Solutions Architecture Director in United States

Who we are At Twilio, we’re shaping the future of communications, all from the comfort of our homes. We deliver innovative solutions to hundreds of thousands of businesses and empower millions of developers worldwide to craft personalized customer experiences. Our dedication to remote-first work , and strong culture of connection and global inclusion means that no matter your location, you’re part of a vibrant team with diverse experiences making a global impact each day. As we continue to revolutionize how the world interacts, we’re acquiring new skills and experiences that make work feel truly rewarding. Your career at Twilio is in your hands. . Hiring and how we work We use Artificial Intelligence (AI) to help make our hiring process efficient. That said, every hiring decision is made by real Twilions! Also, while we are a remote-first company, you may be asked to report in person on an ad-hoc basis for team gatherings, functional off-sites or customer meetings. . See yourself at Twilio Join us as our next Principal Presales Engineer on Twilio’s ISV team! About the job This position is needed to enable our customers to build the future of communications. The Principal Presales Engineer is a critical part of the sales team focused on our ISV segment. Twilio’s Principal Presales Engineers are responsible for delivering the Technical Win and best Product Fit to our customers. They lead the technical pre-sales relationship, drive technical discovery, propose technical architectures, demonstrate the product, anticipate concerns and offer creative solutions. They build customer trust in Twilio’s solutions. Principal Presales Engineers should be comfortable engaging a CEO or sketching out an API flow on a whiteboard with customer software engineers. As a Principal Presales Engineer you will be fully autonomous. You will be capable of driving the technical side of all but the most complex opportunities independently. Furthermore, you will pr

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role On the Accelerators team, you will help OpenAI evaluate and bring up new compute platforms that can support large-scale AI training and inference. Your work will range from prototyping system software on new accelerators to enabling performance optimizations across our AI workloads. You’ll work across the stack, collaborating with both hardware and software aspects - working on kernels, sharding strategies, scaling across distributed systems, and performance modeling. You'll help adapt OpenAI's software stack to non-traditional hardware and drive efficiency improvements in core AI workloads. This is not a compiler-focused role, rather bridging ML algorithms with system performance - especially at scale. In this role, you will: Prototype and enable OpenAI's AI software stack on new, exploratory accelerator platforms. Optimize large-scale model performance (LLMs, recommender systems, distributed AI workloads) for diverse hardware environments. Develop kernels, sharding mechanisms, and system scaling strategies tailored to emerging accelerators. Collaborate on optimizations at the model code level (e.g. PyTorch) and below to enhance performance on non-traditional hardware. Perform system-level performance modeling, debug bottlenecks, and drive end-to-end optimization. Work with hardware teams and vendors to evaluate alternatives to existing platforms and adapt the software stack to their architectures. Contribute to runtime improvements, compute/communication over

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role As an Engineer on our hardware optimization and co-design team, you will co-design future hardware from different vendors for programmability and performance. You will work with our kernel, compiler and machine learning engineers to understand their unique needs related to ML techniques, algorithms, numerical approximations, programming expressivity, and compiler optimizations. You will evangelize these constraints with various vendors to develop and influence future hardware architectures towards efficient training and inference on our models. If you are excited about efficiently distributing a large language model across devices, dealing with and optimizing system-wide/rack-wide networking bottlenecks and eventually tailoring the compute pipe and memory hierarchy of the hardware platform, simulating workloads at different abstractions and working closely with our partners, this is the perfect opportunity! This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. Key Responsibilities Co-design future hardware for programmability and performance with our hardware vendors Assist hardware vendors in developing optimal kernels and add support for it in our compiler Develop performance estimates for critical kernels for different hardware configurations and drive decisions on compute core and memory h

