Advanced Cmos Device And Process Integration Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron Technology is seeking a highly motivated and proactive individual to join our team as an Advanced CMOS Device & Process Integration Engineer. This is a unique opportunity to work with a world-class company that is at the forefront of memory and storage solutions. As an Advanced CMOS Device & Process Integration Engineer, you will play a crucial role in the development of current and future CMOS technology. You will be responsible for device and process integration and development, working closely with teams across the organization including Process, Circuit, Design, Layout, Product Engineering, and Modeling/TCAD. Your expertise will be vital in establishing advanced CMOS devices and bringing them to high volume manufacturing. Responsibilities include, but not limited to: Collaborate with your peers to develop and implement our roadmap, ensuring alignment with our goals. Provide support to improve the performance and cost efficiency of our device portfolio. Conduct and analyze silicon experiments for future device generations. Validate transistor models and implement corrective actions as needed. Define electrical test structures, design rule verification, and process monitoring. Foster a collaborative working style and team spirit. In order to excel in this position, a solid understanding of standard CMOS Transistor Physics an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the CMOS Device Integration Team at Micron, where we push the limits of memory technology every day. We work at the intersection of device physics, process integration, and product performance to enable the next wave of DRAM, HBM, and Compute-in-Memory innovation. If you’re excited by challenging technical problems and real-world impact, you’ll feel right at home here! In this role, you’ll serve as a technical leader shaping the future of Micron’s most advanced memory products. As a Distinguished Member of Technical Staff, you’ll drive CMOS device and module development that directly impacts array efficiency, data rates, and product scalability. Your expertise and influence will help guide technology decisions that power AI, high-performance computing, and emerging applications. Responsibilities: Develop and integrate advanced CMOS devices for next-generation DRAM, HBM, and emerging memory architectures Perform detailed electrical characterization of CMOS devices and circuits to drive performance improvements Partner with Design, TCAD, Modeling, Process, Reliability, and Layout teams to deliver integrated technology solutions Provide technical leadership, strategic recommendations, and clear presentations to guide technology direction Minimum Qualifications: Master’s degree or PhD in Electrical Engineering or equivalent practical experience 10 or more years of hands-on experience in advanced CMOS device design and/or integration 1

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Additional Responsibilities Align TDT CMOS Device development and transfer objectives with Technology Development sites. Drive and ensure close collaboration with Design, TCAD, Modeling, and Product Engineering groups across Micron sites. Collaborate with process integration module owners and process owners to drive electrical characterization of CMOS devices and CMOS circuits and identify device improvement opportunities. Utilize technology development and transfer knowledge to develop new technology nodes to mature manufacturing capability while achieving key program metrics. Ensure CMOS devices meet electrical, performance, power, variability, and reliability targets required for product success. Drive close collaboration with device and process integration development groups at other Technology Development sites. Collaborate closely with manufacturing fabs to facilitate successful technology transfer and production ramp. Contribute to the fundamental understanding of CMOS technology and its impact on overall product figures of merit. Lead cross-functional exploration and development of future CMOS device architectures, including non-planar transistor technologies, by partnering with Device, TCAD, Process Integration, Design, and Manufacturing teams to enable future DRAM technology roadmaps. Drive adoption of AI, machine learning, advanced analytics, and engineering automation solutions to accelerate technology development, r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all . As a team member of technology development reliability group, you will be working with DRAM device/process development team and circuit design team. You will be responsible for analyzing reliability performance of hot carrier, bias temperature instability, electromigration etc. for each cell transistor, high performance CMOS and advanced interconnect. Also, you will be responsible for reliability model building and the consultation from device development team and circuit design team. The reliability is one of the important pillar for device scaling and state of the art technology development. Its work is based on understanding the semiconductor device physics, DRAM architecture knowledge, DRAM process integration knowledge. For the new reliability findings during the technology development phase, to point in the right direction is required. Responsibilities and Tasks: Develop and implement test methodologies to evaluate wafer-level & circuit-level reliability behavior and performance. Analyze results and create reports to deliver decision-ready, actionable recommendations for guiding technology development. Collaborate with Process Integration and characterization teams to correlate reliability signature with process conversions and parametric test data. Integrate other data sources (inline metro, param,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, Inc., you will join a team responsible for bringing next-generation High Bandwidth Memory (HBM) products from design through high-volume manufacturing. This role plays a critical part in improving product reliability, accelerating production ramp, and enabling early time-to-market through advanced failure analysis. You will focus on analyzing failures from production test, internal qualification, and customer returns (RMA), using a combination of electrical, physical, and data-driven techniques to identify root causes related to fabrication or assembly processes. Key Responsibilities Perform electrical failure analysis and fault isolation using techniques such as emission microscopy, laser-based methods, and EOTPR. Analyze and model failure signatures from backend testing, qualification, and RMA data. Apply physical failure analysis (PFA) and de-processing techniques to isolate defects. Develop and maintain deep technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration. Generate clear, organized, and timely failure analysis reports, including root cause and corrective action insights. Collaborate multi-functionally with Product, Process, Assembly, Quality, and Management teams to communicate findings and drive resolution. Apply AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination. Support flexible work sch

