Solutions Architecture Manager in Boise

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Customer Engineering organization serves as the primary technical interface for our global customers and helps ensure that Micron solutions are seamlessly integrated into next-generation technology platforms. Our team coordinates deep engineering engagements, technical product qualifications, and architecture reviews to secure design wins and grow market share. We are dedicated to providing world-class technical support that accelerates revenue and builds long-term strategic partnerships with our customers. Role Description: The Field Applications Engineer - Associate plays a vital role in achieving the technical achievements needed to launch products. You will be an important member of our field engineering team. In this position, you will oversee many end-to-end technical tasks, including sophisticated product sample deployments, lifecycle management, addressing technical questions, and other customer interactions. You should adopt an "automation-first" approach to actively find ways to improve processes and apply AI-based workflows in daily operations when possible. This role can lead to a full-time FAE career for individuals who achieve the right results. It also requires demonstrating the right skills and behaviors. Example Responsibilities: Coordinate the entire process of tech

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s DRAM Product Architecture Group partners across fabs, test, module, and system teams worldwide to deliver high-performance memory products. We work across geographies and functions to solve complex technical challenges, drive product innovation, and enable industry-leading DRAM solutions. Our team values collaboration, continuous learning, and making a measurable impact through engineering excellence. As a New College Graduate DRAM Yield & Quality Engineer, you will play a key role in monitoring and improving the health of Micron’s server DRAM products. Working with experienced engineers and cross-functional teams around the globe, you will analyze product and manufacturing data, investigate technical issues, and contribute to strategies that improve yield, quality, and performance throughout the product lifecycle. This is a highly visible role with direct impact on customer success and product reliability. Responsibilities Analyze silicon parametric, test, and manufacturing data to identify trends, resolve product issues, and support root cause investigations. Contribute to yield and quality improvement initiatives across new product introduction (NPI), qualification, ramp, and high-volume manufacturing. Collaborate with fab, test, module, quality, and operations teams to drive execution of product health objectives. Develop and maintain automation solutions to improve engineering efficiency, data analysis, and reporting. Apply AI, Agentic AI, and Generative AI tools to en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our team is at the forefront of developing next-generation memory and AI computing platforms. We are core contributors to the design, validation, and mass production of advanced systems using emerging memory technologies, ASICs, FPGAs, high-speed digital interfaces, mixed-signal and analog circuitry, and complex power delivery architectures! We are seeking a highly experienced Mechanical & Thermal Engineer to provide technical leadership and drive the mechanical and thermal architecture of ground breaking hardware platforms. This role offers the opportunity to influence product strategy, lead critical engineering decisions, and collaborate across global multidisciplinary teams to enable world-class computing solutions. The ideal candidate brings deep expertise in thermal, mechanical, and heat mitigation solutions for memory product. They demonstrate strong analytical and problem-solving skills. They have a proven record of delivering products from concept through high-volume manufacturing! Performs design and development engineering assignments related to hardware products and systems including development of new products or updates to existing products. Work may encompass one or more areas of engineering including electronic design, mechanical design, or other related fields. Duties may include research, evaluation, development, and application of new processes and methods into products. May be responsible for establishing and conducting testing routines, developing or implementing project plans, budgets, and schedules, and documentation

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Our Team Our team builds and enables scalable, cloud-native software platforms that power critical manufacturing and business operations. We use modern full stack engineering practices and AI-driven technologies to create innovative solutions that improve automation, decision making, and operational efficiency. Position Overview We are seeking an AI-Centric Full Stack Software Engineer to design, build, and support modern software solutions with a strong focus on AI-enabled applications and intelligent automation. This role goes beyond simply using AI coding assistants. You will have strong understanding of Prompt Engineering, Vibe Coding, Rework Rate Reduction and leverage Custom Agents, and integrations built around the Model Context Protocol (MCP). You will apply strong software engineering fundamentals to assemble, integrate, and operationalize AI capabilities into real production systems being accountable for Full-Stack solutions. The goal of this role is to significantly shorten development and feedback cycles by automating routine engineering work, augmenting human decision-making, and embedding intelligence directly into our development workflows and the applications we deliver! Responsibilities Design, develop, test, deploy, and maintain scalable full stack applications and platform services. Own software solutions end-to-end, including system design, architecture, implementation, testing, observability, deployment, and lifecycle support. Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. About Our Team Our team builds and enables scalable, cloud-native software platforms that power critical manufacturing and business operations. We use modern full stack engineering practices and AI-driven technologies to create innovative solutions that improve automation, decision making, and operational efficiency. Position Overview We are seeking an AI-Centric Full Stack Software Engineer to design, build, and support modern software solutions with a strong focus on AI-enabled applications and intelligent automation. This role goes beyond simply using AI coding assistants. You will have strong understanding of Prompt Engineering, Vibe Coding, Rework Rate Reduction and leverage Custom Agents, and integrations built around the Model Context Protocol (MCP). You will apply strong software engineering fundamentals to assemble, integrate, and operationalize AI capabilities into real production systems being accountable for Full-Stack solutions. The goal of this role is to significantly shorten development and feedback cycles by automating routine engineering work, augmenting human decision-making, and embedding intelligence directly into our development workflows and the applications we deliver! Responsibilities Design, develop, test, deploy, and maintain scalable full stack applications and platform services. Own software solutions end-to-end, including system design, architecture, implementation, testing, observability, deployment, and lifecycle support. Deve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal ASIC Design Engineer About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team drives performance-scaling innovation across circuits, signaling, packaging, and interconnects with a 3–5 year technology horizon. A core part of that work is silicon-based validation of novel PHY solutions, and we are growing the team to execute. As the Principal ASIC Design Engineer , you will be the primary digital contributor on a deliberately small, senior team — united around the goal of carrying high-speed interface technologies from architecture to tape-out. The team’s analog and chip-level architecture is anchored by a deeply experienced analog custom design engineer; your role is to be the authoritative digital voice — owning RTL design and micro-architecture of the digital blocks, defining timing constraints, supporting verification, and serving as the key interface between the digital design and the analog and layout specialists who will carry the implementation through to silicon. On a test ASIC of this scope, the front-end digital work is the critical path, with contractor and layout support engaged as bandwidth demands warrant. What You’ll Own Digital Block Architecture & RTL Design Own the micro-architecture and RTL implement

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: We are advancing the future of semiconductor packaging through innovative 2.5D, 3D, and heterogeneous integration technologies. Our team develops the processes that enable next-generation AI and high-performance computing products, working across materials, device, design, manufacturing, and test engineering to solve complex technical challenges. If you're excited by emerging packaging architectures and breakthrough integration approaches, you'll find meaningful opportunities to make an impact here. Position Overview: As a Process Integration Lead for Advanced Packaging, you will lead a team focused on developing and integrating advanced packaging technologies from concept through full-scale manufacturing. This role plays a critical part in enabling high-performance multi-die solutions by driving technology development, process integration, technology transfer, and collaborative execution. You will help shape the roadmap for next-generation packaging platforms while mentoring a highly skilled technical team. Responsibilities: Manage and grow a team responsible for seamless process integration across 2.5D and 3D packaging platforms, including advanced interconnect architectures, die-stacking solutions, and HBM implementation. Spearhead the development, optimization, and qualification of emerging packaging technologies through experimental design (DOE), process analysis, performance validation, and establishment of design rules. Improve

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive