Strategic Solutions Engineer in United States

Become a part of our caring community The Automation Engineer identifies and implements solutions (hardware and software) for improvement of the high-quality automation infrastructure. The Automation Engineer work assignments are varied and frequently require interpretation and independent determination of the appropriate courses of action. The Automation Engineer designs, programs, simulates, and tests automated processes, and is responsible for detailed design specifications and other documents. Understands department, segment, and organizational strategy and operating objectives, including their linkages to related areas. Makes decisions regarding own work methods, occasionally in ambiguous situations, and requires minimal direction and receives guidance where needed. Follows established guidelines/procedures. Use your skills to make an impact Required Qualifications Bachelor's degree or relevant and equivalent years of experience in lieu of degree requirement. 4&#43; years of technical experience related to automation. Strong knowledge and understanding of Claude code Experience using AI coding assistants such as Claude code, Github, Copilot, or similar developer productivity tools. Hands-on experience leveraging Claude Code for test automation development, debugging, script generation, and software quality engineering. Experience developing automation using Java, Python, or JavaScript. Experience with Selenium, Playwright, Cypress, or equivalent frameworks. Experience testing REST APIs and backend services. Experience with CI/CD pipelines and automated deployments. 2&#43; years of experience in Software QA testing in a SAFe Agile environment. Strong experience with black box, web-service integration and server back-end testing.</

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Global Supplier Quality organization is seeking a Controller Quality Principal Engineer to lead the quality strategy, qualification, and continuous improvement of storage and memory controller (ASIC/SoC) manufacturers supporting Micron's SSD, embedded, and storage solutions portfolio. This is a senior technical leadership role responsible for driving controller supplier quality performance from design qualification through mass production and field support The successful candidate will collaborate across functions with ASIC Development Team, Compose Engineering, Product Engineering, Dependability, Manufacturing, and Commodity Management, as well as directly with controller IC vendors, foundries, third party reliability labs and OSAT (outsourced assembly and test) partners, to ensure controller quality, reliability, and supply continuity meet Micron's standards. This role can be based in Taiwan, Hyderabad, or San Jose and will work extensively across time zones with global partners and suppliers! Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when vital. Ensures that established manufacturing inspection, sampling and statisti

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team is responsible for building the next generation of AI-native silicon while working closely with software and research partners to co-design hardware tightly integrated with AI models. In addition to delivering production-grade silicon for OpenAI’s supercomputing infrastructure, the team also creates custom design tools and methodologies that accelerate innovation and enable hardware optimized specifically for AI. About the Role We are looking for an experienced Mechanical Engineer with 7+ years of experience in design of IT hardware from chip/package to system levels. You’ll work alongside experts in thermal, mechanical, electrical, software, and systems engineering to support the design, analysis, and validation of mechanical and thermal systems that ensure the reliability, efficiency, and longevity of mission-critical hardware. This position requires strong analytical skills, hands-on testing experience, and the ability to work in a fast-paced, cross-disciplinary environment. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Lead mechanical design for AI supercomputer product in the data center application Collaborate with the cross functional team to design and optimize thermal solutions for data center hardware, including chips, power modules, and system-level cooling architectures Collaborate with cross-functional teams to integrate thermal management strategies into hardware design, from concept to mass production Design and validate mechanical systems, including chassis, enclosures, cooling systems, and high-power connections, ensuring alignment with performance and reliability standards. Perform 3D modeling, FEA, tolerance analysis, and prototyping, ensuring manufacturability and a

Datadog's Technical Solutions (TS) organization is one of the largest organizations in the company — spanning Sales Engineers, Technical Account Managers, Enterprise Customer Success Managers, Technical Support Engineers, and Solutions Architects who work with prospects and customers across every stage of their journey with Datadog. Technical Solutions Operations (TSO) exists to make that organization faster, smarter, and more scalable. We build the systems, analytics & programs that give TS teams more leverage — and we measure our success by the business outcomes we drive, not the projects we complete. The programs this team runs touch every function in TS, and the operating model you build will define how that scales. We're looking for a Director of Technical Program Management to lead the TSO Program Management team. This role sits at the intersection of strategy and execution: you'll own the programs that shape how TS operates at scale, lead a team of technical program managers, and serve as a peer to the Directors and VPs who run the teams you support. Your counterparts are leaders overseeing hundreds of customer-facing technical professionals, and your role is to successfully interface with each organization with proactive solutions on how your team can help them be more effective. This is a rare opportunity to lead a function where the output isn't a deliverable, it's organizational capability. If you want to build something that compounds across an entire organization, this is the role. At Datadog, we place value in our office culture - the relationships and collaboration it builds and the creativity it brings to the table. We operate as a hybrid workplace to ensure our Datadogs can create a work-life harmony that best fits them. What You’ll Do Run the PMO as a business impact function. Own the PMO operating model end-to-end, including intake, prioritization, scoping, execution, and impact measurement — with every program directly linked to measurable bu

