Advanced Engineering And Manufacturing Internship Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. • Leverage AI-enabled and AI-assisted work methods, including Microsoft Copilot, Generative AI, and advanced analytics tools, to improve equipment utilization, yield performance, alarm code analysis, parts lifetime prediction, and manufacturing efficiency . • Utilize AI-powered data analysis to identify equipment performance gaps, predict equipment failures, optimize preventive maintenance strategies, and reduce unplanned downtime. • Apply AI-assisted troubleshooting techniques to accelerate root cause analysis of equipment alarms, process excursions, and yield loss mechanisms. • Familiar with TCB/DB process and possesses a minimum of 5 years of semiconductor equipment engineering experience . • Identify, diagnose, and resolve assembly equipment related issues utilizing data-driven and AI-supported methodologies. • Coordi nate and execute process, equipment, and material evaluations, leveraging AI insights to optimize manufacturing performance and quality. • Lead and participate in utilization improvement, yield enhancement, cost reduction, and smart manufacturing initiatives through automation and AI technologies. • Validate and qualify new processes

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are at the heart of advanced DRAM node development, driving innovations from concept to high-volume production. Our team partners closely across Technology Development, Design, Quality, and Manufacturing to bring innovative memory technologies to life. If you’re excited about translating breakthrough ideas into real-world impact, you’ll find this work both challenging and rewarding. As a High Volume Manufacturing (HVM) Node Development Product Engineer, you will play a central role in introducing new DRAM nodes into production at the ID1 fab. This role connects development to manufacturing—owning yield ramp, cost efficiency, and quality improvements. You’ll collaborate cross-functionally to solve complex problems, improve product performance, and ensure successful technology transfer at scale. Responsibilities: Lead new node startup, qualification, yield ramp, and production readiness Guide development teams on process integration using deep technical insight Analyze yield data and electrical failures to drive measurable improvements Partner with Design, TD, Quality, and Test teams to resolve yield and performance issues Use statistical tools and lab analysis to identify root causes and optimize processes Minimum Qualifications: Bachelor’s degree in Electrical Engineering, Computer Engineering, or related field Familiarity with DRAM architecture, operation, testing, and process integration Understanding of CMOS fundamentals and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Micron is the place for you to expand your caliber by working on key projects and developing the leader in you! As the Test Solutions Engineer, you will be the key project owner for Micron Nand Flash memory test programs. You will be ensuring project readiness and assessing program quality through stringent program release process. In addition, you will have the following job responsibilities: Develop and maintain wafer and package functional test strategies and programs for semiconductor NAND Flash products Collaborate with various test solutions engineering and production engineering groups to ensure test program, infrastructure and system readiness for new product introduction as well as high volume manufacturing Improve device yield, reliability and quality through test condition optimization, advanced redundancy analysis schemes, data analysis and test equipment hardware optimization Provide cost effective and innovative solutions for production test flow optimization with cutting-edge test time reduction methodologies Assist process and production teams by providing necessary engineering expertise to ensure smooth manufacturing operations Introduce innovative test time reduction solutions and release test pro

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metro Real-time Defect Analysis (RDA) Process & Equipment Engineer, you will be responsible for developing, deploying, and sustaining RDA capabilities that enable robust process control and equipment performance across advanced packaging and New Product Introduction (NPI) manufacturing environments. You will focus on integrating process knowledge, equipment behavior, and automation intelligence to improve tool stability, detect early signals of risk, and accelerate learning during NPI, pilot, and ramp phases. This role serves as a critical link between Process Engineering, Equipment Engineering, NPI teams, and RDA, ensuring monitoring strategies are technically sound, actionable, and scalable to high-volume manufacturing (HVM). You will work closely with Site and Global RDA, Process, Equipment, Automation, and IT teams to drive continuous improvement in equipment capability, process robustness, and manufacturing readiness. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Boise Expansion Team is at the forefront of Micron’s historic growth as we invest in leading-edge semiconductor manufacturing and build the future of memory and storage technology. Our Yield Analysis organization plays a critical role in delivering world-class product quality, accelerating yield ramps, and driving operational excellence. We are looking for collaborative, innovative leaders who are excited to help shape the future of semiconductor manufacturing in Boise. As a Yield Analysis Manager, you will lead a team focused on improving fab yield performance through advanced analytics, structured problem solving, and cross-functional collaboration. You will drive yield improvement strategies, develop engineering talent, and leverage data, automation, and AI-enabled solutions to accelerate issue resolution and strengthen manufacturing performance across the organization. Responsibilities: Lead the Yield Analysis team to achieve fab yield and quality goals through yield deviation management, yield-tail reduction, yield ramp acceleration, and long-term yield improvement Establish and manage yield KPIs, forecasting methods, dashboards, and operating mechanisms that drive accountability and measurable business results Drive technical excellence in Model-Based Problem Solving (MBPS), root cause analysis, statistical validation, and corrective action implementation Partner with Process Integration, Process Engineering, Failure Analysis, Quality, and Manufacturing teams

