Principal Engineer / MTS, PDE Package Design

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the groundbreaking forefront of semiconductor innovation, engineering world-class memory solutions built for uncompromising performance. If you're ready to redefine what's possible in NAND process technology, we'd love you on this journey with us. As a Principal Engineer / Member of Technical Staff (MTS) – Thin Films, you'll spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission: architect and deploy next-generation thin film fabrication methods that keep Micron ahead of the global competition. This is a role for a technical leader who thrives on solving the toughest challenges in materials, deposition, and device integration. Responsibilities: Advance thin film process development to meet demanding structural, electrical, and reliability targets across the NAND roadmap. Lead the creation of thin films for next-generation NAND cells, including dielectric, conductive, interface, and charge-storage layers. Explore new materials, precursor chemistries, and deposition techniques to unlock future sca

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal/MTS Photolithography Process Development Engineer in Micron's R&D Technology Development group, you will lead advanced photolithography process development for next-generation memory devices, driving innovation in process integration and technology transfer across Micron’s global manufacturing network. Key Responsibilities: Lead development and optimization of photolithography processes to achieve yield, quality, and performance targets for advanced technology nodes. Define and translate future device requirements into robust process specifications and equipment roadmaps. Drive early adoption of innovative process and equipment solutions to enhance margin and manufacturability. Identify and integrate disruptive technologies into production flows. Collaborate with global R&D teams and manufacturing sites to ensure seamless technology transfer. Partner with suppliers to accelerate breakthrough solutions and maintain strategic vendor relationships. Implement advanced process control methodologies using statistical tools, DOE, and simulation software. Conduct material evaluations, reticle/layout/OPC development, process window analysis, and overlay optimization. Generate intellectual pro

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Welcome to Micron's Advanced NAND Process Pathfinding Team — where the next generation of memory technology is developed. We operate at the innovative edge of semiconductor progress, engineering world-class memory solutions crafted for uncompromising performance. If you're ready to invent what's possible in NAND process technology, we'd love you on this journey with us. As a Principal Engineer / Member of Technical Staff (MTS) – Dry Etch, you'll spearhead groundbreaking initiatives alongside some of the industry's most accomplished technologists. Your mission: architect and deploy next-generation plasma etch solutions that enable future NAND scaling and novel device architectures. This is a role for a technical leader who thrives on solving the toughest challenges in plasma processing, pattern transfer, process integration, and technology development driven by advanced tools. Responsibilities: Develop and refine dry etch processes to satisfy NAND roadmap criteria for structure, performance, and yield. Guide the development of next-generation etch solutions, encompassing high aspect ratio patterning, selective etch, profile control, and CD management. Evaluate new plasma chemistries, process technologies, and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Principal Engineer/MTS (Member of Technical Staff), you will join a groundbreaking Next Generation NAND research and development Dry Etch team working on critical modules listed below. This role offers many opportunities for innovation, collaboration, and expanding capabilities with Next Generation NAND. You will collaborate closely with process integration and other areas such as Wet Etch, CVD, Diffusion, Metals, Lithography, and CMP. You will manage powerful dry etch chambers and lead the process roadmap to achieve program and yield targets. Your responsibilities include, but are not limited to: Main Responsibilities: Leading innovation in Dry Etch technology and essential module advancement Develop and innovate dry etch processes to meet structural and electrical specifications. Work together with hardware teams to develop the equipment roadmap for the current and upcoming generation of NAND products. Show expertise in dry etch technology fundamentals and possess a mechanistic understanding of how process parameters affect out

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal / MTS-Lead, you will be a part of a groundbreaking next-generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration, and testing a new dimension and scaling with next generation NAND. You will collaborate directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on powerful and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. In this role, your responsibilities will include, but are not limited to: Program and Project Management Manage efforts and set the strategy for developing process technology for assigned products in Process R&D. Offer routine project coordination and technical support to your process development team. Handle the demands of several customers to determine priorities for your team. Resolve yield and defect issues related to your process area. Collaborate with the Manufacturing Development Engineering team to meet R&D product quality and cycle time goals. Work with R&D Management, Process Integration, and High-Volume Manufacturing Sites to regula

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As s Principal Engineer/MTS (Member of Technical Staff), you will be a part of revolutionary Next Generation NAND research & development Dry Etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with Next Generation NAND . You will work directly with process integration and other process areas such as Wet Etch, CVD, Diffusion, Metals, Lithography & CMP. You will work on state of the art and best in class dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Leading Dry Etch technology and critical module development Be a Dry Etch Area expert. Develop/innovate dry etch processes to meet structural and electrical specifications Collaborate with hardware teams to build equipment roadmap for the current and next generation NAND products. Demonstrate authority on dry etch technology fundamentals and have a mechanistic understanding of process parameters impact. Collaborate and lead cross functional teams to solve complex structural problems. Present process and technology roadmaps for current and future technology nodes. Stay