1671 About the Role We are seeking a Senior Signal Integrity Engineer to develop, validate, and optimize high-speed signaling solutions across blade- and rack-level architectures for advanced compute platforms. This role sits at the intersection of silicon, package, interconnect, board, and system design , with a strong emphasis on hands-on measurement, simulation correlation, and cross-functional technical communication. Key Responsibilities End-to-end signal integrity analysis for blade- and rack-level system architectures. Analyze and optimize high-speed and low-speed I/O interfaces, including PCIe Gen4/5/6, Ethernet, DDR, SerDes, SPI , I2C, etc . and related interconnects. Perform time-domain and frequency-domain simulations using tools such as Ansys HFSS, Keysight ADS, Cadence Sigrity, CST, SPICE , or similar. Support hands-on lab validation using VNA, TDR, BERT, and high-speed oscilloscopes . Correlate simulation results with lab measurements to identify margin gaps, debug issues, and improve design methodology. Collaborate with silicon, package, board, connector, cable, and system design teams to optimize I/O channel performance. Work with interconnect vendors and ODMs to guide board layout, stack-ups, routing rules, and system design decisions. Review schematics, layouts, simulation results, and validation data for blade, backplane, and rack-level hardware. Prepare and communicate clear validation reports, measurement summaries, debug findings, and technical recommendations to internal teams, vendors, and senior technical stakeholders. Required Qualifications Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or a related field . Strong experience in signal integrity for high-speed digital systems. Hands-on measurement expertise using VNAs, TDRs, BERTs, and high-speed oscilloscopes . Experience measuring and analyzing S-parameters, impedance profiles, eye diagrams, jitter, timing margins, insertion loss, return loss, and cro

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

About the Team The Applied AI Engineering team is responsible for helping customers turn frontier AI capabilities into real products, workflows, and business impact. We act as trusted technical partners across solution design, architecture, implementation, evaluation, and adoption, working alongside customers to build and scale effective AI applications with OpenAI’s technologies. The Codex Applied AI Engineering team focuses on helping organizations transform how software is built with AI. We partner directly with engineering teams and technical leaders to integrate Codex into their software development lifecycle — from identifying high-impact use cases and designing AI-enabled workflows to implementation, evaluation, and scaled adoption. Our work helps ensure AI-powered software development is effective, reliable, secure, and deeply integrated into how engineering organizations operate. About the Role We are seeking an experienced technical leader to join as Manager, Applied AI Engineering (Codex) , leading a team of Applied AI Engineers responsible for driving successful Codex adoption across strategic customers. Your team will work hands-on with customer engineering organizations to design and build AI-enabled development workflows, solve complex implementation challenges, and establish scalable patterns for AI-powered software development. As a manager, you will shape how these technical engagements operate at scale — setting strategy, coaching engineers, determining where the team can have the greatest impact, and ensuring consistently strong execution across customers. You will serve as both a people leader and senior technical advisor, partnering closely with Sales, Product, Research, and Engineering to translate customer needs and real-world usage into better technical approaches, reusable patterns, and product insights. Success in this role will be measured by meaningful and sustained Codex adoption, successful customer outcomes, and the creation of repeat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Linux System Administrator Alexandria, VA Secret clearance or higher The Test and Training Enabling Architecture (TENA) program at Leidos is looking to add a Linux System Administrator . Our mission is to develop tools for the United States Department of Defense test and training communities, to increase the speed of the development cycle, to get capabilities to the warfighter more rapidly. The Linux System Administrator will work within a team engineers, developers and system administrators, adding new capabilities to our enclaves, as well as ensuring the existing systems are secure and performing as intended. This position is required to work on-site in our Alexandria, VA office. Primary Responsibilities: Provide support for installing and maintaining Linux servers. Provide technical leadership for migrating on premise infrastructure to hybrid cloud solution. Provide support for troubleshooting from OS to application-level issues. Manage networking equipment including switches, routers and firewalls. Manage configuration and maintenance of core enclave infrastructure services including DCHP, DNS, e-mail, Apache Web Servers, Tomcat application servers, Atlassian applications, MariaDB database servers. Configure and monitor security tools required for DoD networks. Participate and contribute to design discussions related to improving the capabilities, performance and security posture of new and existing services. Basic Qualifications: US Citizen with at least an active Secret clearance. Bachelor’s degree with 4+ years of experience or a Master’s degree with 2+ years of experience. Additional experience may be considered in lieu of a degree. 4+ years of experience providing System Administration to DoD IT systems. DoD 8570 IAT level I

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a mid- to senior-level Physical Design Engineer who will contribute to the physical design of high-performance chips for industry-leading AI/ML architectures, spanning implementation from synthesis through tapeout. You will partner with front-end and physical design engineers to optimize floorplanning, timing, power, performance, and area across multiple IPs. Along the way, you will build end-to-end ASIC expertise while learning from experienced engineers across the chip development process. This role is hybrid , based out of Austin, TX, Fort Collins, CO, or Santa Clara, CA . We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are An engineer excited to work on high-performance designs for industry-leading AI/ML architectures. A collaborative problem solver who enjoys working with experienced engineers across ASIC disciplines. Grounded in logic design fundamentals and gate- and transistor-level implementation. Curious about how early architectural and RTL decisions shape physical implementation and final chip quality. What We Need A BS, MS, or PhD in Electrical Engineering, Computer Engineering, Computer Science, or a relat

