Advanced Package/Product Integration Sr. Manager

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As MSH PDE Yield Enhancement (YE) Lead Engineer within Package Development Engineering (PDE), you will lead a team of YE Engineers responsible for yield performance, excursion management, and yield stabilization across High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is accountable for ensuring predictable yield ramps , fast learning closure , and robust manufacturing readiness for advanced HBM technologies. You will provide people leadership, technical direction, and execution governance , partnering closely with Process Integration (PI), MRDA, Process Engineering, Assembly/Test Manufacturing, Quality, and Program Leadership to protect schedule, yield, and customer commitments. Job Responsibilities People & Team Leadership Build, lead, and develop a high‑performing MSH PDE YE team Set clear expectations on yield ownership, execution discipline, and escalation behavior Coach engineers on technical rigor, structured problem solving, and stakeholder communication Drive individual development plans, succession planning, and technical depth within the YE team Ensure sustainable on‑call / coverage models for critical NPI and

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD SG Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. You will need to have understanding of Frontend Process, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC time to market, continuou

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As part of APTD Technology Development Process Integrator, you will be responsible for developing advanced packaging process solution and ensure New Process, New Equipment, New Material and Path finding activities success for all adv pkg products in Micron. To lead/contribute new Technode process readiness and improving the yield, quality and reliability with process characterization and optimization and new materials, machines & technologies introduction. Having understanding of Frontend Process is a plus, packaging requirements, chip package interaction, equipment understanding and process technology in the industry. The ability to enable best technology for New Technode with packaging requirements. You will also be required to drive & collaborate with cross functional teams to resolve process related problems. Ensure smooth transition from new process development, 1st qualification success to small volume production launch Development and Qualification of new packaging process, material, equipment and technology solutions to meet new Technode requirements and schedule Perform CPI NUDD, process TRA, Si characterization, risk mitigation execution and process recipe readiness prior Silicon arrives and ensure 1st pass rate. Qualify new process/technology/equipment/materials Technical capability Identify path finding opportunities for Micron's technology leadership with BIC t

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in APTD Micron you will be responsible for leading and managing the activities and operation of Advanced Package Development by collaborating with internal and external stakeholders to build and execute technology development strategies aligned to organizational and business objectives by providing high performing and cost effective packaging solution on time with best predictable reliability performance. You will need to comprehend package technology development business process (MOR development) and TECHNODE business process for packaging technology and ensure all package development and product transfer work are carried out in accordance with these business processes. Other responsibilities include ensuring organizational compliance to company policies and regulations, as well as to departmental procedures, and providing organizational leadership for building and implementing department strategies, processes, and policy through active participation in functional teams and projects, as well as mentoring other functional leaders through collaboration and the development of sustainably successful solutions. Responsibilities and Duties include, but not limited to: Develop and Communicate Technology Development Strategy Develop and communicate Technology Development strategic objectives Understand the impact and implica