a Mechatronics & Robotics Technician, you will use your skills to support the Operations Maintenance team in repairing and maintaining material handling equipment and pneumatic systems throughout the building. You will have the opportunity to install, maintain and repair automated packaging and distribution equipment. In addition to developing your skills, you will have the opportunity to mentor junior technicians to grow in their roles. What your day-to-day will look like: Promote a safe working environment by following all safety procedures Complete preventative maintenance routines with proper documentation Troubleshoot electrical and mechanical problems related to all Material Handling Equipment (MHE) which includes belts, motors, photo-eyes, relays, and more

Product Manager Enterprise Integrations Description - Role Summary We are looking for a Principal Product Manager to lead the evolution of HP’s Enterprise Integration strategy—from fragmented, point-to-point integrations to a scalable, productized API ecosystem. This role will define and drive a shift toward API-as-a-product, enabling reusable business capabilities, accelerating developer productivity, and laying the foundation for an AI-first, composable enterprise. You will play a pivotal role in transforming our integration landscape into a unified Integration Fabric, and ultimately an Intelligence Fabric that powers next-generation digital and AI-driven experiences. What You’ll Own API Productization Strategy Transform APIs from point solutions into reusable, discoverable product offerings Define capability-based packaging aligned to business domains (B2C, B2B, Partner ecosystems) Drive standardization across design, classification, and maturity frameworks Enterprise Integration Fabric Define integration patterns that unify platform, SaaS, and custom-built APIs Establish a holistic, cross-application view of enterprise APIs Reduce point-to-point integrations through reusable architecture patterns and services Data + API Convergence Partner with Data teams to define and expose data products via APIs Enable consistent access to enterprise data through standardized interfaces Align API strategy with enterprise data governance and cataloging AI-First APIs & Developer Experience Define APIs optimized for AI agents, automation, and developer productivity Build APIs that are discoverable, composable, and machine-consumable Enable next-gen use cases including agent or