Advanced Dram Process Integration Engineer Jobs

Advanced Technology Japan Engineer, CMP process — Hiroshima - Fab 15, Japan. Apply via Workday.

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities and Tasks: • Accountable and sustain for Bond process. • Backup for Debond area process basic maintenance. • Establish and improve process condition and technology. • Upgrade tool capability and improve product quality. • Establish and modify process management projects. • Set up process parameters for a variety of semiconductor equipment. • Evaluation, promotion and planning of new equipment / materials. • Abnormal analysis and improvement. • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization. Qualifications and Skills • Experience in wafer bonding, debonding, coating, lithography, thin film, or advanced packaging processes is preferred. ​ • Establish and improve process condition and technology.​ • Upgrade tool capability and improve product quality.​ • Establish and modify process management projects.​ • Set up process parameters for a variety of semiconductor equipment. ​• Evaluation, promotion and planning of new equipment / materials. ​• Abnormal analysis and improvement.​ • Leveraging AI and data analytics tools to enhance process monitoring, root cause analysis, predictive maintenance, and process optimization for semiconductor manufacturing operations. Requirement:​

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Micron’s Chemistry Lab plays a critical role in advancing semiconductor technology by developing analytical methods that support materials understanding, process development, defect characterization, and next-generation memory innovation. The team applies advanced chemical, optical, and surface characterization techniques to solve complex materials challenges across semiconductor manufacturing and research. We are seeking a highly motivated summer intern to contribute to advanced spectroscopy and nanoscale characterization projects focused on semiconductor thin films, surfaces, interfaces, and process-induced material changes. Working alongside scientists and engineers in Corporate Labs, the intern will develop and apply spectroscopy-based characterization methods, analyze complex materials datasets, and gain experience in experimental design, data analytics, and semiconductor materials research within an industrial laboratory environment. Responsibilities Conduct experiments using advanced spectroscopy and microscopy techniques to characterize semiconductor thin films, surfaces, interfaces, and related materials. Collect, process, analyze, and interpret spectroscopy data, including photoluminescence, fluorescence lifetime, Raman, and AFM-IR datasets, and develop visualization workflows to communicate results. Correlate spectroscopic signatures with material properties, process conditions, surface states, and defect behavior while colla

Work Flexibility: Onsite Stryker is seeking a Staff Advanced Manufacturing, Automation/Software Engineer to join our Advanced Operations team, supporting the Medical Division - Acute Care Business Unit. In this role, you will lead the design, development, and deployment of advanced automation and production test systems for new product introductions. This role is critical to ensuring reliable, scalable, and compliant manufacturing for patient support and patient environment products. You will serve as both a technical owner and a supplier-facing leader, architecting systems internally while guiding external partners to deliver high‑quality automation solutions. You will have the opportunity to work on the design transfer of new products from research through development and into production. This is a hybrid role based out of Portage, MI. The team works onsite 4-5 days per week to support collaboration and project needs. What you will do: Automation System Architecture & Development Lead the full lifecycle of industrial automation and test systems from requirements, architecture, and design through implementation, validation, and release. Define system-level requirements encompassing mechanical, electrical, software, controls, and safety considerations. Develop and integrate control software, embedded interfaces, test sequences, and operator interfaces (HMI/SCADA). Ensure robust performance, maintainability, reliability, and alignment with design intent and manufacturing needs. Troubleshoot complex processes, software, and equipment issues; optimize system performance and uptime. Supplier & Equipment Vendor Leadership Manage automation and equipment suppliers, including capability assessments, technical reviews, process monitoring, and on‑site visits. Create clear, comprehensive

F15 Advanced Technology Japan PI Device Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

Postdoc - Advanced Modeling and AI Solutions — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Senior Advanced Packaging Material Category Supplier Manager (HBM) — Taichung - MTB, Taiwan. Apply via Workday.

HBM Advanced Package Process / Equipment Engineer — Taichung - MTB, Taiwan. Apply via Workday.

