3d Animator Jobs

Every day, tens of millions of people come to Roblox to explore, create, play, learn, and connect with friends in 3D immersive digital experiences– all created by our global community of developers and creators. At Roblox, we’re building the tools and platform that empower our community to bring any experience that they can imagine to life. Our vision is to reimagine the way people come together, from anywhere in the world, and on any device. We’re on a mission to connect a billion people with optimism and civility, and looking for amazing talent to help us get there. A career at Roblox means you’ll be working to shape the future of human interaction, solving unique technical challenges at scale, and helping to create safer, more civil shared experiences for everyone. As the Director of MENA Public Policy you will develop and implement an engagement strategy with key policymakers, stakeholders, and opinion leaders across MENA. The successful candidate will oversee critical issues including, but not limited to, gaming, child safety, artificial intelligence, privacy, and consumer protection. The ideal candidate is a strategic thinker, driven to develop and execute creative strategies that advance Roblox’s business and priorities within the region. This position is based in Dubai and reports directly to the Head of Public Policy, Europe and MENA. The Director of MENA Public Policy will play a critical part in shaping Roblox's future in the country by establishing and executing effective public policy strategies. This role is instrumental in ensuring compliance, addressing policy issues, and fostering strong relationships with external partners, ultimately contributing to a safer and more engaging environment for Roblox's global community of developers and creators. You Will Maintain and build relationships with regional policymakers and political figures Identify, monitor, and analyze policy issues affecting Roblox in MENA Develop and execute policy

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Principal/Staff Engineer, Process Integration, NTI NAND at Micron, you will have the outstanding opportunity to work on groundbreaking 3D NAND technology. This technology will develop the future of data storage solutions. This role suits those who are ambitious, enjoy solving complex problems, and want to lead innovative projects that push the boundaries of what is possible. Responsibilities Module Ownership: Lead one or more process modules related to the development and operation of 3D NAND semiconductor coordinated circuits. Specification Definition: Define structural specifications and process requirements for assigned modules. Strategic Direction: Set a clear direction and vision for the module and establish a continual improvement plan. Proactive Issue Resolution: Identify potential structure, electrical, and reliability issues early and address them with process control. Solve problems using a model-based approach. Performance Optimization: Focus on structural development, electrical performance, parametric verification, and process control. Optimize manufacturability assessments. Material Innovation: Analyze materials physically and electrically. Collaborate with process groups to select new materials for development and tran

We are seeking a detail-oriented PCB Layout Engineer to maintain electronic component libraries and develop printed circuit board layouts. This role works closely with electrical engineering, mechanical engineering, procurement, and NPI to ensure component data and PCB designs are accurate, consistent, and ready for production. This position is in Austin, Texas. Key Responsibilities Create, verify, and maintain schematic symbols, PCB footprints, and associated 3D models. Validate component pin assignments, dimensions, land patterns, and library attributes against manufacturer documentation. Maintain library naming conventions, revision control, and component approval processes. Develop PCB layouts from approved schematics, including component placement, routing, stackup coordination, and design rule setup. Collaborate with engineers to address electrical, mechanical, thermal, and manufacturing requirements. Run design rule checks, resolve layout issues, and participate in design reviews. Prepare fabrication and assembly deliverables, including Gerber or ODB++ files, drill files, drawings, and pick-and-place data. Coordinate with PCB fabricators and assembly suppliers to resolve manufacturing questions. Support engineering changes and maintain accurate release documentation. Work with procurement and engineering to identify obsolete components and evaluate suitable alternatives. Required Qualifications Experience with setting up PCB design and electronic component library management. Proficiency in Cadence Allegro/OrCAD. Ability to interpret schematics, component datasheets, and mechanical drawings. Working knowledge of PCB fabrication, assembly processes, and design for manufacturability. Familiarity with relevant IPC standards for PCB design and component land patterns. Strong attention to detail, documentation skills, and ability to manage competing priorities. Experience with multilayer, high-density, mixed-signal, and high-speed PCB designs. Familiarity w

