Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The CVD Central Process and Equipment Engineering (CPEE) High Volume Manufacturing organization is seeking a highly motivated engineer to drive manufacturing excellence, equipment performance, and network-wide productivity across Micron's global semiconductor fabrication facilities. This role is responsible for developing and executing manufacturing strategies that improve equipment capability, factory output, cost competitiveness, and technology readiness while leveraging advanced analytics, digital manufacturing solutions, and AI-enabled tools to accelerate decision making and operational improvements. The successful candidate will work closely with global manufacturing teams, technology development organizations, and strategic equipment suppliers to define long-term equipment and manufacturing roadmaps, identify future capability requirements, and accelerate deployment of innovative solutions across the Micron network. This position provides a unique opportunity to influence manufacturing strategy, shape supplier development priorities, and drive competitive advantage through advanced equipment and manufacturing solutions. Strategic Manufacturing & Supplier Leadership Develop and drive long-term manufacturing and equipment capability roadmaps to support future technology requirements, capacity expansion, and factory competitiveness. Partner with strategic equipment suppliers to define and influence next-generation hardware, software, automation, and process capab
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Work Flexibility: Hybrid I am delighted to share that we are now accepting applications for our Stryker Advanced Operations (AO) Global Engineering Development Programme (AOGEDP) – to begin in September 2027. If you are an upcoming or recent graduate in a Level 8 or above Engineering, Software or Digital discipline-based Degree, then this is the opportunity for you! Advanced Operations (AO) is Stryker’s function that specialises in new product introductions across all of our divisions. The “ AO Global Engineering Development Programme ” is a 2 0 - month structured programme that provides participants the opportunity to be part of a global team, with exposure to cutting edge technology varying from traditional manufacturing processes to a dditive manufacturing and Robotics, as well as interactions with market leading Product Development , Quality Assurance and Operations teams from across the 9 Stryker divisions. The programme focuses on developing the skillset s , mindset and toolkit of each participant to enable them for success within Advanced Operations to
Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of
About the job Own the manufacturing performance behind advanced AI compute systems in volume production. As, Senior Manufacturing Product Engineer you will connect product design, test, quality and supply chain with manufacturing execution. You will support volume production across PCB assembly with our build partners in Taiwan. Your work will improve yield, quality and manufacturability across complex products. You will link manufacturing process performance to the product metrics that matter most. You will manage partner engineering relationships, resolve manufacturing issues and drive continuous improvement. You will also shape DfM feedback, production data requirements and next generation manufacturing technologies. This role suits someone who combines practical manufacturing judgement with strong data thinking. You will work close to suppliers, product teams and the decisions that shape production outcomes. The team and culture You will join the Manufacturing and Technology Process team within Operations. The team works across Bristol, Cambridge and Taiwan, close to wafer foundry, package assembly and PCBA subcontractors. Work happens through direct ownership at partner sites and clear technical engagement with internal teams. You will move quickly on production issues, using data and engineering judgement to guide action. The team values people who speak up, take responsibility and build strong supplier relationships. Decisions are grounded in evidence, product impact and the need to keep manufacturing improving. What we're looking for · Strong fault diagnosis, problem solving and failure analysis skills, including ICT to SMT debug · Thorough understanding of automated SMT assembly processes and lean manufacturing methodologies · Working knowledge of L10 mechanical design and system build, ideally for HPC products · Experienced in statistical analysis tools (e.g JMP, SQL, Python) · Ability to connect silicon, package and PCB interactions into clear DfM