Chief Engineer - Patriot Advanced Capability (PAC-3) Company: The Boeing Company Boeing Defense, Space & Security (BDS) is searching for an inspiring and visionary Chief Engineer to lead groundbreaking engineering transformation for the PAC-3 Acceleration Efforts in Huntsville, AL . This pivotal role offers a unique opportunity to be at the forefront of accelerating production rates by driving innovative design for manufacturability and testability, optimizing production systems, and pioneering advanced engineering solutions that empower high-rate manufacturing success. As production demands soar, you will be the catalyst transforming engineering processes and production capabilities—ensuring we not only meet ambitious acceleration targets but also uphold Boeing’s renowned standards of quality and technical excellence. The Chief Engineer will serve as a strategic technical leader, spearheading engineering changes essential to unlocking higher production rates. You will collaborate seamlessly with engineering, manufacturing, quality, supply chain, and production teams to enhance product designs and processes geared toward efficiency, scalability, and continuous improvement. Position Responsibilities: Lead and champion engineering transformation initiatives to significantly accelerate PAC-3 production rates Drive and embed design for manufacturability (DFM), design for testability (DFT), and design for assembly (DFA) practices that enable smooth, high-rate production Partner closely with manufacturing and production teams to innovate and implement enhancements in production systems, tooling,

The pay range is $132,000.00 - $238,000.00 Pay is based on several factors which vary based on position. These include labor markets and in some instances may include education, work experience and certifications. In addition to your pay, Target cares about and invests in you as a team member, so that you can take care of yourself and your family. Target offers eligible team members and their dependents comprehensive health benefits and programs, which may include medical, vision, dental, life insurance and more, to help you and your family take care of your whole selves. Other benefits for eligible team members include 401(k), employee discount, short term disability, long term disability, paid sick leave, paid national holidays, and paid vacation. Find competitive benefits from financial and education to well-being and beyond at https://corporate.target.com/careers/benefits . JOIN TARGET AS A LEAD FULL STACK ENGINEER - ADVANCED AI About us: Working at Target means helping all families discover the joy of everyday life. We bring that vision to life through our values and culture. Learn more about Target here . About the role Target’s Advanced AI team

Work Flexibility: Hybrid Job Description Lead Process Development Engineer (Senior Staff) Location: Carrigtwohill, Ireland Work Arrangement: Hybrid Join Stryker's NPI team and play a key role in developing the advanced manufacturing processes used to produce precision surgical blades that support knee replacement procedures. As a senior technical contributor, you will lead end-to-end process development activities, working directly with industrial laser welding, CNC equipment, and validation methodologies to create robust, scalable manufacturing solutions . This role combines hands-on engineering, technical leadership, and innovation to bring new manufacturing technologies from concept to production. Characterise, develop, and optimise manufacturing processes through hands-on testing, analysis, and process experimentation. What You Will Do Lead engineering projects by defining technical objectives, determining project direction, and driving successful outcomes. Lead capital equipment acquisition activities including equipment specification, supplier engagement, installation, and validation. Develop, characterise, and optimise manufacturing processes through hands-on testing, analysis, and process experimentation. Provide engineering support for new product and process introductions in accordance with established product development procedures. Ensure manufacturing processes meet product, quality, regulatory, and operational requirements. Participate in Process Failure Mode and Effects Analysis (PFMEA), Control Plans, Standard Operating Procedures (SOPs), and Production Part Approval Process (PPAP) activities. Review and approve validation documentation and support

POSITION: CONSULTANT OPHTHALMOLOGY - Vitreo-Retinal Surgeon QUALIFICATION: MS/DNB/DIPLOMA IN OPHTHALMOLOGY PREFERABLY POST PG LONG TERM FELLOWSHIP IN ANY SUB SPECIALTY EXPERIENCE: 1+ YEAR WITH GOOD SURGICAL SKILLS SALARY BUDGET: NEGOTIABLE - Best in the Industry LOCATION: ROHTAK, HARYANA, APPROX 60 KMS FROM DELHI HOSPITAL: A WELL ESTABLISHED ADVANCED EYE CARE HOSPITAL IN ROHTAK, HARYANA APPROX 60 KMS FROM DELHI STATE OF ART INFRASTRUCTURE, LATEST MACHINERY & EQUIPMENT AND MOST MODERN TECHNOLOGY. THE HOSPITAL IS RUN BY A SEASONED MEDICAL PROFESSIONAL AND SUCCESSFULLY RUNNING FOR THE LAST 40+ YEARS. Interested candidates are requested to send us your cv on recruiterdoctors at the rate gmail.com. If spouse is a medico, please send us both CVs. If not interested, please help us with suitable references and share this job in your group. You can share your cv with us for future reference or for your preferred locations jobs also. Please note that we donot charge any type of fee from the candidates, it is absolutely free service. Regards, Team Doctors Recruiter Chandigarh

Senior Systems Software Engineer - Advanced Technology Group — US, OR, Hillsboro. Apply via Workday.

Director - Foundry Advanced Packaging Business Development — US, California, Santa Clara. Apply via Workday.