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Mech/Thermal Platform team as a Graduate Mechanical Engineer. You will contribute to the mechanical design, thermal validation, and verification of advanced AI hardware and data center systems. You will work with experienced mechanical, thermal, hardware, and systems engineers throughout the development lifecycle. The role combines 3D computer-aided design, prototype evaluation, lab testing, data analysis, troubleshooting, and clear engineering documentation. What You Will Do Create and update mechanical parts, assemblies, and drawings using Creo or comparable 3D CAD software. Take ownership of defined mechanical design tasks from requirements and concepts through detailed design, review, release, and verification. Apply mechanical design, materials, manufacturing, heat transfer, and thermodynamics principles to engineering decisions. Develop mechanical and thermal test plans and procedures for prototypes and development systems. Set up and operate laboratory equipment, collect accurate data, analyze results, and document conclusions. Evaluate prototypes and identify mechanical, thermal, assembly, or manufacturability issues. Support design verification, troubleshooting, root-cause analysis, and implementation of verified design improvements. Maintain accurate engineering documentation, including design notes, drawings, test procedures, results, and change r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that deliver the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing some of the world’s most transformative technologies. Our new AI Engineering Campus in Austin will play a central role in building the future of AI computing. The Opportunity As a Mechanical Engineering Intern, you will contribute to the mechanical design and thermal validation of advanced AI hardware. Working alongside experienced mechanical and thermal engineers, you will gain hands-on experience with 3D computer-aided design (CAD), laboratory setup, test development, prototype evaluation, and engineering documentation. Type: 12-week summer internship Timing: May - August (exact dates to be confirmed) Commitment: Full-time What You’ll Do Contribute to mechanical design activities using Creo or comparable 3D CAD software, including part modeling, assemblies, drawings, and design updates under the guidance of experienced engineers. Work with the thermal engineering team to develop test procedures and help set up laboratory capabilities for evaluating AI hardware. Support thermal and mechanical testing using appropriate laboratory equipment; collect, organize, and analyze test data. Assist the mechanical and thermal design teams with prototype evaluation, troubleshooting, design verification, and documentation of findings. Collaborate with cross-functional engineering partners, communicate progress and issues clearly, and follow applicable laboratory and safety procedures. What You’ll Bring Current enrollment in a bachelor's, master's, or doctoral program in mechanical engineering or a related discipline during the internship. Students in other disciplines with relevant mechanical engineering exper

Do you have an insatiable curiosity and passion for science? Do you want to partner with PIs at the top research institutions in the world to accelerate their life's work? We are seeking a dedicated and science-savvy Senior Account Manager to lead our relationships with a few key R1 universities in the Northeastern or Mid-Atlantic regions. NVIDIA’s accelerated computing platform is the scientific instrument transitioning research from traditional sequential computing to massively parallel, neural networks driven labs. Our full-stack platform includes supercomputers, the CUDA programming model, and hundreds of libraries, frameworks, and models. From BioNeMo for structural biology, Parabricks for genomics, Omniverse for 3D virtual worlds, and RAPIDS for data science, to CUDA-Q for hybrid quantum-classical computing, PhysicsNeMo for physics-informed AI, and Earth-2 for climate modeling, we are empowering the next scientific breakthroughs. What You'll Be Doing: Institution and Government Engagement: Serve as a trusted advisor to university and occasionally, state government leaders, communicating NVIDIA's vision, technology roadmaps, and research impact. Grow the Business: Champion organic business growth, forecast revenue, and collaborate with IT and business partners on go-to-market strategies. Research Community Partnership: Forge strong connections with leading research labs and PIs across diverse scientific domains (e.g., AI/ML, life sciences, physical sciences, climate science, engineering, and materials science). You will understand their grand challenges and keep a pulse on emerging computational methods. Strategy Execution: Engage internal cross-functional NVIDIA teams (Solution Architects, Developer Relations, Product Management, Business Units, etc.) and university partners to accelerate science on NVIDIA’s platform. Ecosystem Enablement &

