Aptd Swa Module Engineer On Shift Jobs

APTD SWA Module Engineer On-Shift (Day shift) — US, Arizona, Phoenix. Apply via Workday.

APTD Process Integration Technician — Fab 10A, Singapore. Apply via Workday.

APTD Equipment Development Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.

APTD Integrator — Taichung - MTB, Taiwan. Apply via Workday.

APTD Process Integration Technician — Fab 10A, Singapore. Apply via Workday.

Engineer - APTD Operations — Fab 10A, Singapore. Apply via Workday.

Engineering Project Manager - APTD Operations — Taichung - MTB, Taiwan. Apply via Workday.

Senior Business Analyst - APTD — Fab 10A, Singapore. Apply via Workday.

Engineering Technician (Night Shift) – APTD PI TECH — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is advancing next-generation packaging technologies that enable the performance and scalability requirements of tomorrow’s AI and high-performance computing applications. Our team brings together experts in process integration, materials engineering, and semiconductor development to solve complex technical challenges and turn new ideas into production-ready solutions. Join us and help shape the future of advanced memory and packaging technology! Position Overview: As a Process Integration Engineer for Advanced Packaging, you will play a key role in developing and integrating advanced package architectures, including 2.5D, 3D stacking, HBM, and hybrid bonding technologies. You will work across engineering disciplines to develop new processes, improve performance and yield, and support the transfer of emerging technologies into manufacturing. This is an opportunity to contribute to innovative products while working on some of the industry's most advanced packaging solutions. Responsibilities: Develop and optimize advanced packaging technologies, including 2.5D/3D integration, HBM, hybrid bonding, and advanced interconnects Design and execute experiments to qualify materials, process flows, and design rules for new package architectures Analyze yield, performance, and defect data to identify process improvements using SPC and advanced analytics Drive

Snr/Staff Equipment Development Engineer (APTD) — Fab 10A, Singapore. Apply via Workday.

Senior/Staff Equipment Development Engineer (APTD) — Fab 10A, Singapore. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is shaping the future of memory and storage technology through advanced packaging innovation. Our team develops the processes, automation, and manufacturing capabilities that enable next-generation semiconductor products. Working closely with global R&D and manufacturing partners, we turn new ideas into scalable solutions that help maintain Micron’s leadership in the industry. Position Overview: As a Process Engineer, you will play a key role in improving the quality, reliability, and manufacturability of future memory products. This position combines hands-on problem solving, process optimization, and cross-functional collaboration in a fast-paced development environment. You will help drive technical advancements, influence technology roadmaps, and contribute directly to the success of next-generation semiconductor solutions. Responsibilities: Optimize automation, equipment, and process performance to improve product quality, reliability, and cost Develop and enhance host, automation, and data systems to accelerate learning and decision-making Perform root cause analysis and failure investigations using methodologies such as FMEA, 8D, SPC, and FDC Partner with equipment, process development, and process integration teams to develop and implement new solutions Support pilot line operations and technology transfer to high-volume ma

Engineer, APTD CEM - Advanced Packaging Die Level Technology Engineering — Fab 10A, Singapore. Apply via Workday.

Engineer, APTD CEM - Advanced Packaging Equipment Engineering — Fab 10A, Singapore. Apply via Workday.