Solutions Architect

Job Details: Job Description: The Role and Impact We are seeking a Silicon Packaging Design Architect to join our team, where you will drive end-to-end package solutions for physical, electrical, and cost requirements. In this senior engineering role, you will collaborate with cross-functional teams to design, troubleshoot, and continuously improve packaging standards and processes, ensuring high-quality package output. Your contributions will directly impact the seamless transition of designs to production and enhance Intel's advanced packaging technologies. Business Group As part of Intel Corporation's dynamic and innovative ecosystem, this role resides within the Silicon Packaging Architecture team, focused on developing advanced packaging solutions that enable Intel's cutting-edge silicon technologies. The team plays a vital role in ensuring packaging, and 3D IC designs meet technical, mechanical, and reliability standards while supporting Intel's broader mission to drive world-changing advancements in technology. Key Responsibilities Translate product requirements into detailed package architecture specifications. Drive technology tradeoff decisions to ensure silicon packages conform to electrical, mechanical, thermal, and reliability standards. Collaborate with silicon, hardware, and package teams to deliver high-quality package solutions and overcome roadblocks. Oversee the end-to-end package development process, including design, procedures, and continuous improvements to quality standards. Troubleshoot packaging designs and resolve issues related to materials and processes, providing innovative and cost-effective solutions. Implement co-design strategies between silicon and board design teams to optimize product

Job Details: Job Description: About the Group Global Construction Engineering (GCE) is responsible for the design and engineering of all of Intel's major manufacturing and cleanroom projects across the globe. We are a team of specialized in-house architects and engineers in a highly collaborative environment. We work together with our factory, operations, and supply chain partners to deliver some of the most technically challenging construction projects in the world with demanding schedule and cost constraints. Our vision is to become the world leader in semiconductor foundry construction engineering. We are growing our team to accelerate Intel Foundry's manufacturing roadmap. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding fast-paced environment this is the right place for you. Everywhere you go you'll find an opportunity to make a difference. In any given workday you will be given responsibility to innovate and create an impact to our business. This position is with the Tool Install Central Engineering (TICE) team. TICE focuses on the construction designs required to install the semiconductor manufacturing equipment around the globe. We design thousands of tools each year to keep our factories running on the most advanced manufacturing equipment. This is a hybrid position at the Ocotillo campus in Chandler, Arizona. As a Civil, Structural, Architectural (CSA) Project Engineer - Tool Install Engineering your responsibilities will include but are not limited to: Provide engineering solutions and breakthroughs to enable and deliver tool install construction projects to meet cost, schedule, duration an

itD is seeking a DFT (Design For Test) Lead to drive the implementation and integration of advanced Design-for-Test (DFT) solutions across the silicon development lifecycle, ensuring highly testable, manufacturable, and reliable ASIC designs. The ideal candidate will bring deep expertise in ASIC DFT methodologies, post-silicon validation, and test architecture development, with a proven track record of delivering production-ready silicon through cross-functional collaboration. Location: Hybrid in Carlsbad, CA or Allentown, PA , or U.S. Remote . Candidates must be available to work Pacific Time business hours (9:00 AM–5:00 PM PST). Duration: 14 months We provide comprehensive medical benefits, a 401k plan, paid holidays, and more. Please note that we are only considering direct W2 candidates at this time, as we are unable to offer sponsorship. Responsibilities: Lead the implementation of hardware Design-for-Test (DFT) features, including scan, memory BIST (MBIST), BISR, boundary scan, and DFT simulation setup and debugging. Develop innovative DFT IP in collaboration with cross-functional engineering teams and integrate testability features into full-chip RTL designs. Drive reusable DFT and debug methodologies for next-generation silicon devices, including bare die and stacked die architectures. Perform post-silicon debugging, root cause analysis, and production qualification activities to improve silicon yield, reliability, and manufacturability. Collaborate with physical design, validation, and hardware engineering teams throughout the complete silicon product lifecycle. Design, validate, and release ATPG patterns while supporting manufacturing test readiness and production ramp. Develop technical solutions and resolve complex DFT challenges with minimal supervision while providing technical leadership to the broader engineering team. Internal Responsibilities: Attend regular internal practice community meetings. Collaborate with your itD practice team on ind