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a Security Engineer to join our First-Party Hardware team. In this role, you will own the end-to-end security foundation for OpenAI's first-party AI hardware systems, working across hardware security, embedded security, system security, and practical deployment at data center scale. You will partner with silicon, hardware, firmware, infrastructure, manufacturing, operations, and security teams to define and deliver system-level device trust. This includes boot integrity, device identity, provisioning, attestation, management-plane security, storage encryption, debug controls, firmware update and recovery, RMA, and decommissioning. You will be accountable for turning threat models into requirements, requirements into implementation, and implementation into validation evidence that can support launch decisions. Location: San Francisco, CA (Hybrid: 3 days/week onsite) Relocation assistance available. In this role, you will: Own security requirements, threat models, validation strategy, and launch-readiness evidence for first-party hardware platforms from early design through production deployment. Design and review secure boot, measured boot, roots of trust, platform firmware resilience, firmware signing, recovery, and anti-rollback strategies across heterogeneous devices. Own device identity, provisioning, enrollment, attestation, certificate lifecycle, and key-management requirements across manufacturing and data center bring-up. Harden management

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role On the Accelerators team, you will help OpenAI evaluate and bring up new compute platforms that can support large-scale AI training and inference. Your work will range from prototyping system software on new accelerators to enabling performance optimizations across our AI workloads. You’ll work across the stack, collaborating with both hardware and software aspects - working on kernels, sharding strategies, scaling across distributed systems, and performance modeling. You'll help adapt OpenAI's software stack to non-traditional hardware and drive efficiency improvements in core AI workloads. This is not a compiler-focused role, rather bridging ML algorithms with system performance - especially at scale. In this role, you will: Prototype and enable OpenAI's AI software stack on new, exploratory accelerator platforms. Optimize large-scale model performance (LLMs, recommender systems, distributed AI workloads) for diverse hardware environments. Develop kernels, sharding mechanisms, and system scaling strategies tailored to emerging accelerators. Collaborate on optimizations at the model code level (e.g. PyTorch) and below to enhance performance on non-traditional hardware. Perform system-level performance modeling, debug bottlenecks, and drive end-to-end optimization. Work with hardware teams and vendors to evaluate alternatives to existing platforms and adapt the software stack to their architectures. Contribute to runtime improvements, compute/communication over

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities include but are not limited to the following: Team oriented approach to create new strategies for DRAM DFT. New DRAM Test Flow Strategy. Fail Pattern Recognition. Improved methodology for test time reduction and improved quality. Assist in solutions to high visibility DRAM product issues. Create supporting software tools to assist in Engineering Analysis. Invent and Innovate anything and everything related to DFT. Employer will accept a Bachelor’s degree in Electrical Engineering, Computer Science, Electrical and Computer Engineering or related field. Position requires: 1) CMOS circuit knowledge 2) Basic programming skills in Python, Java, C or C&#43;&#43; 3) DRAM knowledge 4) Statistics 5) Basic lab experience or equivalent applied software profiling/analytics As a world leader in the semiconductor industry, Micron is dedicated to your personal wellbeing and professional growth. Micron benefits are designed to help you stay well, provide peace of mind and help you prepare for the future. We offer a choice of medical, dental and vision plans in all locations enabling team members to select the plans that best meet their family healthcare needs and budget. Micron also provides benefit programs that help protect your income if you are unable to work due to illness or injury, and paid family leave. Additionally, Micron benefits include a robust paid time-off program and paid holidays.<s

Become a part of our caring community Job Description Summary The Lead Solutions Architect provides architecture leadership for CenterWell Home Health programs and platforms, shaping conceptual and reference architectures, governing solution designs, and aligning delivery teams to cloud and data strategies. The scope includes high-priority initiatives as well as interoperability and provider-data integrations that span CenterWell and Humana Insurance. As Lead Solution Architect, you'll be the senior individual contributor on a team with broad accountability across CenterWell's dispensing pharmacy portfolio — mail order, specialty, retail, and associated platforms. You'll own the architectural vision for complex, multi-system initiatives, shape how technology decisions get made, and act as a connective force between business strategy, engineering execution, and enterprise standards. You will operate within CenterWell IT – Cross-CenterWell Architecture. You will collaborate with product, engineering, EA Activation, security, data, and operations. You will engage governance forums to enable Integrated Health across CenterWell and Humana Insurance. Key Activities Quickly conduct structured knowledge transfer with existing architects and relevant stakeholders to capture critical in-flight designs and decisions. Review current initiatives and establish an architectural roadmap aligned with organizational priorities. Develop or refine reference architectures and design patterns for core platforms and solutions. Collaborate with governance and compliance teams to validate designs against enterprise standards and regulatory requirements. Define integration strategies and solution blueprints for key systems and data flows. Establish architecture review processes and decision forums to support de