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. This role is part of the Customer Engineering Technical Leadership function within HIG PSE. The Customer Integration Engineer will focus on technical engagement across product development, system architecture, develop, front-end and back-end process, Package Failure Analysis, Qualification, and Test. The successful candidate will have expertise in one of these subject areas and a strong appetite to learn others on the job. This position emphasizes hands-on technical problem-solving, working with multi-functional groups, and enabling successful integration of advanced HBM products into customer systems. AI adoptation and regular development and use is a must. Leveraging Artificial Intelligence is part of day to day operations Responsibilities: Apply deep technical knowledge across one or several domains such as product engineering, system engineering, building, front-end/back-end process, PFA, qualification, or test. Support integration of customer requirements into internal design and manufacturing processes. Participate in technical reviews, debug sessions, and failure analysis activities. Work closely with internal teams across build, product engineering, and manufacturing to resolve technical challenges. Assist in yield improvement and qualification efforts tied to customer programs. Minimum Qualifications: Bachelor’s or Master

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Design DFT team at Micron, building testability into the heart of advanced memory products. Our work spans circuit innovation, architecture, and methodology, and directly impacts quality, scalability, and manufacturability across Micron’s global portfolio. We collaborate deeply across design, verification, and manufacturing to solve hard problems early and push memory technology forward! As a Design Engineer on the Design DFT team, you play a critical role in ensuring Micron’s memory products are testable, robust, and production-ready. This role blends hands-on circuit design with architectural thinking and forward-looking methodology development. You will influence designs early, partner across disciplines, and help introduce AI-enabled approaches that shape the future of DFT. Responsibilities: Define and implement DFT, testmode, and related design methodology requirements for current and future memory products Design and evaluate new DFT circuit and architectural solutions to improve coverage, scalability, and robustness Influence early design planning by shaping DFT architecture, testability strategies, and reusable design intent Validate DFT solutions through modeling, simulation, and review of circuits, testmodes, and verification results Collaborate across design, verification, product engineering, and manufacturing to meet coverage, cost, and qualit

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s HBM design organization, building the test architectures that enable the most advanced memory products in the world. Our team works at the intersection of design, manufacturing, and silicon learning to make 3D‑stacked memory reliable at scale. We thrive on deep technical challenges and close collaboration across disciplines! As an HBM Design Architect, you will define how next‑generation HBM products are tested from wafer to system. This role is critical to ensuring quality, yield, and performance across complex multi‑die architectures. You’ll influence product success early, work hands-on with silicon, and partner closely with design, test, and manufacturing teams. Responsibilities: Define and implement end-to-end DFT architectures for HBM base die and DRAM die Develop DFT strategies for stacked-die, cube-level, and system-level test flows Architect test access mechanisms supporting wafer probe through final test Enable silicon observability for yield learning, debug, and failure analysis Collaborate across design, verification, layout, test, and manufacturing teams Minimum Qualifications: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, or related field Strong knowledge of scan, MBIST, JTAG, and boundary scan concepts Experience with wafer probe and fin

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the team committed to advancing Dry Etch processes within Micron’s R&D organization, pushing the limits of plasma etch technology to enable future memory products. We work at the intersection of physics, materials, and manufacturing to solve hard problems and move new ideas from concept to production. This is a highly collaborative environment where deep technical expertise directly shapes Micron’s technology roadmap! As an R&D Dry Etch Process Development Engineer, you will develop and optimize plasma dry etch processes for advanced memory technologies. You will take ownership from early research through pilot line execution and global process transfer. Experienced engineers in this role drive multi‑area technology roadmaps and influence Micron’s leadership in semiconductor manufacturing. Responsibilities: Develop and optimize plasma dry etch processes to meet structural and electrical requirements Drive dry etch technology roadmaps and deliver solutions for future product nodes Perform root cause defect analysis and failure mode investigations Partner with integration, yield, manufacturing, and vendors to ensure robust processes Support process transfer from R&D pilot line to global production fabs Minimum Qualifications: Bachelor’s degree in Electrical, Mechanical, Materials, Chemical Engineering, Physics, or related field with 5+ years of semiconductor experience Strong understanding of d

