3d Animator Jobs

Every day, tens of millions of people come to Roblox to explore, create, play, learn, and connect with friends in 3D immersive digital experiences– all created by our global community of developers and creators. At Roblox, we’re building the tools and platform that empower our community to bring any experience that they can imagine to life. Our vision is to reimagine the way people come together, from anywhere in the world, and on any device. We’re on a mission to connect a billion people with optimism and civility, and looking for amazing talent to help us get there. A career at Roblox means you’ll be working to shape the future of human interaction, solving unique technical challenges at scale, and helping to create safer, more civil shared experiences for everyone. Who We Are: Roblox is powered by microservices. Application Networking connects and secures Roblox’s services. We build ingress gateways that route traffic from the edge data centers to the core data centers, and service mesh to facilitate inter-service communications in the core data centers. We are forming a new Kubernetes networking team for a high performance computer that we are building for machine learning (ML) inference and training workloads. We are looking for accomplished engineers to set the foundation of this work. You will: Bootstrap the Kubernetes networking domain within Roblox Contribute to the technical strategy and the execution to b

Every day, tens of millions of people come to Roblox to explore, create, play, learn, and connect with friends in 3D immersive digital experiences– all created by our global community of developers and creators. At Roblox, we’re building the tools and platform that empower our community to bring any experience that they can imagine to life. Our vision is to reimagine the way people come together, from anywhere in the world, and on any device. We’re on a mission to connect a billion people with optimism and civility, and looking for amazing talent to help us get there. A career at Roblox means you’ll be working to shape the future of human interaction, solving unique technical challenges at scale, and helping to create safer, more civil shared experiences for everyone. The Senior Corporate FP&A Manager, Workforce Planning & Total Rewards leads Roblox’s end-to-end headcount planning cycle, aligning top-down envelopes and bottoms-up requests across Finance, People, and business leaders. You’ll own how we translate budget dollars into concrete hiring plans, using various internal tools to manage the planning and execution cycles. You’ll partner closely with People Science & Analytics, PBPs, Compensation, and Talent Acquisition to ensure plans are data-driven, executable, and tied to company priorities. Ultimately, you’ll be the connective tissue between our long-range plan, annual budget, and the teams we staff to deliver it. The ideal candidate will be eager to develop and drive processes, has an eye for efficiency, and works well cross fun

*Hiring for an architecture and designing company* *Position:* Interior Designer ( Female candidates are preferred) *Location:* Viraj Khand, Gomti Nagar, Lucknow *Salary:* 15000/- to 30000/- pm *Experience:* 1 2 Years (Freshers with strong design skills can also apply) *Qualification:* Bachelor's Degree/Diploma in Interior Design or a related field *Key Responsibilities:* 1- Create innovative interior design concepts for residential and commercial projects. 2- Prepare 2D drawings, 3D models, layouts, and renderings. 3- Coordinate with clients, architects, vendors, and site teams. 4- Select materials, furniture, lighting, and finishes. 5- Ensure timely project execution within budget. *Required Skills:* 1- Proficiency in AutoCAD, SketchUp, 3ds Max, V-Ray/Lumion, Photoshop, and MS Office. 2- Strong knowledge of space planning and interior materials. 3- Good communication, presentation, and client-handling skills. 4- Knowledge of site execution and construction detailing is an advantage.

*Job Profile*: Architect *Experience*: Minimum 2 years in architectural design *Salary*: Up to 40,000 per month based on experience & portfolio *Skills*: AutoCAD, SketchUp/3Ds Max, Lumion/V-Ray, Photoshop preferred *Qualification*: Diploma or B.Arch Degree in Architecture *Location*: Viraj Khand, Gomti Nagar, Lucknow, UP *Job Type*: Full-time *Key Responsibilities:* 1- Create 2D/3D architectural designs, plans, and elevations for residential & commercial projects 2- Handle both interior and exterior design concepts as per client requirements 3- Prepare working drawings, presentation drawings, and material selection 4- Site visits for measurement, supervision, and coordination with civil team/contractors 5- Client interaction for design approval and modifications 6- Ensure designs are functional, aesthetic, and comply with building codes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in FILMs process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 3 years experience in FILMs (CVD, PVD) in related industry 3. Solid understanding of thin film deposition principle 4. Understanding of process character

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Specific Responsibilities: 1. Drive HBM process development and yield improvement in WSS process. 2. Assist advanced package technology (chip stacking, 2.5D or 3D) research and development 4. Support project on-site execution and make decisions as technical consultant 5. Troubleshoot a variety of complex problems. Perform root cause analysis and resolve process engineering issues 6. Generate internal and external documentation for presentations and technical reports Technology Development: 1. Understand department and organizational goals and objectives to ensure daily tasks align with Technology Development needs. 2. Project engagement with cross-team interaction, providing expert contribution in materials characterization. 3. Coordinate mechanical characterization for advanced packaging development efforts globally including US, Japan, and Singapore site. 4. Provide recommendations for test structure and test vehicle design for material property evaluation. 5. Review, summarize, and present data with recommendations of materials and lead discussions with packaging material suppliers to meet technology roadmaps. Qualifications: 1. Degree/Major: Master above (PhD. is plus) major in Chemistry, Physic, Material, engineering science related fields 2. Must be at least 2 years experience in BONDING related works 3. Solid understanding of WSS/BOND advanced technilogies, 1 or more in below fields: a) Temporary bonding/debon

