Stacker Operator

We are seeking a highly motivated Assistant Manager – Projects (Construction Mechanical) to support the execution, erection, installation, testing, and commissioning of Coal Handling Plant (CHP) systems and associated mechanical infrastructure for thermal power projects at Adani Power, Korba. The role requires hands-on experience in CHP construction, mechanical erection, conveyor systems, crushers, stacker reclaimers, transfer houses, and related Balance of Plant (BOP) equipment. The candidate will be responsible for project execution, contractor management, quality assurance, safety compliance, and commissioning support while ensuring timely completion of project milestones. Source: Adani Group | Job ID: 58752

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Leveraging AI for design quality