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. ROLE Lead first-silicon bring-up, characterization, debug, and validation of advanced 3D NAND products. Establish whether silicon meets design intent and datasheet requirements, correlate simulation with measurements, and resolve issues that could affect product qualification, reliability, yield, or SSD/system integration. This role provides a unique opportunity to develop end-to-end expertise across advanced NAND products, spanning circuit design concepts, mixed-signal simulations, first-silicon bring-up, silicon debug, product qualification, and manufacturing readiness. Engineers gain broad exposure to analog, mixed-signal, digital, firmware, memory-array, and system-level behavior while working closely with design, verification, firmware, product, and system teams. RESPONSIBILITIES • Own validation strategies, coverage, and test plans for assigned NAND circuits and functions; define expected behavior, operating corners, and pass/fail criteria from product specifications and design intent. • Lead first-silicon bring-up, characterization, debug, and simulation-to-silicon correlation across voltage, temperature, process, timing, and workload conditions. • Characterize and debug NAND subsystems including reference and bias generation circuits, bandgap references, oscillators, voltage regulators, charge pumps, sensing and page-buffer paths, high-voltage program/er

REQUISITOS MANDATÓRIOS EXPERIÊNCIA Experiencia em projetos para a indústria de petróleo e/ou unidades de produção offshore; Microsoft Office, Microsoft TEAMS, Power BI, SAP S/4HANA, Autodesk Navisworks Manage, Autodesk AutoCAD ou MicroStation, Smart Plant Foundation, Smart 3D, Smart P&ID e Smart Review; Conhecimentos obrigatórios adicionais por disciplina de atuação: Instrumentação: Smart Instrumentation; Elétrica: Smart Electrical; Segurança: Softwares de acompanhamento de estudos de segurança e Análise de risco; Naval, estruturas ou arquitetura: CAE (SmartPlant3D); Automação de Projetos: Ferramentas de engenharia CAD/CAE, Smart 3D, Cloudworxs, Smart P&ID, Smart Instrumentation, E3D (Aveva) - PROTEUS / ENVIRON / PLAN 360, Microstation, AutoCAD, Autodesk Navisworks Manager, Autodesk RECAP PRO, Leica Truview, Leica Cyclone (Register, Model e Enterprise) e WebTag. Conhecimento técnico em programas 2D de CAD/CAE, tratamento de Nuvem de Pontos e Fotos 360; ESCOLARIDADE Nível de Formação: Nível Técnico Industrial com Registro no Conselho Regional de Técnicos Industriais - CRT. ATRIBUIÇÕES Apoio ao planejamento de projetos, contemplando, dentre outras atividades descritas: Atuação técnica em projetos de engenharia; Elaboração de projetos (operação de programas 2D, 3D); Elaboração de listas de materiais; Realização de embarques para levantamento de campo. Sobre a CAPCO: Na Capco promovemos uma cultura inclusiva. Valorizamos a diversidade em todas as suas expressões. Pensamos, em conjunto , sempre em ações diversas de inclusão e de responsabilidade social através de comitês internos geridos pela nossa comunidade interna, como os grupo de Mulheres, Pessoas Com Deficiência, Pessoas Negras, LGBTQIAPN+, Parentalidade, Gerações, entre outros. Nossas oportunidades são trabalhadas para todos(as)!!! #LifeAtCapco PRÓXIMOS PASSOS: Se você está ansioso(a) para progredir sua carreira conosco, candidate-se e aguarde o contato de um d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. At Micron, we are advancing the memory technologies that power the AI era. As a NAND Cell Device Engineer , you will work at the forefront of advanced 3D NAND development , driving the characterization, understanding, and optimization of next-generation memory cells. You will collaborate with world-class experts across device, process integration, design, product, and reliability teams to solve complex technical challenges and enable future technology nodes. This role offers the opportunity to influence the direction of future NAND technologies through deep device physics expertise, data-driven insights, and cross-functional collaboration . Scope and level of responsibility will be aligned with your experience . We welcome both high-potential engineers looking to grow into technical leadership roles and established experts seeking to make a significant impact on cutting-edge memory technology. Key Responsibilities Characterize advanced NAND memory cells and arrays to identify opportunities for performance, reliability, and scaling improvements. Develop deep expertise in NAND device physics, array operation, and failure mechanisms to guide future technology development. Analyze large-scale electrical test data to u

Interactive Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and non-technical audiences Build, test, troubleshoot, and iterate prototypes to identify issues and improve product performance, reliability, a

