HBM Hardware Emulation Architect - SMTS

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The general responsibilities of the position are the following: HBM development Improve Probe testing coverage, quality and on HBM products Own the probe test flow, review and sign off probe test program release to ensure quality control Utilize state-of-art in house engineering equipment to support product characterization and electrical failure analysis Develop creative testing algorithms to improve testing efficiency New Generation Product Development Responsible for new product startup and yield improvement Support design verification and in-depth circuit of new products using CAD tools and Verilog simulations Work with the wafer fab process/integration group to address process-related defects affecting product yield Identify design marginalities and recommend design fix for circuit-related problems Functional and Design Validation Design novel test algorithms and develop test programs for validating HBM features and commands Use high-speed tester hardware to perform validation of new HBM devices Analysis of failures generated from the evaluations Automation of program development and work processes using scripting Product Yield Enhancement Identify causes of low yield through systematic analysis Work closely with various engineering groups in resolving process/defects related issues Perform electri

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role As a Supply Chain Program Manager, you will own material readiness and supply chain execution for critical hardware programs spanning custom silicon, systems, memory, storage, networking, and rack infrastructure. You will work cross-functionally with Engineering, Strategic Sourcing, Manufacturing Operations, Finance, Planning, Quality, and external suppliers to develop and execute scalable supply strategies that support aggressive product development and deployment timelines. This role requires deep understanding of hardware supply chains, material planning, NPI execution, supplier management, and operational scaling in constrained and rapidly evolving environments. In this role you will: Material Readiness & Supply Planning - Own end-to-end material readiness across NPI and production phases, including building the necessary framework and processes for enablement. Drive supply planning and execution for long lead-time and constrained commodities including ASICs, HBM, DDR, SSDs, networking, optics, power, thermal, and mechanicals. Build and manage material readiness plans aligned to proto/pre-EVT, EVT, DVT, PVT, and mass production schedules. Monitor supply health, lead times, inventory positions, allocation risk, and capacity constraints. Drive shortage management, allocation mitigation, and recovery planning. Coordinate supply commits, forecast alignment, and supply continuity planning with suppliers and manufacturing partners. Cross-Functional Program Ma

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re

About the Team OpenAI’s Hardware organization develops system and infrastructure solutions optimized for advanced AI workloads. We collaborate across research, software, and external hardware partners to design and deploy next-generation AI systems at scale. Our team works closely with silicon vendors and system partners to evaluate emerging technologies, validate performance characteristics, and ensure that hardware capabilities translate effectively to real-world AI workloads. About the Role We are seeking a 3P Hardware Architecture Expert with deep expertise in GPU and accelerator architectures to engage directly with silicon vendors and guide hardware decisions for AI infrastructure. In this role, you will evaluate architectural tradeoffs across compute, memory, and interconnect systems, translating vendor specifications into real-world workload impact. You will play a critical role in early silicon evaluation, benchmarking, and performance validation, helping ensure that next-generation hardware meets the needs of our workloads. This role is highly hands-on and requires both deep technical understanding and the ability to engage at a high level with partners such as NVIDIA and AMD on architectural direction and design tradeoffs. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance. Key Responsibilities Engage deeply with silicon vendors (e.g NVIDIA & AMD) on GPU and accelerator architecture tradeoffs. Analyze and interpret performance, power, and efficiency characteristics of next-generation hardware. Translate vendor specifications into expected real-world performance for AI workloads. Evaluate architectural aspects including: compute throughput and utilization memory systems (HBM, cache hierarchies, bandwidth constraints) data types and precision tradeoffs (FP16, BF16, FP8, etc.) interconnect and scaling behavior. Run benchmarks and profiling to validate hardware performance a

Job Summary Reporting to the Memory Validation leadership team, the Senior Silicon DDR/HBM Validation Engineer will be responsible for the bring-up, validation, characterization and debug of advanced memory subsystems used in next-generation AI compute platforms. The role will focus on DDR and HBM technologies, working closely with silicon design, firmware, characterization, platform and systems teams to ensure robust memory subsystem functionality, performance and reliability. The successful candidate will take ownership of significant validation activities, contribute to debug and root-cause analysis efforts, and help improve validation methodologies, automation and infrastructure. The Team The Memory Validation team sits within the Validation organisation and is responsible for the bring-up, validation, characterization and debug of memory subsystems across Graphcore silicon and platform products. The team supports DDR and HBM validation activities throughout the product lifecycle, from first silicon through production readiness. Engineers work closely with architecture, RTL, firmware, characterization, systems and platform teams to ensure memory technologies meet functionality, performance, reliability and performance objectives. Responsibilities and Duties Execute validation and bring-up activities for DDR and HBM memory subsystems Verify memory bring-up software, firmware and scripts against defined project requirements Debug firmware, hardware and system-level issues and contribute to root-cause analysis activities Analyse system logs, validation data and characterization results to identify failures and performance issues Perform PHY characterization and analog-level analysis during stress testing and validation activities Develop and execute functional, stress, performance and corner-case validation tests Perform signal integrity, voltage, frequency and timing measurements using laboratory instrumentation Char

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer Engin