Advanced Packaging Substrate Supplier Enablement Lead Jobs

Metro RDA Senior Manager (Package Development for Advanced Packaging) — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are part of Micron’s Advanced Packaging Technology Development (APTD) organization, where new AI assisted packaging technologies are developed to enable future generations of memory and storage solutions. Our team works closely across engineering disciplines to improve manufacturing performance, solve complex technical challenges, and support the technologies driving advances in AI and high-performance computing. As a Shift Process Engineer, you will play a key role in supporting and improving assembly processes within a fast-paced development environment. You will investigate process issues, use data to drive decisions, and work with cross-functional teams to improve yield, quality, and operational performance. This role offers the opportunity to make a direct impact on process capability while collaborating with teams across Micron's global network. Responsibilities: Identify, diagnose, and resolve process issues using failure analysis, FMEA, 8D, SPC, and FDC methodologies Analyze process and manufacturing data to improve yield, product quality, and cost performance

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) team at Micron is shaping the future of memory and storage technologies that fuel the AI era. We collaborate with global R&D groups, suppliers, and manufacturing teams to turn bold ideas into production-ready solutions. We innovate fast, learn continuously, and work as one team! This position is intended to be part of Micron's Technical Leadership Program (TLP). This is a career path for individuals seeking to advance as technical leaders and industry innovators. TLP members are expected to influence, lead, and mentor others. Position Overview: We are seeking an experienced organizational leader who will l ead and influence methodology improvements, including best practices in process development, data-driven decision-making, and application of AI/advanced analytics to drive innovation. In this role, you will drive strategic process development for Micron’s most advanced memory products, including HBM, 3DS DRAM, and emerging 3D architectures. You will guide end‑to‑end technology execution, partner across organizations, and influence both internal roadmaps and the external ecosystem. This is a high-impact role for someone who thrives at the intersection of innovation, complexity, and collaboration. Responsibilities: Own advanced packaging process technologies across wafer‑level and die‑level modules from pathfinding through manufacturing readiness Develop

Shift Process Engineer, Advanced Packaging Technology Development (APTD) — Boise, ID - Main Site. Apply via Workday.

Principal Wet Process Engineer, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Equipment Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Integration Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM – Advanced Packaging Wafer Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

Sr Engineer, Advanced Packaging Design Enablement Engineering (APDEE) — Hyderabad - Phoenix Aquila, India. Apply via Workday.

MATERIAL ENGINEER, ADVANCED PACKAGING TECHNOLOGY DEVELOPMENT — Taichung - Fab 16, Taiwan. Apply via Workday.

Equipment Technician, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.

Process Technician, Advanced Packaging — Boise, ID - Main Site. Apply via Workday.