Product Design Engineer - HPIQ Description - About The Role As a Product Design Engineer at HP IQ, you’ll work at the intersection of creativity, engineering, and design to develop groundbreaking devices that redefine how people interact with technology. You’ll collaborate closely with industrial designers, hardware engineers, and interaction designers to transform ideas into functional prototypes and production-ready designs. From 3D CAD modeling and hands-on prototyping to engineering analysis and design validation, you’ll help solve complex mechanical challenges and drive designs from early concepts toward production. You’ll have the opportunity to take ownership of meaningful engineering work while learning from an experienced, multidisciplinary team and contributing to products that push the boundaries of what’s possible. What You Might Do Design mechanical parts, components, and assemblies for new consumer devices using 3D CAD (NX) Create detailed 2D engineering drawings, define specifications and tolerances, and work closely with overseas vendor partners to ensure accuracy and quality Design and run experiments, applying engineering analysis and test results to guide design decisions Evaluate materials, manufacturing processes, and design tradeoffs to develop robust and scalable solutions Work cross-functionally with hardware, software, industrial design, and other engineering teams to bring concepts from ideation through development Conceptualize, design, and build prototypes that quickly validate ideas Participate in design reviews, clearly communicating design decisions, technical analysis, and tradeoffs to both technical and

Where Performance Meets Purpose Join a team that values excellence and innovation, at a company known for its iconic golf brands. At Acushnet Company, your background and experience contribute to creating the best products for dedicated golfers worldwide. Here, your performance has purpose. What You Will Be Doing The Senior Associate Product Designer plays a key role in bringing innovative, performance‑driven products to life across the Titleist Gear, Club Glove, and Links & Kings franchises. Working under the guidance of the Design Manager and Senior Designers, this role contributes to the creation, development, and refinement of new product concepts using a blend of art, design, graphic, and 2D/3D CAD skills. The position collaborates closely with cross‑functional product design and development teams to translate form, function, and brand intent into commercially viable solutions that align with critical timelines. Through hands‑on concepting, prototyping, research, and documentation, the Senior Associate Product Designer supports IP efforts, participates in design critiques and vendor engagements, and continually expands technical and creative expertise. With a strong passion for golf and travel gear, this role helps drive thoughtful design, material innovation, and visual storytelling that elevate product performance and presentation from inspiration through commercialization. When submitting your resume, please also include a cover letter describing why the golf industry inspires you and what motivates you to pursue a career with the Acushnet Company. What You Bring B.S. or B.A. Product Design or a closely related field. 1–3 years of professional experience in product design or a related

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Sr Design Engineer, you will work on design, simulation, and validation of next ‑ generation High ‑ Bandwidth Memory (HBM) architectures and circuit blocks. HBM requires advanced DRAM design knowledge combined with deep understanding of 3D stacked architecture, TSV signaling, wide I/O interfaces, PHY timing, power integrity, and system co ‑ optimization with GPUs/accelerators. This role sits at the intersection of DRAM design and high ‑ performance computing, enabling future AI/ML, HPC, and advanced graphics products. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction.

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking an experienced ASIC Package Signal Integrity / Power Integrity Engineer to drive electrical architecture, modeling, optimization, and validation for the most advanced AI/HPC silicon and package design. This role focuses on high-speed SerDes and memory channel architecture, advanced 2.5D/3D package SI/PI, substrate to package co-design, power-delivery-network optimization, electromagnetic modeling, and simulation-to-measurement correlation. The ideal candidate has strong hands-on experience with high-speed channel and PDN analysis across ASIC packages, interposers, substrates, and power-delivery structures, and can translate simulation results into practical design requirements for interposers and package substrate design optimization. The engineer will work closely with ASIC, package, system, mechanical, thermal, power, and silicon validation teams from early architecture and feasibility studies through production bring-up. In this role you will Own SI/PI architecture and analysis for advanced AI ASIC packages from early feasibility studies through production. Develop and optimize high-speed electrical channels for 200G/400G SerDes, PCIe, HBM, DDR, and chiplet/die-to-die interfaces. Perform package, interposer and substrate modeling using 2D/3D electromagnetic solvers. Define and optimize package stack-ups, transmission-line structures, via transitions, breakout structures, return paths, ground shielding, bump maps, and ball maps based on SI/PI re