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners! The solutions we build help make everything from virtual reality experiences to breakthroughs in artificial intelligence possible. We do it all while committing to integrity, sustainability, and giving back to our communities, because doing so can fuel the very innovation we are pursuing. As a process integration engineer in the 3D DRAM organization, you will join a team of world-class engineers who are working in an industry leading 300mm R&D facility on technology that enables the future of memory scaling. You will focus on performance and manufacturability of Micron’s cutting-edge next-generation memories. Areas of concentration will include integration and circuit issues specific to 3D DRAM technology. In addition to a broad basis of process integration knowledge, this position requires a strong background in materials science and semiconductor device physics, along with a creative mindset and effective project management. The role interacts significantly with process development, simulation, characterization, and reliability groups. Responsibilities: Contribute to technology development activities to enable next generation DRAM, working on device components such as charge storage devices and thin-film transistors, among others. Optimize process flows and develop creative solutions to meet product requirements. Engage numerous cross-functional te

Job Details: Job Description: Join Intel's Silicon and Platform Engineering Group (SPE) as an Exempt Tech Contract Employee, The Role and Impact :As a Power Integrity Engineer, you will play a pivotal role in ensuring Intel's platforms and products meet the highest standards of performance and reliability. This position offers you the opportunity to work on cutting-edge technologies, designing and optimizing power delivery networks for complex high-speed platforms, boards, packages, and silicon. Your contributions will directly impact Intel's ability to deliver industry-leading solutions to its customers, driving innovation in power integrity and enhancing the performance and functionality of our silicon and systems. Join us to tackle exciting challenges and create impactful solutions that push technological boundaries. The primary responsibilities for this role will include, but are not limited to: Develop and analyze power delivery networks, including 2D and 3D model extraction and noise analysis across die/C4 bumps, silicon, package, sockets, and boards. Define power grid specifications and power and area targets to achieve optimal balance between power integrity and performance. Design test structures, electrical analysis methodologies, and verification plans to address power integrity challenges. Perform measurements to characterize power noise profiles across frequency, ground bounce, and other critical metrics, verifying power delivery networks post-design. Correlate measurements back to presilicon analysis and estimations for improved accuracy. Apply expertise in power integrity design and tradeoffs to guide simulations of power networks and physical implementations for packages and platforms. Ensure on-die power noise meets system-on-chip (SoC) functionality an

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum IC Substrate Package Layout Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for design of large form factor IC substrates within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Design of IC substrates using Siemens Xpedition IC package design software - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Deliver and disseminate design milestones to stakeholders - Design validation and verification; including DRC and LVS - Advanced packaging design integration (2.5D and 3D) with IC substrate - Tapeout of designs with substrate suppliers in collaboration with Intel substrate teams - Communicate designs in presentations and relevant documentation - Stay curre

What if the work you did every day could impact the lives of people you know? Or all of humanity? At Illumina, we are expanding access to genomic technology to realize health equity for billions of people around the world. Our efforts enable life-changing discoveries that are transforming human health through the early detection and diagnosis of diseases and new treatment options for patients. Working at Illumina means being part of something bigger than yourself. Every person, in every role, has the opportunity to make a difference. Surrounded by extraordinary people, inspiring leaders, and world changing projects, you will do more and become more than you ever thought possible. We are seeking a Senior Mechanical Engineer to support new product development in genomics instrumentation. This is a highly technical mechanical design role focused on the development of custom mechanisms, precision motion systems, and electromechanical assemblies used in advanced instrumentation. The ideal candidate will be an engineer with experience designing motorized mechanisms and precision motion systems, including a strong understanding of system requirements, motion architecture, controls integration, structural design, and performance validation. The ideal candidate also has experience developing motion solutions from requirements through implementation and understands the engineering principles behind achieving precise, reliable motion in complex systems. Responsibilities Design and develop custom mechanical mechanisms for use in genomics instruments, including motion systems, precision assemblies, and fluidic or sample‑handling components. Integrate mechanical designs with electrical, firmware, and control systems Create and maintain 3D CAD models, engineering drawings, and support

