Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Package Development & Engineering Support package feasibility studies, architecture evaluations, design optimization, and technical risk assessments. Apply mechanical, electrical, materials, thermal, and manufacturing fundamentals to package-engineering problems. Support development activities for memory and semiconductor package technologies from concept through qualification and manufacturing readiness. Analyze engineering data, identify risks, document findings, and recommend technically sound actions. Contribute to design-for-manufacturing, design-for-reliability, design quality, and first-pass qualification objectives . Design, CAD & EDA Create, review, or analyze package layouts, substrate structures, stack-ups, drawings, design inputs, and engineering deliverables. Use CAD/EDA tools
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Salary not disclosed
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Role overview
Job description
Package Engineering (PEPkg) Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.
What they are looking for
Skills & requirements
Hiring company
Micron
Manufacturing
Micron is a global leader in memory and storage, powering AI and compute-intensive applications from cloud to edge with innovative semiconductor solutions.
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