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are the Waferless Metrology team within Micron’s Metrology organization, supporting advanced semiconductor manufacturing using inspection guided by design software. We are a small, highly engaged group that values precision, speed, and practical problem solving. Our work directly impacts yield, cycle time, and manufacturing confidence! This role plays a key part in enabling waferless, non-contact metrology for advanced processes. You will translate design data into reliable, production-ready recipes that support both high-volume manufacturing and R&D. The work is collaborative, detail-focused, and performed onsite without cleanroom requirements. Responsibilities: Develop and validate waferless metrology recipes using CAD data Translate CAD designs into measurement locations and alignment strategies Partner with process, yield, and equipment teams to define inspection targets Automate and support recipe generation for manufacturing and R&D Analyze metrology results and resolve recipe execution issues Minimum Qualifications: Bachelor’s degree in engineering, physics, materials science, or equivalent practical experience 2+ years of experience in semiconductor metrology, process engineering, or CAD-based recipe development Experience with CAD tools and metrology platforms such as SEM or CD-SEM Strong analytical and problem-solving skills Preferred Qualifi

Job Title Physicist Job Description We are looking for a Physicist to join our Computed Tomography (CT) R&D team in Haifa, part of the DMS organization. In this role, you will contribute to the research, development, optimization, and validation of next‑generation detector technologies that power advanced CT systems. This position offers the opportunity to work at the intersection of physics, engineering, and medical imaging driving innovation that directly impacts product performance and patient outcomes. Your role: Be actively involved in the development and evaluation of CT detector concepts and components. Model and characterize key detector performance parameters, including spatial resolution, noise, dynamic range, spectral response, stability, and dose efficiency. Collaborate with system image quality teams in shaping and designing image correction algorithms. Design and execute experiments to assess detector behavior under laboratory and system-level operating conditions. Analyze imaging data and detector signals using quantitative methods to identify performance limitations and improvement opportunities. Collaborate with hardware, electronics, software, reconstruction, systems, and manufacturing teams to translate physics requirements into technical specifications. Support prototype integration, verification testing, root-cause analysis, and performance troubleshooting. Support Service and Production detection related investigations. Develop test methods, technical reports, verification protocols, and documentation for internal and regulatory use. Stay current with scientific literature, emerging detector technologies, and industry trends. You're the right fit if: MSC or PhD in Physics, with a strong advantage for experimental Physics. Hands on experimen

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop and optimize end-to-end process integration flows for silicon photonics technologies from concept throug

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are seeking experienced engineers for Principal, MTS, and SMTS roles. The level at which candidates are hired will be determined by their years of experience, demonstrated technical depth, and overall qualifications Principal Photonics Integration Engineer The Advanced Packaging Technology Development (APTD) team is shaping the future of memory, storage, and photonics technologies that power AI, high-performance computing, and next-generation data infrastructure. We collaborate across research, device, process, packaging, and manufacturing organizations to develop innovative solutions that move quickly from concept to production. Join a team where technical challenges are complex, innovation is constant, and your work will directly influence Micron's technology roadmap. As a Principal Photonics Integration Engineer, you will lead the development and integration of silicon photonics and heterogeneous integration technologies that enable high-performance optical connectivity solutions. This role combines process integration, advanced packaging, device development, and program leadership to bring new technologies from concept through manufacturing readiness. You will work across multidisciplinary teams to solve complex technical challenges while employing AI-enabled engineering tools to accelerate development and improve decision-making. Responsibilities: Develop an

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Technology Development organization, driving next-generation DRAM through advanced photolithography process development. Our team operates at the center of innovation, enabling rapid learning cycles and continuous process improvement in a fast-paced, 24/7 development environment. We value strong execution, collaboration, and building future technical leaders! This role combines people leadership, operations ownership, and deep photolithography expertise. You will lead a team across shifts, guide development execution, and remove barriers to accelerate technology learning. The position offers strong ownership, visibility, and direct impact on Micron’s technology roadmap. Responsibilities: Lead photolithography development execution and ensure high-quality wafer flow and data Manage and develop engineers across shifts through coaching and mentoring Drive operational performance including cycle time, tool readiness, and execution efficiency Partner with integration, process, and manufacturing teams to resolve issues Apply AI-Enabled approaches to improve decision making and development efficiency Minimum Qualifications: Bachelor’s degree in engineering or equivalent semiconductor experience Experience in photolithography process development and imaging fundamentals Demonstrated leadership in a technical or manufacturing environment Strong problem-solving and comm

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are transforming how the world uses information to enrich life for all. Within our DRAM organization, we develop next-generation memory technologies in an industry-leading 300mm R&D environment, bringing together expertise across process development, design, modeling, characterization, reliability, and manufacturing. Our team works collaboratively to advance memory scaling while improving performance and manufacturability. As a Process Integration Engineer, you will help enable state-of-the-art DRAM technologies and solve complex integration, device, yield, and circuit challenges. You will work closely with cross-functional engineering teams to optimize process flows, improve yield and margin, and translate technical data into solutions that enable future generations of memory technology. Responsibilities: Lead technology integration activities to enable manufacturability of advanced DRAM technologies Partner with process development, product engineering, design, yield, mask, and probe teams to resolve yield, performance, reliability, and margin challenges Design and implement R&D fab experiments and optimize process flows to meet product and technology requirements Analyze inline, defect, parametric