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department Photolithography Engineering Project Title Large-Scale Photolithography Software Stack Integration Project Description Photolithography is one of the most software-intensive and technologically advanced manufacturing processes in semiconductor manufacturing. Maintaining world-class performance requires an integrated software ecosystem spanning process control, equipment connectivity, data engineering, automation, visualization, machine learning, and decision-support systems. As an intern within the Photolithography Engineering team, you will collaborate with process, equipment, data, and manufacturing engineers to design and develop software solutions that transform large-scale manufacturing data into actionable insights and automated engineering workflows. Project assignments will be tailored to individual strengths, academic background, and learning interests, providing opportunities to contribute across software engineering, data engineering, system integration, analytics, and Artificial Intelligence domains. Where relevant, the project will incorporate AI-Enabled development approaches, Generative AI, Artificial Intelligence, AI Assistants, Agentic AI technologies, and Agen
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron's Boise R&D site, the DRAM Technology Development organization drives innovation in next-generation memory solutions. The team develops advanced DRAM cell architectures, access devices, materials systems, and integration technologies that enable future scaling, improved performance, enhanced reliability, and manufacturing readiness. Engineers work across device, materials, process integration, modeling, design, and product engineering teams to bring groundbreaking memory technologies from concept to production. As an intern in the Advanced DRAM Device & Cell Technology team, you will contribute to the development and characterization of future DRAM cell and access device technologies through experimental studies, data analysis, and collaboration with multidisciplinary engineering teams. This position combines semiconductor device physics, materials engineering, silicon experimentation, electrical characterization, and data-driven decision making to improve cell performance, density, retention, reliability, and manufacturability. The successful candidate will collaborate with multi-functional teams to evaluate novel materials, device architectures, and integration schemes supporting future memory technology development. Responsibilities Support the evaluation of DRAM access devices, capacitors, and cell stack elements through characterization, data analysis, and assessment of new device architectures, materials systems, and integration schemes. Design and implement
Manufacturing Engineer (Associate or Experienced) Company: The Boeing Company Boeing Defense, Space & Security (BDS) Laser and Electro-Optical Systems (LEOS) site is seeking an Experienced Manufacturing Engineer for our advanced development and production manufacturing team located in Albuquerque, NM. The Boeing Laser and Electro-Optical systems (LEOS) group works to develop and implement next-generation technologies and products serving a variety of commercial and military customers. Our team focuses on rapid prototyping and precision production of advanced laser and electro-optical systems that satisfy challenging product performance requirements built in accordance with aerospace (AS9100) quality standards. Position Responsibilities: Design, develop and optimize manufacturing processes and tooling approaches for complex electro-optical aerospace parts and assemblies Collaborate with design engineers to ensure manufacturability and cost-effective production Review engineering drawings and provide comments to responsible engineer Participate in Integrated Product Teams (IPTs) to integrate technical solutions across multiple disciplines Participate in supplier selection and evaluation to ensure adherence to quality and delivery standards Write content for work instructions, travelers, and standard shop procedures Utilize electronic work instruction, material control and non-conformance management systems as needed to support production Ensure compliance with aerospace industry quality standards (e.g., AS9100, J-STD) Ensure the manufacturing work instructions and special processes follow safety and environmental regulations Assist in shop layout and
Manufacturing Engineer (Experienced, Lead or Senior) Company: The Boeing Company Boeing Defense, Space & Security (BDS) Laser and Electro-Optical Systems (LEOS) site is seeking a Manufacturing Engineer (Experienced, Lead, or Senior) for our advanced development and production manufacturing team located in Albuquerque, NM. The Boeing Laser and Electro-Optical systems (LEOS) group works to develop and implement next-generation technologies and products serving a variety of commercial and military customers. Our team focuses on rapid prototyping and precision production of advanced laser and electro-optical systems that satisfy challenging product performance requirements built in accordance with aerospace (AS9100) quality standards. Position Responsibilities: Design, develop and optimize manufacturing processes and tooling approaches for complex electro-optical aerospace parts and assemblies Collaborate with design engineers to ensure manufacturability and cost-effective production Review engineering drawings and provide comments to responsible engineer Participate in Integrated Product Teams (IPTs) to integrate technical solutions across multiple disciplines Participate in supplier selection and evaluation to ensure adherence to quality and delivery standards Write content for work instructions, travelers, and standard shop procedures Utilize electronic work instruction, material control and non-conformance management systems as needed to support production Ensure compliance with aerospace industry quality standards (e.g., AS9100, J-STD) Ensure the manufacturing work instructions and