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we are transforming how the world uses information to enrich life. The High Bandwidth Memory (HBM) Design team develops industry-leading memory solutions that enable advances in Artificial Intelligence, high-performance computing, graphics, and data-center applications. Our engineers collaborate across global teams to deliver innovative memory architectures and semiconductor technologies that power next-generation computing systems. As an HBM Design Engineer Intern, you will work alongside experienced memory engineers and gain hands-on experience in semiconductor design, simulation, verification, and analysis. This internship provides exposure to industry-standard design methodologies, EDA tools, and cross-functional collaboration throughout the product development lifecycle. You will also have opportunities to apply AI-Assisted and AI-Enabled workflows to improve engineering productivity, debug efficiency, and design quality. Responsibilities Assist with the design, simulation, analysis, and verification of HBM memory and logic circuits using industry-standard semiconductor design tools. Support RTL development, circuit implementation, timing analysis, power analysis, and functional validation activities. Develop scripts, automation solutions, and AI-Assisted workflows to improve design productivity, debug efficiency, and design-flow quality. Collaborate with Design, Verification, Physical Design, CAD, and Product Engineering teams on technical reviews, debug activities, and project deliv

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking talented Physical Design Engineers to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid , based out of Austin, TX, Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Our Tensix team is building custom AI compute cores, RISC-V CPUs, and chiplet-based architectures for datacenter, edge, and automotive AI. Design Verification Engineers on this team validate compute IP and subsystems and build scalable DV infrastructure to keep verification fast, automated, and production-grade. This role is hybrid, based out of Toronto, ON, Austin, TX or Belgrade, Serbia. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced in modern verification methodologies with strong SystemVerilog skills and exposure to structured testbench development. Comfortable working from block-level to system-level verification and reasoning about microarchitecture behavior from specs and waveforms. Proficient in Linux environments with Python, or Bash scripting for automate builds, parse logs, manage CI pipelines. Skilled in coverage-driven verification and confident debugging across RTL, testbench, and workload scenarios. Motivated by AI hardware and eager to learn verification strategies for new architectures and domains. What We Need Contribute to verification of Tensix IP and subsystems from early planning through tape-out, owning cov

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. We are seeking a GCC Compiler Engineer to design, develop, and optimize compilers for next-generation RISC-V and AI compute architectures. You will work across hardware and software teams to improve performance, programmability, and integration of our custom toolchains into real applications. This role is fully hands-on and central to how developers interact with Tenstorrent hardware across both traditional compute and advanced machine learning workloads. This role is Hybrid, based out of Santa Clara, CA, Austin, TX, or Toronto, ON. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are Experienced compiler engineer with deep knowledge of GCC and LLVM internals, comfortable optimizing for custom hardware targets. Strong C/C++ developer with a solid grasp of algorithms, data structures, and performance analysis. Collaborative and analytical, able to work across hardware and software domains to deliver efficient, high-performance toolchains. Passionate about enabling breakthrough compute architectures through compiler innovation and software-hardware co-design. What We Need Design, develop, and optimize GCC and/or LLVM compilers for Tenstorrent’s cust

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking a talented Physical Design Engineer to implement high-performance blocks for our industry-leading CPU and AI/ML architectures. You'll own the complete implementation flow from synthesis to tapeout, working alongside world-class engineers to push the boundaries of performance, power, and area. If you're passionate about crafting silicon that powers the future of AI computing and thrive on solving complex design challenges, we want you on our team. This role is hybrid, based out of Austin, TX or Santa Clara, CA or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A hands-on engineer with deep expertise in SOC/ASIC physical design and a track record of successful tapeouts. Passionate about optimizing PPA through innovative implementation techniques and close RTL collaboration. Strong problem solver who excels at debugging complex issues across design hierarchies. Collaborative team player who thrives in fast-paced, technically challenging environments. What We Need BS/MS/PhD in EE/ECE/CE/CS with proven experience in synthesis, PnR, and timing closure on taped-out designs. Expertise with industry-stan