Production Associate in Boise

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. Responsibilities: Safely identify, handle, and work with chemicals and associated hazards in the work area. Recognize and respond appropriately to safety alarms and events, including EES, fire alarms, MDA, and ERT notifications. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Engineer in Node Development group, you will be part of a forward-thinking team of engineers that solves complex problems to develop industry leading DRAM! You will engage on new technology at design start and be part of a team responsible for delivering technology to enable the full product portfolio, initial device qualification and production ramp. This will be accomplished through innovation and by cross-functional engagement with partner groups; Design, Test, Technology Development, Marketing, Manufacturing and Quality Assurance departments to co-optimize product and process. While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a teammate who is motivated to grow in technical breadth and depth. Suppose you are open to learning while being a valued member of a team of world-class engineers. In that case, we are determined to help build upon your existing foundation, while focusing on your individual and collaborative skills in this exciting and outstanding opportunity. Responsibilities Include: Enable new process node startup, qualification, yield, and ramp Collaborate with internal engineering groups; Design, Technology Development, Design for Test, and Quality teams to understand yield issues and priorities. Provide direction to development teams using thorough knowledge for process integration Develop and key metrics for feedback on a new technology Support design verification and validation using CAD tools and simulation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Equipment Engineer is responsible for monitoring, sustaining, and improving the equipment while working in partnership with process team members and area engineers. In this position you will supervise tool performance, schedule and perform preventative maintenance on assigned tool sets, and use mechanical, electronic and PC/software skills to solve and repair equipment issues. They are also required to assist with equipment installations, engineering tests, build and modify equipment procedures, increase tool uptime through systematic problem solving and quality workmanship, and thoroughly document all maintenance. This is a hands-on equipment focused role with time spent in the fabrication facility. </sp

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hardworking people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. ID1 High Volume Manufacturing Engineer is responsible for leveraging area knowledge to optimize area performance and reduce cycle time. A Manufacturing Engineer collaborates with PD, ATE, PEE, ME and IE teams to expedite product movement and reacts to process issues that could impact quality. Responsibilities: Completes all required safety training and conducts all work in accordance with safety policies and regulations Ensures p

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About our Team: Micron’s Industrial and Physical AI team is driving the transformation of semiconductor manufacturing through Autonomous Operations, AI, robotics, and digital twin technologies! We develop and deploy innovative solutions across Micron’s global fabrication and assembly/test facilities, enabling smarter, safer, and more efficient operations at scale. Position Overview: We are seeking a hands-on Full-Stack AI Engineer to design, build, and deploy production-grade AI applications that support Micron's Autonomous Operations initiatives. This role owns the end-to-end development lifecycle, from data pipelines and AI models to APIs, web applications, digital twin integrations, and cloud/edge deployments, delivering impactful solutions for engineers, operators, and business leaders worldwide. Responsibilities: Design, architect, and deliver end-to-end AI products, including data ingestion pipelines, feature engineering, model training/inference, APIs, user interfaces, and application monitoring. Build and maintain modern front-end applications using React, Angular, or Streamlit, supported by backend services in Python and FastAPI. Develop scalable integrations between manufacturing systems, robotics platforms, AMRs, sensor networks, and enterprise applications to enable intelligent factory operations. Design and implement digital twin environments using platforms such as NVIDIA Omniverse, Gazebo, or Unity Robotics Hub to support simulation, validation, and o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that inspire and transform technology. With plans to invest more than $150 billion globally over the next decade in leading-edge manufacturing, we are looking for passionate people to join our Boise expansion team and contribute to the growth and innovation of the semiconductor industry. As a Senior CVD/PVD (Chemical Vapor Deposition/ Physical Vapor Deposition) Process Engineer you will be primarily responsible for starting up, developing, and optimizing processes to improve product quality, driving process yield improvements, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle process issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. Responsibilities Process area knowledge DRAM development and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Boise site is undergoing a historic $15 billion investment in semiconductor manufacturing, with DRAM production planned for the second half of the decade. As part of Micron’s global $150 billion expansion, our High Volume Manufacturing team drives innovation and operational excellence to deliver world-class memory solutions. As an ID1 High Volume Manufacturing Process Engineer Intern , you will work on process optimization, yield improvement, and cost reduction initiatives. This role involves collaborating with equipment teams, operations leaders, and multi-functional collaborators to ensure area critical metrics are met and wafer output is optimized. Responsibilities Finish the required safety training and adhere to safety policies and laws. Ensure proper tool documentation and update reaction mechanisms as needed. Supervise and resolve issues impacting yield, excursions, defects, or output loss. Apply SPC, FDC, and 8D methodologies to optimize processes and improve tool availability. Analyze data using engineering knowledge and visualization tools to make critical process decisions. Perform project work to optimize wafer processing and increase wafer outs. Update or create procedures to align with area and global practices. Minimum Qualifications Current student in an engineering or related degree program; graduation date not before September 2027. Understanding of SPC and Design of Experiments. Prof

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand groundbreaking manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. As a Dry Etch Process Engineer, you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a brand new fabrication environment, working with multi-functional teams to improve yield, quality, reliability, and productivity. This is an excellent opportunity to apply engineering fundamentals, develop technical expertise, and grow your career in semiconductor manufacturing. Responsibilities Support the development and optimization of dry etch processes to improve product performance, yield, and manufacturing efficiency. Analyze process and manufacturing data to identify trends, solve issues, and implement corrective actions. Partner with process integration, equipment,