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location Singapore Department NAND Product Engineering, Probe Product Engineering Project Title AI-Enabled Wafer Probe Test Optimization and Yield Analytics Project Description The NAND Probe Product Engineering Intern will undertake an engineering project focused on wafer probe testing, silicon characterization, yield analysis, and test optimization. Working under the guidance of experienced Product Engineers, the intern will study how probe test strategies are developed and evaluated across product development and manufacturing phases. The project provides exposure to advanced NAND semiconductor technologies, wafer-level testing, statistical data analysis, yield improvement methodologies, and Artificial Intelligence-enabled engineering workflows. The intern will collaborate with cross-functional teams, including Design, Design for Test, Design Validation, Process Integration, Backend Test, Reliability, and Manufacturing Engineering. Objective of the Project Develop an understanding of wafer probe testing and its role in NAND product development and manufacturing. Evaluate probe test data to identify yield patterns, product behavior, and test optimization opp
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role: Join our Product Engineering team to develop AI and Machine Learning solutions that transform semiconductor workflows. This role focuses on model development and agentic AI applications, enabling smarter testing, faster yield advancement, and engineering automation to improve cost, cycle time, and quality. This is a ground-breaking opportunity to work on modern technologies and make a significant impact in a world-class company! You will also train and guide Citizen Data Scientists (CDS or equivalent experience) within Product Engineering, helping them apply advanced ML techniques and analytics tools to gain domain-specific insights. Key Responsibilities: Machine Learning Development: Build predictive models for yield, test time, and reliability analysis using structured/tabular data Use advanced machine learning techniques to analyze complex datasets and generate actionable insights that improve manufacturing and operational performance Build and validate ML workflows for large-scale semiconductor datasets Agentic AI Solutions: Develop intelligent agents to automate engineering tasks (e.g., test program validation, yield analysis, report generation) Integra
Sigmoid empowers enterprises to make smarter, data-driven decisions by blending advanced data engineering with AI consulting. We collaborate with some of the world’s leading data-rich organizations across sectors such as CPG-retail, BFSI, life sciences, manufacturing, and more to solve complex business challenges. Our global team specializes in cloud data modernization, predictive analytics, generative AI, and DataOps, supported by 10+ delivery centers and innovation hubs, including a major global presence in Bengaluru and operations across the USA, Canada, UK, Netherlands, Poland, Singapore, and India. Recognized as a leader in the data and analytics space, Sigmoid is backed by Peak XV Partners and has consistently received accolades for innovation and rapid growth. Highlights include being named a ‘Leader’ in ISG’s Specialty Analytics Services for Supply Chain (2024), a two-time ‘India Future Unicorn’ by Hurun India, and a four-time honoree on both the Inc. 500 and Deloitte Technology Fast 500 lists. Technical Lead – Data Engineering As a Technical Lead, you will be responsible in building a highly-scalable and extensible big data platform that provides the foundation for collecting, storing, modeling, and analyzing massive data sets from multiple channels. This position reports to Engineering Manager. Responsibilities: Align Sigmoid with key Client initiatives Interface daily with customers across leading Fortune 500 companies to understand strategic requirements Connect with VP and Director level clients on a regular basis. Travel to client locations Ability to understand business requirements and tie them to technology solutions Facilitate in Technical Aspects Design, develop and evolve highly scalable and fault-tolerant distributed components using Big data technologies. Excellent experience in Application development and support, integration development and data management. Provide technical leadership and manage it day to day basis Guiding developers