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for designing and analyzing digital and analog circuits used in the development of memory products. Engage in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. Collaborate with various internal design and verification teams all over the world and support the efforts of groups, including Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsible for power delivery network evaluation and optimization of DRAM designs, as well as design and optimization block level power generators. Utilize both analog and digital CMOS design skills to work on the analog circuits. Responsible for working with Product Engineering to verify silicon performance vs simulation performance of circuits you design. Work with Process integration and transistor modeling personnel in designing the circuits to be used on Micron's next groundbreaking process node. Review product requirements and logic diagrams for device definition. Responsible for projects, or portions of projects, to design, fabricate, modify, and evaluate semiconductor devices and components. Employer will accept a Bachelor's degree in Computer Engineering, Electrical Engineering, Electronics Engineering, or related field, followed by fi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Role and Responsibilities Responsible for Design and development of critical analog, mixed-signal, custom digital block, and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and support documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Demonstrate leadership skills in planning, area/time estimation, scheduling, and execution to meet project scheduling multiple project environment. Contribute to effective project-management. Effectively communicating with Global engineering teams to assure the success of layout project. Qualification/Requirements 8 to 15 years' experience in analog/custom layout build in advanced CMOS process, in various technology nodes (Planar, FinFET ) Expertise in Cadence VLE/VXL and Mentor Graphic Calibre DRC/LVS is a must. Should have hands on experience in creating layout of critical blocks such as Temperature sensor, PLL, ADC, DAC, LDO, Bandgap, Ref Generators, Charge Pump, Current Mirrors, Comparator, Differential Amplifier etc., Good understanding of Analog Layout fundamentals (e.cg., Matching, Electro-migration, Latch-up, coupling, crosstalk, IR-drop, active and passive static device parasitics etc.) Understanding layout effects on the circuit such as speed, capacitance, power and area etc. Ability to understand build constraints and implement high-

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Staff Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Senior Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and contributes to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Utilize AI-Enabled tools to assist with schematic editing, data collection and layout floorplan. Create optimized floorplans for circuit placement, routing, power delivery, sense margins, array timing, and die size, including layout leadership. Conduct circuit simulations using FINESIM, HSPICE, and VERILOG; analyze power, performance, reliability, and parasitic impacts. Validate builds through reticle experiments, tape‑out revisions, and simulation‑to‑silicon correlation, identifying required schematic edits. Prepare and maintain design documentation while contributing to best‑known practices and departmental training. Collaborate with global build, verification, product engineering, test, probe, process integration, assembly, and marketing teams to ensure manufacturability and quality. <

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. What’s Encouraged Daily: Contribute to the development of new HBM products by assisting with the overall design, and layout . • Interpret product specifications and design circuits to meet the required functionality. • Design, implementation, and improvement of Complex Analog Mixed Circuits such as CMOS Amplifiers, Comparators, Bandgap references, V2I converters, LDOs, charge pumps, Oscillators, DLL, IO circuits (DDR/LPDDR), Delays, Process and temperature sensors in advanced semiconductor process nodes for advanced High Bandwidth Memory (HBM) products • Integration of modules with Power delivery network and propose design solution for optimum performance • Deep understanding of Array and its peripheral circuits. • Driving innovation into the future Memory generations within a dynamic work environment • Validate & optimize design for reliability (Device stress, Aging effect) • EM/IR simulation, optimize layout to achieve best circuit performance • Custom digital circuit design & validation • Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions • Overseeing and managing the layout process including floor-planning, placement, and routing • Performing verification processes with modeling and simulation using industry standard simulators • Contributing to cross group communication to work towards standardization and group success • Working wit

