Transformation Analyst in United States

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The TD Electrical Device Characterization team pushes the boundaries of Micron’s memory technology. We explore device behavior, uncover insights through data, and collaborate across engineering teams to enable next-generation products. We are a hands-on team that values curiosity, precision, technical rigor, and collaboration. In this role, you will drive electrical characterization for advanced memory technologies and partner with device, process, and product teams to turn measurements into actionable technical insights. Your work will help guide technology development and shape the performance and reliability of future NAND, DRAM, and emerging memory products. Responsibilities: Lead electrical characterization for advanced memory devices Develop measurement methods, algorithms, and scalable characterization standards Automate data pipelines and analysis using Python, JSL, C/C&#43;&#43;, and dashboard tools Architect test setups and manage wafer probe and ATE test flows Investigate device behavior, identify root causes, and communicate technical findings Minimum Qualifications: <span style="color:#6

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Principal Signal Integrity Engineer — Interface Pathfinding About the Role At Micron, we transform how the world uses information to enrich life for all. As a global leader in memory and storage innovation, we develop technologies that accelerate intelligence and enable the next era of AI, ML, and advanced computing. Micron’s Interface Pathfinding team operates at the leading edge of that mission — serving as a bridge between corporate strategy and engineering through forward-looking investigation and development of energy-efficient bandwidth solutions. Our work spans innovative circuit, signaling, packaging, and interconnect solutions with a 3–5 year technology horizon, grounded in rigorous analysis, hands-on measurement, and a commitment to building a robust intellectual property portfolio. As a Principal Signal Integrity Engineer , you will be a core technical contributor on a deliberately small, senior team united around the goal of preparing high-speed interface innovations for high-confidence product adoption. What You’ll Work On Micron’s Interface Pathfinding team investigates and validates novel interconnect and signaling solutions for high-speed memory and die-to-die interfaces. The signal integrity scope is broad and analytically deep — spanning electrical modeling, channel analysis, and substrate evaluation — with an emphasis on original analysis rather than execution of established playbooks. Key signal integrity domains include: Intercon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Design Technology Co-Optimization (DTCO) team works at the intersection of process technology, standard cell architecture, and design implementation to optimize power, performance, and area (PPA) for advanced memory products. The team collaborates closely with standard cell library, RTL, and physical design engineers to evaluate design tradeoffs and develop methodologies that improve silicon outcomes. As a DTCO Intern, you will gain hands-on experience assessing and optimizing PPA at the standard cell and logic block level. You will use industry-standard place-and-route tools and AI-enabled automation techniques to implement, benchmark, and optimize logic blocks while developing practical skills in physical design, timing closure, and design analysis. Responsibilities Implement standard cell logic blocks using industry-standard physical design tools, including floorplanning, placement, clock tree synthesis (CTS), routing, and optimization activities focused on PPA assessment. Analyze and benchmark power, performance, and area across standard cell libraries and logic block configurations, identifying opportunities for improvement. Perform static timing analysis (STA), investigate setup and hold timing violations, and support timing closure activities. Execute physical verification checks, including DRC, LVS, and IR-drop analysis, and assist with resolving design issues. Leverage Generative AI, AI Assistants, and Agentic AI solutions to automate data collection, reporting, comparison, and w

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology’s DRAM and Emerging Memory Group (DEG) is a distributed team of engineers and innovators focused on advancing next-generation memory technologies. For more than 43 years, Micron has been a leader in semiconductor innovation, delivering solutions that power applications ranging from artificial intelligence and high-performance computing to immersive digital experiences. The team is committed to innovation, integrity, sustainability, and meaningful community impact while driving the future of memory technology. As an HBM Memory Design Engineer, you will design, analyze, and optimize digital, analog, and memory circuits used in High Bandwidth Memory (HBM) products. You will collaborate with global design, verification, and product teams to develop high-performance DRAM solutions that meet manufacturability, reliability, and performance objectives. This role provides the opportunity to contribute to innovative memory technologies supporting AI, HPC, and data-centric applications. As part of Micron’s AI-Enabled workforce transformation, you will leverage AI-Assisted tools and data-driven methodologies to improve engineering productivity, accelerate design analysis, enhance decision-making, and drive innovation throughout the product development lifecycle. Responsibilities Design, analyze, and optimize memory, logic, and analog circuits for HBM products, including support for layout, validation, and tape-out activities. Perform circuit verification, parasitic modeling, and design simulations