Air Proprietary Tooling Engineer (Entry-Level or Associate) Company: The Boeing Company The Boeing Defense, Space & Security (BDS) team is seeking motivated Tooling Engineers located in Berkeley, MO . This role will support design, development, installation, and sustainment of production tooling and assembly aids used across manufacturing and maintenance programs. The role partners with manufacturing, quality, suppliers, and design engineering to deliver safe, compliant, and cost-effective tooling solutions that enable efficient production. At The Boeing Company, our mission is to connect, protect, and explore our world and beyond. Position Responsibilities Develop and qualify production tooling, jigs, fixtures, and assembly aids from concept through production release Translate manufacturing and design requirements into tooling specifications, drawings, 3D CAD models, and bill of materials Perform tolerance stack-up, fit checks, and tooling validation through analysis, prototyping, and hands-on trials Support tooling fabrication and inspection, including supplier management, fabrication oversight, and acceptance criteria verification Lead root-cause analyses for tooling-related manufacturing issues and implement corrective actions and continuous improvement Create and maintain tooling documentation: process plans, safety assessments, work instructions, inspection plans, and change records Collaborate with multidisciplinary teams—manufacturing, quality, stress, systems, and supply chain—to ensure tooling meets program schedule, safety, and quality goals Ensure compliance with company and regulatory standards, maintain configuration control and toolin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Who We Are HP IQ is HP’s new AI innovation lab. Combining startup agility with HP’s global scale, we’re building intelligent technologies that redefine how the world works, creates, and collaborates. We’re assembling a diverse, world-class team—engineers, designers, researchers, and product minds—focused on creating an intelligent ecosystem across HP’s portfolio. Together, we’re developing intuitive, adaptive solutions that spark creativity, boost productivity, and make collaboration seamless. We create breakthrough solutions that make complex tasks feel effortless, teamwork more natural, and ideas more impactful—always with a human-centric mindset. By embedding AI advancements into every HP product and service, we’re expanding what’s possible for individuals, organisations, and the future of work. Join us as we reinvent work, so people everywhere can do their best work. About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering ana

Why Sony Interactive Entertainment? Sony Interactive Entertainment isn’t just the Best Place to Play — it’s also the Best Place to Work. Sony Interactive Entertainment (SIE) is the company behind the PlayStation brand. As a subsidiary of Sony Group Corporation, we’re part of a proud legacy of innovation and excellence. SIE is a dynamic technology company, delivering cutting-edge hardware and network services to more than 100 million people and an entertainment leader, home to some of the most beloved and recognizable intellectual properties (IP) in the world. Our role at SIE is to create and nurture the experiences under the PlayStation brand, a name synonymous with entertainment excellence and creativity. Division overview: The PlayStation Studios: Creative team is an award winning, global internal creative agency within PlayStation Studios. We endeavour to build a working environment where we can flourish and create industry leading work. Structured around 2 teams; Brand & Strategy and the Creative Studio, comprising of four core disciplines; Design & illustration, UI/UX, Motion & 3D, Film and Video. We deliver projects in collaboration with our game development and marketing/PR teams. Role Overview: This is an exciting opportunity to be at the forefront of our creative endeavors! As a key client-facing leader, you will partner with global stakeholders across multiple regions, building strong relationships and translating business needs into impactful creative solutions. You will serve as a trusted point of contact, ensuring creative deliverables align with project objectives, client expectations, and business priorities. Responsibilities: Coordinate the daily operations of the Creative Team in Malaysia. Cultivate a creative, diligent, and inclusive work environment. Manage the team's capacity plan, track utilisation, and handle competing priorities to ensure resources are effective

Instawork is on a mission to create meaningful economic opportunities for skilled hourly professionals in communities around the globe. Our AI-powered labor marketplace helps local businesses scale, and enables global technology companies to push the frontiers of robotics and AI. Backed by world-class investors like Benchmark, Spark Capital, Craft Ventures, Greylock, Y Combinator, and others, we’re looking for exceptional talent to reimagine the way the world works. Senior Mechanical Engineer — Robotics Hardware Location - Bangalore Instawork Robotics Labs is building Instacore, our proprietary five-camera and IMU wearable capture rig. Hundreds of units operate across India every day, collecting real-world data used to train frontier Physical AI models. We are looking for a senior, mechanically focused engineer to own the complete hardware lifecycle for Instacore and future hardware products. This person will independently lead design, prototyping, manufacturing, testing, deployment, logistics, maintenance, and continuous improvement. What you’ll do - Own the mechanical design and development of Instacore and other robotics hardware from initial requirements through production and field deployment. - Create detailed CAD models, assemblies, engineering drawings, bills of materials, and manufacturing documentation. - Rapidly prototype and validate designs using 3D printing, machining, fabrication, and off-the-shelf components. - Design durable mounts, enclosures, fixtures, wearable components, packaging, and protective systems. - Own design for manufacturability, assembly, serviceability, reliability, and cost. - Improve cable routing, connector retention, strain relief, thermal management, ingress protection, and resistance to vibration and impact. - Design packaging and logistics processes that prevent damage during storage and transit. - Establish verification, stress-testing, quality-control, and acceptance-testing procedures. - Investigate field failures, d