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role You will build the model runtime within the inference engine that executes complex, frontier models at scale on OpenAI’s custom silicon. The runtime will sit between models running on the hardware and the upper layers of the cluster serving software stack, translating demanding inference workloads into efficient execution while optimizing for throughput, latency, utilization, and reliability. You will work across model architecture, distributed systems, compilers, kernels, and silicon to design a production-grade runtime comparable in ambition to systems such as vLLM and SGLang, but customized and optimized for OpenAI’s AI accelerator. Your work will shape how new model capabilities map onto the platform and how quickly custom silicon can deliver meaningful performance in production. In this role, you will: Design and implement the LLM inference runtime for frontier models running on custom silicon. Build scheduling, continuous batching, memory management, KV-cache management, and execution orchestration for high-performance inference. Develop distributed execution strategies across chips, hosts, and racks, including model partitioning, communication, and synchronization. Optimize end-to-end latency, throughput, memory efficiency, and hardware utilization across diverse model architectures and serving workloads. Partner with kernel, compiler, architecture, and silicon teams to co-design interfaces and remove performance bottlenecks across the stack. Enable new

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role OpenAI's Hardware organization builds supercompute platforms from silicon and boards to full rack-scale systems to power advanced AI workloads. This role owns end-to-end quality for high-speed interconnect hardware across the product lifecycle: early design influence, supplier/contract manufacturer readiness, qualification, ramp, and fleet quality in lab and data center environments. You will be the quality lead for advanced interconnect components and assemblies, including high-speed copper cables, cable cartridges, patch panels, backplane/cable-backplane solutions, high-speed connectors, and related electro-mechanical interfaces. You will partner closely with electrical, mechanical, SI/PI, systems, reliability, operations, and external vendors to prevent escapes and drive rapid, data-driven containment and corrective action. In this role you will: Own quality for advanced interconnect components and assemblies: high-speed connectors, high-speed copper cables, cable cartridges (e.g., cable cassette style assemblies), patch panels & optics, and backplane/cable-backplane interconnect solutions. Drive quality-by-design: participate in design reviews, DFM/DFx, tolerance stacks, material and plating selections, connector mating strategy, strain relief, and assembly methods to reduce variation and field failures. Define and track quality and reliability metrics (DPPM, yield, escapes, RMA/FRACAS trends, Cpk/Ppk where applicable) for interconnects across NPI and m

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Engineer at Micron’s HBM New Product Validation team in Boise, ID you will be a senior technical guide responsible for validation strategy and readiness for future-generation High Bandwidth Memory (HBM) products. You will apply deep expertise in complex RAM and high-bandwidth memory architecture and building to establish architecture validation strategies. You will impact decisions that improve validation observability and debug efficiency . You will lead investigations of complex architecture, building , and silicon issues from pre-silicon simulation through post-silicon characterization. You will partner across Design Engineering, Design Validation, Product Engineering, Systems teams, and will develop and promote AI-enabled validation methodologies that improve efficiency, quality, and scalability. Responsibilities: Define architecture-aware validation strategies and coverage direction for future-generation HBM products. Drive validation readiness for next-generation products by preparing strategies, test environments, and execution plans before first silicon, reducing risk, accelerating issue resolution, and preventing late-stage surprises. Evaluate new DRAM/HBM architectural features and define validation requirements and testability needs before DBR. <span style="color:#

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron currently has an opening for a Staff or Principal level EUV Equipment Engineer for our Boise, Idaho location. Our Advanced Lithography and Equipment Engineering team enables the technologies that power the future of semiconductor innovation. We work at the leading edge of EUV and High-NA EUV development, partnering across process, manufacturing, facilities, and supplier organizations to deliver world-class equipment performance and support Micron’s technology roadmap. This EUV Equipment Engineer is a technical leadership role focused on maximizing the performance, reliability, and capability of EUV lithography systems. This position plays a critical role in advancing next-generation semiconductor technologies through equipment optimization, problem solving, supplier engagement, and collaboration across engineering disciplines. Responsibilities: Own the performance, reliability, availability, and productivity of assigned EUV lithography equipment Lead equipment installations, upgrades, qualifications, maintenance strategies, and continuous improvement initiatives Drive improvements in scanner performance, tool matching, imaging stability, defectivity reduction, contamination control, and recipe optimization Analyze equipment data and establish monitoring systems to improve overlay, focus, source performance, automation, and overall equipment health Provide technical leadership through supplier management, cross-functional collaboration, mentoring, a