Job Details: Job Description: Intel is shaping the future of technology to help create a better future for the entire world. Our work in pushing forward fields like AI, analytics, and cloud-to-edge technology is at the heart of countless innovations. With a career at Intel, you'll have the opportunity to use technology to power major breakthroughs and create enhancements that improve our everyday quality of life. Join us and help make the future more wonderful for everyone. Want to learn more? Visit our YouTube Channel or the link below. Life at Intel The Role and Impact As a System Software Architect, you will play a pivotal role in designing and developing innovative software solutions that drive efficiency and scalability across Intel's manufacturing processes. You will be responsible for architecting robust systems and frameworks that enhance operational performance while ensuring seamless integration with existing technologies. Your contributions will directly impact Intel's ability to deliver world-class semiconductor products efficiently and reliably. Business Group Intel Foundry Services is at the forefront of manufacturing excellence, delivering cutting-edge solutions to meet the complex demands of the semiconductor industry. The group focuses on pioneering advancements in manufacturing technologies, infrastructure optimization, and secure operations, enabling Intel to stay ahead in a fast-evolving landscape. By joining this team, you will contribute to Intel's broader mission of solving technological challenges and empowering innovation worldwide. Key Responsibilities: - Architect scalable and efficient system sof

Zscaler (NASDAQ: ZS) accelerates digital transformation so customers can be more agile, efficient, resilient, and secure. The Zscaler Zero Trust Exchange platform protects thousands of customers from cyberattacks and data loss by securely connecting users, devices, and applications in any location. Distributed across 200+ public data centers globally and thousands of private sites at the edge, the SASE-based Zero Trust Exchange is the world’s largest in-line cloud security platform. We believe the future of work is Human + AI and are building an AI-native enterprise where human potential is amplified by machine intelligence to solve the world’s hardest security challenges. Driven by deep customer obsession, we are committed to the mission, outcome, and to each other. We bring these commitments to life through three core behaviors: ownership and collaboration, trust through outcomes and impact, and a challenge culture with ongoing feedback. Ready to make an impact at the company pioneering security transformation in the AI era? Join us at Zscaler. We are looking for a Sales Engineer to join our Enterprise West team. This is a remote role, reporting to the Manager of Sales Engineering. The Zscaler Sales and Go-to-Market team is a global group of professionals who are passionate about delighting our customers, nurturing trusted partnerships, and sharing their expertise to drive a secure, cloud-enabled digital future and further cement our position as the world leader in cloud security. Sales, Customer Success, Sales Enablement, Solution Architects, Business Development, Transformation, and Technology Partnerships all work together to demonstrate the power and agility of Zscaler cloud transformation to the world. What you’ll do (Role Expectations) Create and deliver technical product presentations to prospective customers Gather customer technical requirements to ensure proposed solutions will meet customer goals and needs Lead product evaluations and custom produ

Job Details: Job Description: The Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly organization is responsible for developing cutting edge substrate packaging and wafer assembly solutions for our customers. As a member of the Substrate Technology and Manufacturing Group, you will play a critical role in enabling new manufacturing capacity across advanced packaging suppliers. In this position, you will lead substrate supplier development and qualification activities for advanced technologies such as high density FCBGA, EMIB-T and glass core substrate, ensuring suppliers achieve the required readiness to support growing customer demand. This includes driving technical enablement, managing readiness milestones, and collaborating closely with cross functional engineering teams and supplier partners. A combination of detail-oriented project management, strong technical risk assessment / problem solving skills, and effective supplier / stakeholder management will be needed to be successful. Please note: This role requires periodic evening meetings with suppliers in East Asia, as well as occasional travel to supplier sites to support essential program objectives. Key Responsibilities Define process integration roadmaps and establish manufacturing procedures to meet technology transfer milestones. Extract insights from structured and unstructured data, applying statistical analysis and coding techniques for yield improvement. Lead low yield analysis and corrective actions to address quality excursions in high-volume production environments. Drive continuous improvement initiatives to minimize defects and optimize process reliability. Assess quality and reliability risks for manufacturing material and process changes, ensuring sustained product performance. C