Principal Device Engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. NAND Device Engineer / Senior / Staff / Principal At Micron Technology, we are transforming how the world uses information to enrich life. As a NAND Device Engineer in the Device Technology Development team, you will play a critical role in shaping next-generation NAND technologies by bridging device physics, array operation, and product requirements . This role offers a unique opportunity to work at the intersection of fundamental device behavior and real-system impact , contributing directly to cutting-edge memory products deployed globally. What You Will Do: Device Understanding & Innovation Develop deep insight into NAND cell physics, variability, and reliability mechanisms across technology nodes and architectures. Analyze electrical characterization data from cell arrays and test structures to identify key limitations and improvement opportunities. Translate device-level understanding into actionable directions for cell design, process optimization, and array operation . Array-Level Optimization & Co-Design Drive device–array co-optimization , including threshold voltage (Vt) placement, distribution control,

Secure Every Identity, from AI to Human Identity is the key to unlocking the potential of AI. Okta secures AI by building the trusted, neutral infrastructure that enables organizations to safely embrace this new era. This work requires a relentless drive to solve complex challenges with real-world stakes. We are looking for builders and owners who operate with speed and urgency and execute with excellence. This is an opportunity to do career-defining work. We're all in on this mission. If you are too, let's talk. Principal Software Engineer Device Identity and Access Organization The Device Identity and Access organization is at the forefront of Okta’s Zero Trust vision. As a foundational pillar within Okta Research and Development (ORD), our mission is to transform the device itself into a secure, trusted, and effortless identity factor. We are the teams responsible for ensuring users can seamlessly interact with their work from any endpoint, anywhere in the world. Our organization is comprised of engineers who thrive at the intersection of deep client-side platform engineering and massive-scale distributed systems. The work we do secures millions of enterprise endpoints globally, prevents modern identity attacks, and fundamentally changes how people work by making world-class security completely invisible to the end user. Opportunity We seek a highly impactful and influential Software Engineer to join our engineering team. The ideal candidate will leverage their deep expertise in distributed systems, particularly Java, to architect, build, and scale the critical server-side software and services at the heart of our security and identity platform. This is a high-visibility, hands-on opportunity to define the architectural vision, pioneer new capabilities, and drive the technical strategy to solve complex, company-wide challenges and shape the future of Okta's device identity ecosystem. You will act as a key technical leader—a player-coach and force multiplie

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Principal Diffusion Process Development Engineer, you will act as a technical leader accountable for FEOL diffusion, annealing, and gate oxidation process advancement for advanced DRAM devices! This position emphasizes gate dielectric scaling, process reliability, and manufacturing preparedness. The ideal candidate blends extensive expertise in diffusion processes, oxidation principles, and device physics with practical experience transitioning technologies from development to production. You will collaborate closely with groups dedicated to process development, device engineering, equipment, and manufacturing to support future technology nodes. This role requires work with AI for productivity. Key Responsibilities Lead the progress of FEOL diffusion, thermal treatment, and gate oxidation operations in advanced DRAM technology. Develop and scale ultra-thin gate dielectrics, balancing electrical performance, reliability, variability, and manufacturability. Drive process development from concept through integration, pilot qualification, and manufacturing transfer. Evaluate, qualify, and optimize diffusion and oxidation equipment platforms and reactor builds. Define and monitor manufacturing metrics, including statistical process control, process capability, defectivity, and variability. Interpret electrical, physical, and materials characterization data to guide development decisions. Partner with external suppliers to develop hardware and processes aligned with future technology

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of a pathfinding organization focused on developing the technologies that will enable the next generation of memory solutions. Our team brings together engineers, scientists, and innovators working at the forefront of semiconductor research and development to solve sophisticated scaling, performance, and power challenges for future memory products. In this role, you will help develop the future of advanced memory technology by driving the development of first in industry Advanced DRAM solutions! You will collaborate across process integration, device engineering, materials science, characterization, and reliability teams to transform innovative concepts into silicon and deliver breakthrough memory architectures. Responsibilities: Lead process integration efforts for Advanced DRAM technologies, including charge storage devices, thin-film transistors (TFTs), and related device components Develop and integrate new memory device architectures from concept through silicon implementation and productization Design and implement experiments to evaluate device performance, variability, reliability, and failure mechanisms Partner with cross-f

Job Details: Job Description: As the world's largest chip manufacturer, and a global leader in innovation and new technology, Intel strives to make every facet of semiconductor manufacturing state-of-the-art - from semiconductor process development and manufacturing, through yield improvement to packaging, final test and optimization, and world class Supply Chain and facilities support. Employees in the Technology Development and Manufacturing Group are part of a worldwide network of design, development, manufacturing, and assembly/test facilities, all focused on utilizing the power of Moore's Law to bring smart, connected devices to every person on Earth. We're constantly working on making a more connected and intelligent future, and we need your help. Change tomorrow. Start today. What we offer: We foster a collaborative, supportive, and exciting environment where the brightest minds in the world come together to achieve exceptional results. We give you opportunities to transform technology and create a better future, by delivering products that touch the lives of every person on earth. What we do: Join the Logic Technology Development (LTD) organization, a powerhouse of process technology innovation driving Intel's IDM 2.0 strategy to exceed the aspirations of our global customers. We are seeking a visionary Principal Engineer to lead the charge in Intel's foundry revolution, serving as a strategic technical architect and executive partner in guiding our most critical customers through the entire product development lifecycle. In this leadership capacity, you will orchestrate multidisciplinary strategies spanning device engineering, product integration, and yield analysis to steer customers from critical design tape-out and pre-silicon evaluation through to NPI silicon qualification. Furthermore, you will define t

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a NAND Cell Device Senior/Principal Engineer in the Singapore Device Technology Development group of Micron Technology Inc., you will perform electrical characterization of advanced 3D NAND memory cells and develop novel device solutions for next‑generation non‑volatile memory technologies. Scope and responsibilities will align with experience level. Responsibilities Characterize NAND memory cell and array behavior to identify device improvement opportunities. Develop an understanding of performance and reliability requirements for new NAND cells and help refine specifications. Analyze automated tester data to identify qualification gaps, new device corners, and screening improvements. Contribute to NAND cell architecture and process definition through device physics and array operation expertise. Collaborate with process, integration, product, and design teams to address cell challenges and deliver improvement roadmaps. Qualifications M.S. or Ph.D. in Electrical Engineering, Physics, Materials Science , or a related field. Strong foundation in semiconductor device physics and fabrication processes . Experience w