Solution Architect Sbs in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Job Details: Job Description: Join Intel as a Module Development Engineer, where you will play a critical role in driving technology development and enabling advanced manufacturing solutions. In this position, you will lead the design and optimization of complex manufacturing processes, including material selection and equipment development, to enable innovative product designs and high-volume production. Your work will directly impact Intel's ability to maintain its leadership in cutting-edge semiconductor technologies. Business group As part of Intel Foundry, you will join a dynamic team focused on advancing semiconductor manufacturing technologies and capabilities. The group's mission includes enabling high-volume production through innovative process integration, equipment solutions, and technology advancements. Collaborating across Intel's global network, you will contribute to driving Intel's success in delivering transformative technologies to its customers. Key Responsibilities Lead the development of manufacturing processes that include MHS equipment development, parameter optimization, and equipment metrology. Perform pathfinding activities to enable emerging device architectures and support process and hardware development. Develop roadmaps for future technologies that align with Intel's leadership in semiconductor innovation. Collaborate with equipment and materials suppliers to implement solutions that meet manufacturing and technology needs. Recommend and execute modifications to equipment and processes to improve efficiency and optimize production output. Stay informed about industry trends in materials and manufacturing processes, identifying opportunities for innovation. Behavioral Traits Strong p

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Position Summary CVS Health is seeking a Senior Varicent Integration & Platform Engineer with expertise in technical architecture and integration to join the Human Resources Technology team. This experienced and motivated professional will support Compensation business operations by delivering optimal, scalable technology solutions. As an integral member of the team responsible for the Varicent Sales Performance Management (SPM) platform, its integrations, and its technical architecture, this role will address the needs of Total Rewards and Human Resources business partners and stakeholders. The ideal candidate will combine deep technical and platform expertise with a demonstrated ability to collaborate with technical and non-technical partners. The role will provide essential support to the Compensation organization for sales incentive technology needs and will collaborate with HR Technology, Centers of Excellence (COEs), and HR Shared Services across all business segments. This individual will establish cross-functional relationships throughout HR Technology and Human Resources to ensure that solutions and initiatives are effectively designed and implemented, with colleague satisfaction as a key goal. Primary Responsibilities: Collaborate with business and technical partners to support the Varicent technical architecture and integration roadmap, including the e

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The US Construction Engineering department is responsible for the design and construction efforts for high-tech, large-scale projects for Micron in the US. Current high-profile projects include the design and construction of two high-volume manufacturing fabs in Boise, ID1 and ID2, and a third fab in Clay, New York. We are seeking an experienced Chemical Systems Engineer to oversee the third-party design of chemical delivery and handling systems for high-tech large-scale construction projects. The Chemical Systems Engineer will manage external design firms, ensuring that chemical systems meet stringent project specifications, safety standards, and regulatory requirements. This role requires deep technical expertise in chemical systems, strong project management skills, and effective collaboration with multidisciplinary teams to deliver safe, efficient, and compliant systems for semiconductor manufacturing. Job Responsibilities: Manage third-party design firms in developing chemical delivery and handling systems, including storage, distribution, and hazardous waste management. Coordinate with external and internal stakeholders—including contractors, vendors, procurement, finance, construction and design teams—to ensure alignment with facility needs and project schedules. Ensure seamless integration of third-party designs with facility systems using Building Information Modeling (BIM) tools like Revit and Navisworks. Review capacity plan

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This Notice is provided as a result of the filing of applications for permanent alien labor certification for the positions noted below. Any person may provide documentary evidence bearing on an application to the Certifying Officer, U.S. Department of Labor, Employment and Training Administration, Office of Foreign Labor Certification, 200 Constitution Avenue NW, Room N–5311, Washington, DC 20210. Employer: Micron Technology, Inc. Job Title: Firmware Engineer Job Requisition: JR42883 Job Location: Longmont, Colorado Job Type: Full Time Rate of Pay: $100,000 to $254,000 Duties: Develop high-performance controller firmware for innovative volatile and non-volatile memory systems. Assist in evaluating, designing, building, bench testing, debugging, and failure analyzing firmware for new high-performance memory controllers and Solid State Drives that will increase performance, while reducing power, latency and SoC (System on Chip) complexity for the target markets. Work closely with system test engineers, system failure analysis engineers, firmware engineers, firmware test engineers, system hardware design engineers, product engineers, memory design engineers, firmware tools developers, and production engineers to solve cross-functional product development issues. Validate customer requirements and perform failure analysis on FW related issues. Develop structure

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. MTS, Interface Pathfinding Hardware Development Engineer About the Role At Micron, our vision is to transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next generation of high-speed interfaces. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. As the Interface Pathfinding Hardware Development Engineer , you will own characterization for a high-speed interface test-chip program: the characterization plan and its success criteria, development of the characterization bench hardware and its automation, the measurement-uncertainty budget, and the correlation report proving the silicon matches the models. You will join a small, senior team spanning analog design, layout, digital design, and verification, working closely with the Chip Lead and the Signal Integrity and Physical Design engineers — driving decisions independently while consulting heavily with other experts across Micron. This is a foundational hire for a growing program. Strong execution early is expected to lead to follow-on projects of increasing scope, team size, and characterization complexity — including an expanding mandate for AI-enabled engineering leadership across the organization. What You’ll Own Characterization Planning • Derive the electr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is seeking a Facilities Water Services UPW and Wastewater Coordinator to support wafer manufacturing by coordinating daily work, maintenance, vendors, contractors, and projects for ultrapure water, process water, reclaim, and wastewater systems. This role partners with Operations, Engineering, Maintenance, Construction, Procurement, EHS, vendors, and leadership to plan, implement, document, and align work with production needs. Success requires strong organization, technical understanding, communication, attention to detail, and the ability to lead priorities across operations, maintenance, projects, and production schedules. Ideal candidates are proficient with SAP or other CMMS tools, Microsoft Office, trackers, dashboards, drawings, and documentation systems. They coordinate schedules, track action items, communicate status, support scope development, identify gaps, and improve safety, reliability, documentation, cost control, and execution quality. This role helps maintain critical facility systems while demonstrating Micron’s core values of People, Innovation, Tenacity, Collaboration, and Customer Focus. Responsibilities: Coo