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a E5/MTS/SMTS NAND Design Rule / Process Integration engineer, your role is to support the development and high-volume manufacturing of advanced 3D NAND technologies. This role drives design-rule and PDK deliverables, partners closely across process integration and design organizations, and ensures quality, documentation, and timely execution across R&D and production programs. Lead the release of design rules and PDK deliverables; manage DRC waivers, mask definitions, and mask reviews for both R&D and production designs. Own program execution and milestones from kickoff through end-of-life. Partner with stakeholders across Array & CMOS Process Integration, Devices, Layout & Design, Modeling, Scribe & Frame, unit process areas (e.g., PHOTO/OPC/CMP), and Quality & Reliability to guide new 3D NAND generations. Ensure high quality and documentation for Design Rule Checks (DRCs) and drive timely disposition of deviations and exceptions. Collaborate with Yield Enhancement, Product Engineering, Defect Analysis, and Quality Assurance to identify layout- or database-related process issues and prioritize corrective actions. Design and evaluate test structures to generate data for next-generation devices and to assess process margin on

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Act as a module owner to conduct root cause investigations and failure analysis in time-sensitive environments. Drive improvements in yield, cost efficiency, and quality. Run Design of Experiments (DOE) to enhance process capability and margin. Monitor trends and sustain line stability. Address top detractors to improve device yield and reliability. Lead workshops during technology transfer for next-generation devices. Start up, develop, and optimize processes for product quality and reliability. Identify and resolve process-related issues using FMEA, 8D, SPC/FDC methodologies. Coordinate and execute process, equipment, and material evaluations. Validate and qualify new processes, tools, and materials for new product introduction. Manage and audit material suppliers to meet quality, cost, and risk objectives. Support internal and external audits. Be willing to travel internationally for 3&#43; months for tech transfer/training. Be prepared to work a shifted schedule as required. Required Qualifications Bachelor’s degree in Materials Science, Electrical, Electronics, Chemical, or related engineering fields. Basic understanding of MOSFET and DRAM operation. Knowledge of CMOS and characterization methods. Familiarity with DOE, SPC, and JMP. Ability to support SPC/FDC/RMS/APC systems and site-to-site portability. Preferred Qualifications Internship experience in a 300mm semicondu

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities Understand NAND device operation, reliability tests, product qualification, and performance/reliability requirements. Drive process and device technology development to meet performance and reliability specs within project timelines. Design process experiments, segment problems clearly, and analyze data using device physics understanding. Develop and utilize artificial intelligence (AI) tools to enable faster cycles of learning to advance NAND device capability and drive new solution. Extract and analyze inline, probe, parametric, and reliability data. Lead cross-functional teams to address device/array deficiencies across design, process, and device teams. Apply project management skills to small projects or parts of larger projects. Collaborate with product engineering, TCAD, and process integration teams to improve characterization and define structural specs. Provide regular project status, outlook, problem summaries, actions, and deliverable timelines to global cell and management teams. Required Knowledge and Skills Strong understanding of semiconductor device physics, CMOS fundamentals, and memory device operation. Knowledge of semiconductor process

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Join Micron, where your knowledge will influence the future of memory technology! As the Manager for NAND Design Rule/Process Integration, you will lead a talented team to support both development and large-scale production of advanced 3D NAND technologies. This position is essential for producing accurate design-rule and PDK results, ensuring high quality, and maintaining strict documentation across R&D and production efforts. Responsibilities: Lead the release of design rules and PDK deliverables; coordinate DRC waivers, mask definitions, and mask reviews for both R&D and production developments. Own program execution and achievements from kickoff through end-of-life. Partner with collaborators across Array & CMOS Process Integration, Devices, Layout & Build, Modeling, Scribe & Frame, unit process areas (e.g., PHOTO/OPC/CMP), and Quality & Reliability to guide new 3D NAND generations. Ensure high quality and documentation for Build Rule Checks (DRCs) and drive timely disposition of deviations and exceptions. Collaborate with Yield Improvement, Product Engineering, Defect Analysis, and Quality Assurance to identify layout- or database-related process issues and prioritize corrective actions. Build and evaluate te