Sigmoid empowers enterprises to make smarter, data-driven decisions by blending advanced data engineering with AI consulting. We collaborate with some of the world’s leading data-rich organizations across sectors such as CPG-retail, BFSI, life sciences, manufacturing, and more to solve complex business challenges. Our global team specializes in cloud data modernization, predictive analytics, generative AI, and DataOps, supported by 10+ delivery centers and innovation hubs, including a major global presence in Bengaluru and operations across the USA, Canada, UK, Netherlands, Poland, Singapore, and India. Recognized as a leader in the data and analytics space, Sigmoid is backed by Peak XV Partners and has consistently received accolades for innovation and rapid growth. Highlights include being named a ‘Leader’ in ISG’s Specialty Analytics Services for Supply Chain (2024), a two-time ‘India Future Unicorn’ by Hurun India, and a four-time honoree on both the Inc. 500 and Deloitte Technology Fast 500 lists. Technical Lead – Data Engineering As a Technical Lead, you will be responsible in building a highly-scalable and extensible big data platform that provides the foundation for collecting, storing, modeling, and analyzing massive data sets from multiple channels. This position reports to Engineering Manager. Responsibilities: Align Sigmoid with key Client initiatives Interface daily with customers across leading Fortune 500 companies to understand strategic requirements Connect with VP and Director level clients on a regular basis. Travel to client locations Ability to understand business requirements and tie them to technology solutions Facilitate in Technical Aspects Design, develop and evolve highly scalable and fault-tolerant distributed components using Big data technologies. Excellent experience in Application development and support, integration development and data management. Provide technical leadership and manage it day to day basis Guiding developers
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As a Real Time Defect Analysis Engineer, you will drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization. Working closely with cross-functional engineering teams, you will investigate defectivity and process deviations, evaluate new materials and equipment, implement corrective actions, and develop solutions that enhance process capability, product performance, and manufacturing efficiency. Success in this role requires strong analytical and problem-solving skills, effective collaboration, and a passion for continuous improvement and technology innovation. Main Responsibilities Establish and improve process condition and technology. Upgrade process capability and reduce production cost. Establish and modify process management projects. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other process areas to und
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary As a Real Time Defect Analysis Engineer, you will drive yield, quality, and process improvements in advanced semiconductor manufacturing through defect characterization, root cause analysis, and process optimization. Working closely with cross-functional engineering teams, you will investigate defectivity and process deviations, evaluate new materials and equipment, implement corrective actions, and develop solutions that enhance process capability, product performance, and manufacturing efficiency. Success in this role requires strong analytical and problem-solving skills, effective collaboration, and a passion for continuous improvement and technology innovation. Main Responsibilities Establish and improve process condition and technology. Upgrade process capability and reduce production cost. Establish and modify process management projects. Evaluation, promotion and planning of new equipment / materials. Abnormal analysis and improvement. Maximizes yield by working on tools, the process, or wafer fabrication recipes. Troubleshoots wafer fabrication problems and performs root cause analysis. Works with other proc
Job Details: Job Description: About the Group Global Construction Engineering (GCE) is responsible for the design and engineering of all of Intel's major manufacturing and cleanroom projects across the globe. We are a team of specialized in-house architects and engineers in a highly collaborative environment. We work together with our factory, operations, and supply chain partners to deliver some of the most technically challenging construction projects in the world with demanding schedule and cost constraints. Our vision is to become the world leader in semiconductor foundry construction engineering. We are growing our team to accelerate Intel Foundry's manufacturing roadmap. We are looking for world-class technical talent to join our team. If you enjoy working with the latest technology in a rewarding fast-paced environment this is the right place for you. Everywhere you go you'll find an opportunity to make a difference. In any given workday you will be given responsibility to innovate and create an impact to our business. This position is with the Tool Install Central Engineering (TICE) team. TICE focuses on the construction designs required to install the semiconductor manufacturing equipment around the globe. We design thousands of tools each year to keep our factories running on the most advanced manufacturing equipment. This is a hybrid position at the Ocotillo campus in Chandler, Arizona. As a Civil, Structural, Architectural (CSA) Project Engineer - Tool Install Engineering your responsibilities will include but are not limited to: Provide engineering solutions and breakthroughs to enable and deliver tool install construction projects to meet cost, schedule, duration an
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