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Job Details: Job Description: The Role and Impact As a Physical Design Engineer, you will play a critical role in driving the development of cutting-edge technologies at Intel. You will work hands-on to deliver high-performance physical designs, ensuring the successful integration of advanced semiconductor technologies. Your work will directly impact Intel's product innovation, addressing complex challenges in power, performance, and area optimization to shape the future of computing architectures. From synthesis to sign-off, your contributions will enable Intel to meet ambitious design goals and deliver transformative solutions to the market. Business Group This role is part of Intel's Corporate Technology Office (CTO), a dynamic group dedicated to advancing the company's technological leadership and innovation. The group focuses on developing foundational technologies, architectures, and methodologies that drive Intel's product roadmap and enable breakthrough computing solutions. Collaborating with cross-disciplinary teams, the CTO plays a pivotal role in delivering impactful designs that support Intel's broader mission of creating world-changing technology. Key Responsibilities - Drive RTL-to-GDS design convergence using advanced synthesis and place-and-route tools targeting performance, power, and area (PPA) goals. - Deliver block-level physical design, including closure of backend flows, electrical requirements, and enhancing silicon yield. - Collaborate with CAD and physical design methodology teams to adopt industry-leading tools and optimizations for custom designs. - Execute physical implementation tasks such as floor planning, bus/pin placement, power/clock distribution, congestion analysis, timing closure, IR drop analysis, and physical verification. - Debug timing, EM/IR, LVS, and DRC violations, and driv

Job Details: Job Description: The Role and Impact Join Intel's Design Technology Platform (DTP) organization and become an integral part of a highly skilled team driving the development of cutting-edge technologies. As an EDA Tools Software Engineer, you will design, develop, test, and debug software tools and methodologies that directly support Intel's hardware product design and manufacturing processes. Your work will enable design teams to innovate faster, meet complex manufacturability constraints, and deliver industry-leading products to market. By contributing to Intel's advanced process technologies, you will play a pivotal role in achieving leadership in design automation and fostering a culture of innovation. Key Responsibilities Design, develop, and debug Fill components of Process Design Kits (PDKs), Provide algorithmic solutions using tools such as Calibre, ICV, and Pegasus to address density deficiencies and ensure manufacturability compliance. Collaborate with process developers, design rule owners, and end users to define requirements and implement state-of-the-art solutions. Automate workflows to enhance efficiency, accuracy, and deployment across design teams. Develop comprehensive test cases and systems to validate software tools and ensure seamless integration with various design methodologies. Innovate and drive advancements in EDA tools and methodologies to meet the evolving needs of Intel's technology ecosystem. Partner with cross-functional teams and external EDA vendors to define and implement new tool features and methodologies. Maintain documentation, including training materials and user guides, to support customers and ensure robust deployment.

Job Details: Job Description: The Thin Films Senior Process Engineer will support PVD, CVD, and ALD technologies for dielectric and metal thin-film deposition in a high-volume manufacturing environment. Key Responsibilities Apply advanced expertise in thin-film deposition processes to drive continuous improvement in process performance, sustainment, and technology development. Collaborate with upstream and downstream partners to deliver manufacturing improvements through strong cross-functional engagement and stakeholder management. Own manufacturing processes and/or equipment, ensuring achievement of key performance indicators (KPIs) including safety, quality, cost, productivity, defect reduction, and yield improvement. Develop and execute strategic plans for complex projects, coordinating timelines and dependencies across multiple teams and initiatives. Support manufacturing capacity expansion and technology transfer activities to enable successful ramp-to-volume production. Partner with equipment vendors and cross-functional stakeholders to troubleshoot technical challenges, improve tool performance, and enhance operational efficiency. Lead process development initiatives that support current and next-generation high-volume manufacturing technologies. Design and optimize excursion prevention and detection systems to strengthen process control and minimize manufacturing risk. Lead equipment installation, conversion, qualification, and readiness activities during factory ramps, ensuring all tools are deployed safely, on schedule, and in compliance with quality and manufacturing standards. Drive root cause analysis and implement corrective actions to resolve process and equipment-related issues while improving overall manufacturing stability and performance. <p st

