Senior SOC Physical Design Engineer, HBM

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. In this position, you will work and support the efforts of groups such as Design Engineering, Product Engineering, Process Integration, Probe, and Assembly to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer happiness. How To Qualify: B.S.EE degree with + 2 years of experience M.S.EE degree with 1+ years of experience. Coursework in CMOS Circuit Design and VLSI Coursework that included crafting the physical layout of circuits Knowledge and experience using Cadence Virtuoso Excellent problem-solving and analytical skills A self-motivated, hard-working team player who enjoys working with others. Good communication and documentation skills Drive innovation into the future Memory generation with a dynamic work environment. What Sets You Apart: Knowledge of layout synthesis and place and route techniques Experience with LVS and DRC tools such as Calibre Utilize AI-Enabled tools to assist in layout floor planning, place and route Standard cell construction and analog layout techniques Having an innovative approach that is open to improving upon any of our processes or products. As a world leader in the semiconductor industry, Micron is dedicated to your persona

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking a Senior Analog Design Engineer to join our High Bandwidth Memory (HBM) team. This role is responsible for the architecture, design, simulation, and silicon bring ‑ up of high ‑ performance analog and mixed ‑ signal circuits used in HBM PHYs and supporting infrastructure. The ideal candidate has deep expertise in high ‑ speed I/O, clocking, power management, and advanced ‑ node analog design, and has successfully delivered silicon to production. Responsibilities will include, but are not limited to: Design and own critical HBM analog circuits, including: High ‑ speed transmitters and receivers Clock generation and distribution (PLLs, DLLs, CDRs) SerDes ‑ related analog blocks Biasing, reference, and calibration circuits </

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is seeking an exceptional Senior-level Physical Design Engineer to drive top-level implementation of our complex AI and CPU System-on-Chip designs. You'll orchestrate cross-disciplinary collaboration, implementing sophisticated floorplans, power grids, and clock networks while ensuring design closure at the chip level. If you excel at managing the complexity of full-chip physical design and want to deliver next-generation AI hardware, we need your expertise. This role is hybrid , based out of Santa Clara, CA or Austin, TX or Fort Collins, CO. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are A seasoned physical design engineer who thrives on complex, full-chip implementation challenges. Expert at collaborating across disciplines, working effectively with architecture, RTL, and packaging teams. Passionate about optimizing chip-level implementations for power, performance, and area. Detail-oriented professional who drives design closure while maintaining quality and meeting aggressive schedules. What We Need 8+ years of top-level SOC physical design experience on complex, multi-million gate designs. Deep expertise in hierarchic

About Us Graphcore is a globally recognised leader in Artificial Intelligence computing systems. The company designs advanced semiconductors and data centre hardware that provide the specialised processing power needed to drive AI innovation, while delivering the efficiency required to support its broader adoption. As part of the SoftBank Group, Graphcore is a member of an elite family of companies responsible for some of the world’s most transformative technologies. Job Summary Working within the logical design team, the silicon logical design engineer is responsible for a wide range of logical design tasks. The team is responsible for delivering the Microarchitecture and RTL design to implement the chip architecture specification for Graphcore Silicon, working closely with other engineers within the Silicon team. The successful candidate will be responsible for helping the team deliver high quality micro-architecture and RTL for Graphcore chips, working within the logical design team and with the broader Silicon team to ensure we meet the company objectives for Silicon delivery. Responsibilities and Duties Integrate IP and subsystems into top-level SoC designs Develop and maintain build and configuration environments Perform synthesis, linting, CDC/RDC, and timing checks at the SoC level Support verification and physical design teams through clean interface hand-offs Debug and resolve integration-related issues across multiple hierarchies Contribute to the continuous improvement of integration flows and automation Producing high quality microarchitecture and other documentation Ensure good communication between sites to maintain consistent working practises Candidate Profile Essential skills: Logical design experience in relevant industry Experience range 4-8 years in Semiconductor Industry/Product development exposure. Be highly motivated, a self-starter, and a team player Ability to work across teams and debugging issues seen to find root caus

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We are looking for a highly experienced RTL engineer to own critical on- and off-chip interconnect components for our custom AI accelerator platform. You will drive the microarchitecture and RTL implementation of scalable on-chip communication fabrics connecting high-bandwidth compute, memory, and I/O subsystems as well as purpose-built off-chip interfaces and protocols needed to enable custom computing at scale. This is a senior, hands-on engineering role with broad technical ownership. You will drive design from requirements through the full silicon lifecycle, from architecture definition and performance analysis through RTL implementation, verification closure, physical design convergence, bring-up, and production readiness. You will plan and oversee the work of junior engineers and help drive and develop productive engineering relationships with external partners and help manage partner execution. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees. In this role, you will: Own the microarchitecture, RTL design, and delivery of major SoC interconnect components, including network-on-chip fabrics, switches, routers, bridges, protocol adapters, arbiters, and traffic-management logic as well as off-chip protocol bridges and interfaces. Drive third party engagements to develop novel networking and interface protocols and silicon IP while ensuring high quality and de