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Vision Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate, and advance faster than ever. Micron is advancing a historic $15 billion investment in semiconductor manufacturing in Boise, Idaho, with DRAM production planned for the second half of the decade. As a global leader in memory and storage solutions, Micron is investing more than $150 billion worldwide over the next decade to expand leading-edge manufacturing capabilities and drive innovation across the semiconductor industry. Join the Boise expansion team and help build the future of semiconductor manufacturing. You will work alongside experienced engineers to develop advanced processes, solve complex manufacturing challenges, and support the production of technologies that power everything from artificial intelligence to next-generation computing systems. Position Overview As a PCVD Process Engineer , you will contribute to the development, optimization, and sustainment of semiconductor manufacturing processes. You will gain hands-on experience in a state-of-the-art fabrication environment, partnering with teams to improve yield, quality, reliability, and productivity. This role offers an outstanding opportunity to apply engineering fundamentals, build technical expertise, and develop a career in advanced semi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Idaho Semiconductor Manufacturing (Triton) LLC Identify, diagnose and resolve DRAM (Dynamic Random Access Memory) process integration related problems; Coordinate and execute process, equipment and material evaluation / optimization initiatives and implement changes at process step; Lead / participate in continuous yield improvement and cost reduction activities; Validate and fan out new process baseline qualified, including new process, tools and/or materials for new product introduction; Support SPC/FDC/RMS/APC. Employer will accept a Master’s degree in Mechanical Engineering, Electrical Science, Material Science, Physics, Chemical Engineering, or related field. Position requires: 1. Validate and qualify processes, tools, and materials for product introduction 2. Manage and audit material suppliers to meet quality, cost, and risk objectives 3. Support internal and external audits 4. Sustain fab healthiness with daily monitoring 5. Drive effective process technology improvement that enables best-in-class yield, quality and cost As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that b

Leidos has an exciting opportunity for a Principal DevOps Engineer in our Intel Security Sector's Analysis Solutions Business Area . Our talented team is at the forefront in Security Engineering, Computer Network Operations (CNO), Mission Software, Analytical Methods and Modeling, Signals Intelligence (SIGINT), and Cryptographic Key Management. At Leidos , we offer competitive benefits , including Paid Time Off, 11 paid Holidays, 401K with a 6% company match and immediate vesting, Flexible Schedules, Discounted Stock Purchase Plans, Technical Upskilling, Education and Training Support, Parental Paid Leave, and much more. Join us and make a difference in National Security! Job Summary This Principal DevOps Engineer role provides mission critical system support to our customer. You will closely work with the Development team as well as other technology stakeholders to maintain, develop and support IC enterprise products – legacy and new products – in an Agile SAFe environment. The role will also work collaboratively with software engineering to deploy and operate systems. Additionally, this role will help automate and streamline operations and processes; as well as build and maintain tools for deployment, monitoring and operations, and troubleshoot and resolve issues in dev, test, and production environments. Primary Responsibilities: Supports software deployments, cloud infrastructure baselines, and operational availability of production systems. Managing, building, configuring, administering, operating and maintaining all components that comprise the DevOps environment. Defining enterprise Continuous Integration/Continuous Deployment processes and best practices Codifying DevOps best practices across the enterprise Developing and maintaining scripts to automate tool deployment to an AWS cloud environment and other tasks. <l

Leidos has an exciting opportunity for a Principal Software Engineer in our Intel Security Sector's Analysis Solutions Business Area . Our talented team is at the forefront in Security Engineering, Computer Network Operations (CNO), Mission Software, Analytical Methods and Modeling, Signals Intelligence (SIGINT), and Cryptographic Key Management. At Leidos , we offer competitive benefits , including Paid Time Off, 11 paid Holidays, 401K with a 6% company match and immediate vesting, Flexible Schedules, Discounted Stock Purchase Plans, Technical Upskilling, Education and Training Support, Parental Paid Leave, and much more. Join us and make a difference in National Security! Job Summary As a Software Engineer on this program, you will have the opportunity to build strong systems, software, and cloud environments while providing operations and maintenance for critical systems. This role will provide technical expertise in the design, development, implementation and testing of customer tools and applications. Based in a DevOps framework, this role participates in and/or directs major deliverables of projects through all aspects of the software development lifecycle including scope and work estimation, architecture and design, coding and unit testing. Primary Responsibilities: Participates in and/or directs software programming initiatives using Java, JavaScript, Python, SpringBoot, and Hibernate. Develops software system validation and testing methods using Junit and Katalon and uses integrated custom developed software solutions to leverage automated deployment technologies Develop, prototype and deploy solutions within Commercial Cloud Solutions leveraging infrastructure platform services Coordinate closely with team members, Product Owners and Scrum Masters to ensure User Story alignment and implementation to customer use cases Supp