Job Details: Job Description: About the Role Join a team developing next-generation CPU cores that power client, server, IoT, and AI platforms. As a Senior Physical Design Engineer (CPU), you will play a key role in delivering high-performance, power-efficient silicon solutions. You will take ownership of blocks within the CPU core design, driving implementation from RTL to GDS and contributing to advanced physical design methodologies. What You’ll Do Key responsibilities will include but not limited to: Own physical design and implementation of CPU core blocks or subsystems Execute synthesis, floorplanning, place and route, and design closure Perform static timing analysis (STA), power analysis, and physical verification Drive convergence of timing, power, and area (PPA) metrics Debug and resolve complex design issues across multiple design stages Develop and optimize design flows and automation scripts Collaborate cross-functionally with RTL design, verification, clocking, and full-chip teams Contribute to improving design methodologies and best practices Provide guidance to junior engineers where applicable Behavioral traits that we are looking for: Strong problem-solving and analytical thinking Takes ownership and accountability for deliverables Collaborates effectively across multidisciplinary teams Communicates technical concepts clearly and concisely Prioritizes work effectively in a fast-paced environment Continuously learns and applies new tools and methodologies Why Join Us Work on cutting-edge CPU core designs that power client, server, IoT, and AI platforms used worldwide Be part of

Job Details: Job Description: oin Intel Foundry Construction and Sourcing (FCS) in building the world's largest semiconductor manufacturing factories across the globe. The future is what we build. The scope of our work includes but is not limited to Advanced Packaging Factories, New Wafer Fabrication factories (Fabs), Fab Conversions, Process Tools Install, Infrastructure, and Progressive Build. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding, fast-paced environment, this is the right place for you. Everywhere you go, you'll find an opportunity to make a difference. In any given workday, you will be given the responsibility to innovate and create an impact on our business. The Install Qualification Operation Sr Specialist is responsible for driving key milestones enabling tool installation, readiness, and qualification within Intel Foundry Construction and Sourcing (FCS). The role is responsible for equipment install execution from pre-design through design finish and set to SL2 signoff, ensuring safe delivery, accurate scope definition, efficient construction, and prompt vendor qualification. This position requires five days per week of onsite presence and close coordination with manufacturing, design, construction, OEMs, trade contractors, and supplier partners. Please consider that this is an Intel Contract position (3 years). Responsibilities will include but are not limited to: Safety and Compliance: Champion Intel's Culture of Caring and ensure safe behaviors across design and construction activities. Enforce cleanroom, IP protection, and site protocols to maintain compliance with all applicab

Job Details: Job Description: Intel Corporation is the world's largest semiconductor company and a global leader in computing innovation. Our Quantum Computing Group represents Intel's bold venture into the next frontier of computing technology, leveraging our decades of semiconductor manufacturing expertise to develop silicon-based quantum processors. We're pioneering spin qubit technology in silicon quantum dots, combining cutting-edge quantum physics with Intel's unmatched manufacturing capabilities to create the world's first commercially viable quantum computers. Our collaborative approach spans Intel's research divisions and partnerships with leading academic institutions worldwide. We are seeking an exceptional Quantum Interposer Design Engineer to join our pioneering quantum computing team in Oregon. In this role you will be responsible for physical design and integration of advanced packaging interposers within a multidisciplinary team. You'll play a crucial role in advancing Intel's silicon quantum dot technology while contributing to the development of scalable quantum systems that will revolutionize computing. Key Responsibilities - Physical design and integration of interposers used within advanced packaging for quantum computing - Work closely with stakeholders to meet design requirements - e.g., receive feedback from silicon testchip, signal integrity (SI), power integrity (PI), thermal simulation, and system integration engineers - Design validation and verification; including DRC and LVS - Deliver and disseminate design milestones to stakeholders - Communicate designs in presentations and relevant documentation - Stay current with the latest developments in packaging technology and design techniques by attending conferences and reading papers As

We’re building a world of health around every individual — shaping a more connected, convenient and compassionate health experience. At CVS Health®, you’ll be surrounded by passionate colleagues who care deeply, innovate with purpose, hold ourselves accountable and prioritize safety and quality in everything we do. Join us and be part of something bigger – helping to simplify health care one person, one family and one community at a time. Title: Nurse Practitioner, Advanced Practice Provider Company: Oak Street Health Address: 2240 E 53rd St B 1, Indianapolis, IN 46220 Salary: $95,000-148,500 **Wider range available depending on experience and location Schedule: Full-Time, Monday through Friday, 8:00 AM - 5:00 PM Role Description: The purpose of a Nurse Practitioner at Oak Street Health is to provide effective and equitable value-based primary care to adults on medicare to keep them happy, healthy, and out of the hospital. Nurse Practitioners see patients independently and collaborate with physicians, depending on the patient’s specific situation. Nurse Practitioners provide longitudinal care and build meaningful patient relationships; this creates trust and helps our patients understand and feel connected to their care plan. Nurse Practitioners practice in our outpatient practices on a collaborative care team composed of a physician, nurse practitioner or physician assistant, medical assistants, a dedicated medical scribe, and support from registered nurses and care managers. We partner with a network of elite specialists and hospitals for specialty and acute care. As such, our healthcare providers can focus on care within the clinic: primary care, care coordination, and population health. Core R

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Join Our Team as a STAFF ENGINEER, TDT PD CMP At Micron, we are driven by the pursuit of excellence and innovation. As a Chemical Mechanical Planarization (CMP) Process Development Engineer, you will play a key role on our Technology Development Taiwan (TDT) CMP team. You will contribute to the progress of our innovative DRAM technology. If you have a passion for semiconductor development and enjoy working in a dynamic and collaborative environment, we invite you to join us in defining the future of the semiconductor industry! Key Responsibilities Develop and refine CMP processes to support advanced DRAM technology acceleration. Collaborate with diverse teams to develop new outstanding semiconductor devices. Perform rigorous process characterization, develop new consumables, and evaluate new hardware. Conduct groundbreaking research and innovate to contribute to Micron’s extensive patent portfolio. Drive continuous process and efficiency improvements to meet yield, quality, and cycle time requirements. Direct and manage CMP consumables and equipment suppliers. Plan and complete well-designed experiments, presenting results in clear and concise reports. Minimum Qualifications Proficiency in both Chinese and English languages. Expertise in CMP process development. Hands-on experience with CMP polishing equipment, including familiarity with equipment operation, optical metrology, profilometry, common polishing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron in Boise, Idaho has a current need for a Senior or Staff R&D Photolithography Materials Engineer . Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As an R&D Photolithography Materials Engineer at Micron Technology Inc., we are responsible for photolithography material selection and optimization for advanced memory devices. In this position, you will develop new technology and photo materials that meet device requirements and integrate new technology into manufacturing processes. This work could include photo materials for any photo processes including hardmasks and resists for I-line (365nm) through EUV (13.5nm). Additionally, you will address process and materials issues with pilot manufacturing and work on continuous improvements for manufacturability. Job Responsibilities: Lead long-term resist screening projects. Define success criteria with process owners, evaluate multiple rounds of design of experiments (DOEs) with suppliers, and identify top materials for detailed evaluation on devices in technology development. Broad knowledge and experience in photoresist chemistry with an ability to direct material optimization and development with our suppliers Work in a cleanroom, follow safety proc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron is expanding its semiconductor manufacturing operations in Boise through a historic $15 billion investment that will support next-generation DRAM production and advanced manufacturing capabilities. This growth creates exciting opportunities for students to contribute to the future of semiconductor technology while working in a highly collaborative, data-driven manufacturing environment. The High Volume Manufacturing Process Engineer Intern supports process optimization, yield improvement, throughput enhancement, cost reduction, and issue resolution within a manufacturing area. This role partners closely with equipment engineering, operations teams, process owners, and cross-functional stakeholders to improve process performance and achieve key manufacturing objectives. Responsibilities Drive process optimization and manufacturing efficiency initiatives by monitoring process performance, analyzing data, and supporting area throughput and wafer output goals. Identify, troubleshoot, and resolve process issues that could result in yield loss, defects, equipment restrictions, excursions, or production impacts, escalating concerns when necessary. Apply SPC, FDC, Design of Experiments (DOE), and structured problem-solving methodologies, including 8D, to improve process capability and equipment performance. Partner with process owners, operations teams, and engineering stakeholders to address chronic process issues and support continuous improvement initiatives. Leverage Artificial Intelligence and data a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Staff Engineer in Micron’s HBM Product Engineering Component Validation team, you will be an individual contributor responsible for the validation of advanced High Bandwidth Memory (HBM) products. You will use proven knowledge in dynamic random-access memory and high-bandwidth memory architecture to compose validation coverage, implement and analyze validation runs, lead product debug and failure analysis toward a zero-escape validation goal across test modes and product achievements. You will also adopt AI-enabled ways of working, using enterprise AI tools to accelerate your engineering tasks and improve efficiency, work within Micron’s global validation organization and collaborate with groups at different locations. Responsibilities: Translate DRAM/HBM develop intent and architecture into effective verification scope and test cases. Contribute to validation of new and high-risk product features, working with Design Validation, and Systems Engineering. Review design specifications, schematics, and datasheets, provide design feedback and represent the Product Engineering perspective in Design and Verification reviews. Read, analyze, and debug circuit blueprints to detect design-related failure mechanisms, and recommend approaches for verification and fault diagnosis. Perform root-cause analysis and examination of electrical failures (debug) of validation findings, distinguishing developed marginality from process and test-related issues. Apply automation and modern tooling (including

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Vice President, Boise Front End Manufacturing Operations Location: Boise, Idaho Reports To: Senior Vice President, Global Front End Operations Position Summary Reporting to the Senior Vice President of Global Front End Operations, the Vice President, Boise Front End Manufacturing Operations is responsible for the overall leadership, performance, and strategic direction of Micron's Boise front-end manufacturing operations. This leader owns the safe, efficient, and predictable execution of all manufacturing activities while ensuring alignment with company objectives, technology roadmaps, customer requirements, and long-term capacity strategies. The Vice President serves as the senior operational leader for Boise manufacturing and is accountable for operational excellence across safety, quality, yield, cycle time, cost, delivery, workforce capability, and capacity utilization. As a member of the Global Front End Operations Leadership Team, the VP partners closely with Technology Development, Engineering, Business Units, Supply Chain, Procurement, Facilities, Quality, Finance, Human Resources, and peer manufacturing sites to drive world-class manufacturing performance and enterprise-wide outcomes. This leader will play a critical role in shaping the future of advanced semiconductor manufacturing through the deployment of next-generation technologies, automation, digital manufacturing capabilities, AI-enabled operations, and large-scale capacity expansions. Key Responsibilities<

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron has an opening for a Photolithography Engineer (Level 2 or 3) at our Boise, Idaho facility. This position is part of Micron’s Technology Development organization, where advanced ideas become manufacturable technologies. Our team works at the leading edge of memory innovation, partnering across design, integration, manufacturing, and equipment suppliers to enable the next generation of semiconductor devices. This is where curiosity, experimentation, and impact come together. As a Photolithography Engineer, you will play a key role in developing and integrating lithography processes that directly shape future memory technologies. You will work hands-on with tools, materials, layouts, and data, while leveraging Artificial Intelligence and other software, collaborating with global partners to move innovations from R&D into high-volume manufacturing. This role offers broad technical exposure and the opportunity to influence device performance, yield, and cost at scale. Responsibilities: Develop and integrate photolithography unit processes for advanced memory technologies Perform material evaluations, reticle, and layout development, OPC, overlay optimization, and process window analysis Drive yield improvement, failure analysis, and device performance optimization Partner with equipment vendors to evaluate tools and improve process capability Document processes, communicate results, and support technology transfer to manufacturing Leverage Artifi

Leidos is seeking a Test and Integration Engineer to lead cutting-edge testing and validation efforts within the Undersea Systems Division (USD) . This role is a unique opportunity to drive innovation in testing underwater vehicle systems, maritime sensors, subsea telemetry, and ISR solutions that support critical defense and national security missions. You'll contribute to a multidisciplinary team focused on testing, integrating, and validating advanced maritime technologies, ensuring system reliability and performance from prototype design to full-scale system deployment for ongoing Navy missions. Leidos’ Undersea Systems Division is a recognized leader in C4ISR technologies, delivering innovative, mission-critical solutions across sensor networks, unmanned systems, and tactical platforms . We’re known for achieving “industry firsts” in the most challenging maritime domains. Join us and be part of a world-class team delivering unmatched solutions for today's most pressing maritime missions. Why Join Us? Make an Impact : Your work will directly support U.S. maritime dominance and national security. Lead Innovation : Be at the forefront of applying innovative technology and autonomy to real-world maritime systems. Work with Experts : Collaborate with a top-tier team of engineers, scientists, and technicians located across the U.S. Shape the Future : Influence both the strategic and tactical direction of next-generation subsea technologies. What You’ll Do Test and Validate: Write, develop and execute comprehensive test plans, procedures, and protocols to ensure system functionality, reliability, and compliance with requirements. Integrate systems and conduct hands-on testing: Write, develop, and execute integration plans to bring complex systems together. Perform field</b