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron's Global Supplier Quality organization is seeking a Controller Quality Principal Engineer to lead the quality strategy, qualification, and continuous improvement of storage and memory controller (ASIC/SoC) manufacturers supporting Micron's SSD, embedded, and storage solutions portfolio. This is a senior technical leadership role responsible for driving controller supplier quality performance from design qualification through mass production and field support The successful candidate will collaborate across functions with ASIC Development Team, Compose Engineering, Product Engineering, Dependability, Manufacturing, and Commodity Management, as well as directly with controller IC vendors, foundries, third party reliability labs and OSAT (outsourced assembly and test) partners, to ensure controller quality, reliability, and supply continuity meet Micron's standards. This role can be based in Taiwan, Hyderabad, or San Jose and will work extensively across time zones with global partners and suppliers! Develops, evaluates, revises, and applies technical quality assurance protocols/methods to inspect and test in-process raw materials, production equipment, and finished products. Ensures activities and items are in compliance with both company quality assurance standards and applicable government regulations. Performs analysis and identifies trends in the inspection of finished products, in-process materials and bulk raw materials, and recommends corrective actions when vital. Ensures that established manufacturing inspection, sampling and statisti

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Overview The Probe Equipment Engineering team is responsible for ensuring the performance, reliability, and continuous improvement of probe manufacturing equipment within Micron's semiconductor operations. The team partners closely with Manufacturing, Process Integration, Facilities, Quality, and Supplier Engineering organizations to support world-class operational excellence, equipment availability, and product quality while enabling advanced technology node development. Position Overview As a Probe Equipment Engineer at Micron Technology in Boise, Idaho, you will coordinate the installation, modification, upgrade, qualification, and advanced maintenance of manufacturing equipment. You will collaborate with cross-functional teams to increase tool availability, optimize equipment performance, and ensure manufacturing outputs meet or exceed quality standards. In this role, you will leverage data analytics, automation, AI, and machine learning technologies to improve equipment reliability, accelerate problem-solving, and drive manufacturing efficiency. Your work will help enable smarter factory operations and support Micron's continued advancement of AI-driven semiconductor manufacturing capabilities. Responsibilities Drive improvements in equipment availability, relia

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with &#43; 2 years of experience M.S.EE degree with 1&#43; years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Photolithography , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies. Operating on a 12-hour rotating shift schedule , you will be the primary engineering decision-maker for off-hours development activities, ensuring uninterrupted execution of process development experiments and technology learning. Unlike traditional manufacturing shift engineering roles, this position operates in a highly dynamic development environment where process conditions, specifications, and experimental flows regularly evolve. You will apply sound engineering judgment to disposition development wafers, address process and equipment challenges, and balance development objectives with execution needs. In addition, you will use advanced analytics, automation, and AI-enabled solutions to accelerate learning cycles, improve decision quality, and support Micron's AI-driven digital manufacturing strategy. Responsibilities Serve as the primary off-hours technical authority for development activities by dispositioning wafers, releasing or holding tools, responding to process deviations, addressing execution risks, and maintaining development momentum. Partner with Photolithography Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to resolve process and equipment issues, remove output constraints, and support experimental processing. Apply Statistical Process Co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Advanced Packaging Technology Development (APTD) organization, where new AI assisted packaging technologies are developed to enable future generations of memory and storage solutions. Our team works closely across engineering disciplines to improve manufacturing performance, solve complex technical challenges, and support the technologies driving advances in AI and high-performance computing. As a Shift Process Engineer, you will play a key role in supporting and improving assembly processes within a fast-paced development environment. You will investigate process issues, use data to drive decisions, and work with cross-functional teams to improve yield, quality, and operational performance. This role offers the opportunity to make a direct impact on process capability while collaborating with teams across Micron's global network. Responsibilities: Identify, diagnose, and resolve process issues using failure analysis, FMEA, 8D, SPC, and FDC methodologies Analyze process and manufacturing data to improve yield, product quality, and cost performance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an AI Reimagination Engineer in Micron's Generative AI Center of Excellence (GenAI COE), you have an outstanding chance to transform how businesses function. You will partner with different business areas to break down large, manual, multi-step processes and redesign them into effective, autonomous systems. This position combines process reimagination with AI systems engineering, making you a key part of the transformation journey. You will collaborate closely with the GenAI COE, IT architecture, security, and project teams. You will lead projects from the initial redesign to the final build, delivering solutions that business teams can adopt and scale. Responsibilities: Decompose end-to-end processes: Map current-state flows, quantify effort and risk, and lead eliminate/simplify/agentify analysis before automation. Architect the agentic solution: Build future-state flows and AI architecture, including task and agent decomposition, orchestration patterns, tool and data access, memory and context strategy, and human-in-the-loop controls. Translate inventions into buildable solutions by developing agent workflows, composing prompt and context strategies, MCP/connector and integration requirements, and evaluation criteria. Follow Micron's “Secure by Design”

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop