Assembly Equipment Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary The Senior Director, Procurement, Assembly Test Materials & Outsourced Manufacturing leads the global strategy, sourcing, and supplier ecosystem for assembly, test materials, and outsourced manufacturing. This role is accountable for delivering cost competitiveness, supply assurance, and long-term resilience across a complex semiconductor value chain. Partnering closely with engineering, manufacturing, and business leaders, the role drives category strategies, supplier performance, and risk mitigation while enabling Micron’s growth and innovation priorities. Success in this role requires deep semiconductor domain expertise, strong commercial acumen, and the ability to lead large, global teams to deliver enterprise-level outcomes. Main Responsibilities Define and execute global procurement strategies for assembly, test materials, components, and outsourced manufacturing services to support business growth and operational excellence Lead category management, ensuring cost competitiveness, supply continuity, and alignment with Micron’s strategic and financial objectives Build and manage strategic supplier partnerships, driving collaboration, performance accountability, and continuous improvement across the supplie

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an Industry 4.0 (I4.0) Product Owner at Micron Technology, Inc., you will lead the definition, development, and delivery of end-to-end smart manufacturing solutions to empower Micron Assembly and Test Operation to improve cost, scale, quality and productivity. You will bridge business, engineering, and data science teams to drive Industry 4.0 transformation, leveraging industry best methods, advanced analytics, automation, and AI/ML to optimize planning and manufacturing operations. This role requires deep expertise in I4.0 technologies and strong hands-on data science skills to deliver impactful, scalable solutions across global operations. Key Responsibilities Product Ownership & I4.0 Leadership Define and drive the I4.0 product roadmap, aligning with business objectives and manufacturing strategies. Lead cross-functional teams (engineering, IT, data science, operations) to deliver integrated smart manufacturing solutions. Gather, analyze, and prioritize requirements from end users and stakeholders, develop business cases, validate impact, and propose high-ROI projects for implementation. Understands business problems and effectively translates user requirements into technical specifications—and vice versa—for data science, technical

About the Team: OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. Role Overview We are seeking a Package Reliability Engineer to lead reliability engineering for advanced packages used in high-performance AI and computing systems. The primary focus of this role is to assess package level mechanical and thermal reliability risks and apply thermal and mechanical modeling to optimize package design, material selection, and assembly processes. The engineer will also develop reliability test plans with external partners, identify failure mechanisms, perform root-cause analysis, and recommend practical corrective actions. In this role, you will assess package reliability risks from early architecture development through product qualification and high-volume manufacturing. You will work closely with package design, silicon design, system engineering, manufacturing, and ASIC partners to predict package behavior, develop qualification strategies, resolve reliability issues, and improve overall package robustness and lifetime. In this role you will: Lead reliability test plan and assessments for advanced HPC packages, including risk identification, potential failure-mechanism analysis, root-cause investigation, mitigation planning, and corrective-action development. Drive reliability-focused package design optimization based on thermo-mechanical modeling to improve package reliability, power integrity, thermal performance, mechanical robustness, and platform scalability. Develop, validate, and apply package reliability models and lifetime-prediction

About Taskrabbit: Taskrabbit is a marketplace platform that conveniently connects people with Taskers to handle everyday home to-do’s, such as furniture assembly, handyman work, moving help, and much more. At Taskrabbit, we want to transform lives one task at a time. As a company we celebrate innovation, inclusion and hard work. Our culture is collaborative, pragmatic, and fast-paced. We’re looking for talented, entrepreneurially minded and data-driven people who also have a passion for helping people do what they love. Together with IKEA, we’re creating more opportunities for people to earn a consistent, meaningful income on their own terms by building lasting relationships with clients in communities around the world. Taskrabbit is a hybrid company with employees distributed across the US and EU and a Built In — Best Places to Work (2022, 2023, 2024, 2025) continually ranked across multiple national and regional categories. Join us at Taskrabbit, where your work will be meaningful, your ideas valued, and your potential unleashed! This role operates on a hybrid schedule requiring two days of in-office collaboration per week in our San Francisco office. About the Role We're rebuilding the backbone of how partners and consumers interact with our platform — and we need a PM who thrives at the intersection of technical complexity and business impact. This role is accountable for leading a high-stakes platform transition, ensuring that every partner flow, consumer booking experience, and retailer integration lands on a modern, scalable foundation without disrupting the revenue that runs through it today. <strong&

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Description The MSH PDE Process Integration (PI) Manager leads a team of Process Integration engineers responsible for the successful execution of High Bandwidth Memory (HBM) New Product Introduction (NPI) from early development through High Volume Manufacturing (HVM) . This role combines people leadership, technical oversight, and cross‑functional execution , ensuring PI readiness, yield ramp, and risk mitigation across wafer fabrication, assembly, and test. The manager is accountable for delivering NPI commitments while developing a strong, scalable PI organization. Job Responsibilities People Leadership & Talent Development Lead, coach, and develop a team of MSH PDE PI engineers across multiple experience levels Set clear expectations, goals, and priorities aligned to NPI and business objectives Provide regular feedback, performance evaluations, and career development guidance Build organizational capability through hiring, onboarding, mentoring, and succession planning Foster a culture of accountability, collaboration, and technical excellence HBM NPI Execution & Delivery Own PI execution for HBM NPI programs, en

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer, you will work with a team dedicated to improving yields of next-generation memory products across all stages of the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects — driving enhanced product reliability, rapid production ramp, and early time to market. Your day-to-day work will center on fault isolation using a combination of electrical and physical characterization techniques paired with data analysis to pinpoint physical defects introduced during process fabrication or package assembly. You will also be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams to ensure corrective actions are implemented and yields continue to improve. Responsibilities Perform Electrical Failure Analysis and Fault Isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools Apply in-depth knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions Perform

ThermalWorks LLC is seeking an experienced, hands-on Quality Assurance Manager to be stationed full-time on the production floor at our manufacturing facility. This is not a desk-based quality systems role. The successful candidate will personally inspect work in process, identify workmanship that does not meet ThermalWorks specifications or industry standards, and have the authority and technical credibility to stop, hold, and require rework of nonconforming product before it advances. Deep experience in chiller or industrial refrigeration manufacturing is essential, along with working fluency across mechanical, electrical, and control systems and the standards that govern them. Key Responsibilities Include but are not limited to: Resident floor presence: Maintain a daily, full-time presence on the production floor across all build stages – fabrication, brazing/welding, refrigerant circuit assembly, electrical panel build, controls integration, and final test. Workmanship inspection: Identify and document improper or nonconforming work in real time, including braze and weld quality, piping fit-up, leak testing, evacuation and refrigerant charging procedures, torque and fastener practices, wire routing and terminations, and labeling. Hold and rework authority: Exercise stop/hold authority on nonconforming units; drive disposition, rework verification, and re-inspection to closure. Standards and compliance: Verify builds against applicable standards and specifications, including UL 1995 / UL 60335-2-40, NFPA 70 (NEC), ASME B31.5, AHRI 550/590, and applicable CE/IEC requirements for international product, plus ThermalWorks engineering specifications and approved drawings. Inspection and test plans: Develop, maintain, and enforce Inspection and Test Plans (ITPs), in-process checklists, and hold points aligned to the production traveler. Factory acceptance testing: Witness and sign off factory acceptance tests (FATs) and performance verification, including customer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Senior Manager, Strategy Lead (Quality Systems) at Micron Technology, Inc., you will report to the Smart Manufacturing and Artificial Intelligence organization, focusing in Micron Assembly and Test areas. The team defines, drives, and delivers end-to-end smart manufacturing solutions, integrated across business functions. The team investigates the application of industry-leading methodologies in automation, AI, and machine learning to enhance Micron’s product development, business, and administrative processes across the company. Responsibilities and Tasks Establish Strong partnership with Global Stakeholders to identify significant and breakthrough business transformation opportunities using AI Translate expected project metrics gains into dollar values, partnering with Finance. Lead the analysis of complex business problems and issues using data from internal and external sources to provide insights to decision-makers. Identify and interpret trends and patterns in datasets to locate influences. Construct forecasts, recommendations, and strategic/tactical plans based on business data and market knowledge. Create specifications for reports and analyses based on business needs and required or available data elements. Provide con

At Zoox, we are reimagining personal transportation from the ground up. As an Issue Resolution Engineer, you will play a critical role in ensuring the quality and build readiness of our autonomous vehicles during manufacturing. You will operate at the intersection of engineering and production, driving rapid containment and resolution of issues identified during general assembly and end-of-line validation. This role requires strong technical depth, urgency in execution, and the ability to lead cross-functional teams to root cause and implement durable corrective actions. You will partner closely with Vehicle Engineering, Manufacturing, Quality, Supplier Quality, and Operations to ensure vehicles meet Zoox’s quality standards and production targets. Your work will directly impact vehicle readiness, production efficiency, and overall fleet reliability. In this role, you will: Lead triage, containment, and resolution plan of issues identified during general assembly and end-of-line testing within your assigned subsystem/domain Define and execute short-term containment actions, including rework plans, part quarantine, and build flow protection Collaborate cross-functionally to lead root cause analysis across design, process, supplier, and manufacturing domains, identify and prioritize blockers, and drive Design for Manufacturing (DFM) improvements. Support cross-functional teams to implement permanent corrective actions (PCA) and prevent recurrence Support prototype builds, production trials, and engineering changes to validate fixes and improve manufacturability Develop and maintain metrics, dashboards, and reporting to track issue health, closure rates, and recurrence and improve PIRT processes, including issue tracking, prioritization, and cross-functional execution Qualifications B.S. or M.S. degree in Electrical Engineering or related technical field 8 to 12 years of experien

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Physical Design Engineer in the Heterogeneous Integration Group (HIG), you will drive the implementation of advanced HBM SoC logic/base die designs from netlist to GDSII. You will work closely with RTL design, verification, DFT, IP providers, packaging/assembly, and manufacturing teams to deliver best‑in‑class PPA (performance, power, area) and robust signoff collateral for tape-out. This is a hands‑on role with opportunities to own blocks or top‑level integration across multiple product generations. Key Responsibilities Own physical implementation for SoC blocks and/or top-level, including floor-planning, placement, CTS, routing, and physical optimization to meet PPA targets. Drive timing closure (setup/hold) across multi-mode/multi-corner (MMMC) scenarios; partner with RTL, architecture, and STA/signoff to converge designs. Integrate and implement complex IP (e.g., controllers, microcontrollers, NOC, interfaces, MBIST/DFT logic, buffers, PHY‑adjacent logic) with focus on robust physical integration and timing/power integrity. Perform and/or coordinate physical signoff, including DRC/LVS, IR drop/EM, and timing signoff, addressing violations efficiently. Partner with DFT teams to ensure scan/MBIST requirements are physically realizable and do not compromise PPA or schedule. Work with packaging, assembly, test, probe, and manufacturing collaborators to ensure builds meet manufacturability and quality requirements. Support tape-out execution (checklists, ECO flows, signoff r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in premier memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. The Design Engineer is responsible for designing, simulating, and optimizing DRAM circuits while supporting the development of digital and analog circuitry used in advanced memory products. This role collaborates globally across design, verification, product engineering, test, probe, process integration, assembly, and marketing to ensure manufacturable, high‑quality, cost‑optimized solutions. The position drives innovation in future memory generations and supplies to silicon‑to‑system development in a dynamic engineering environment. Responsibilities Design digital, analog, and memory core circuits using CMOS logic and transistors, implementing device specifications from concept to solution. Create optimi

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Engineer at Micron Technology, Inc., you will be responsible for designing and analyzing digital and analog circuits used in the development of memory products. We are engaged in developing groundbreaking silicon-to-systems solutions – right from technology development and advanced memory designs to product development, systems design and validation resulting in world class memory solutions. In this position, you will collaborate with Micron’s various design and verification teams all over the world and support the efforts of groups such as Product Engineering, Test, Probe, Process Integration, Assembly and Marketing to proactively design products that optimize all manufacturing functions and assure the best cost, quality, reliability, time-to-market, and customer satisfaction. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall layout, and optimization of Memory/Logic/Analog layouts Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions Overseeing and managing the layout process including floor-planning, placement, and routing Performing verification processes with modeling and simulation using industry standard simulators Contributing to cross group communication to work towards standardization and group success Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality Driving innovation into the future Memory generations within a dynamic work environment About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Project Title Selective Solder Tooling Enhancement and BOL Conversion Readiness Enhancement Description Enhance selective solder process robustness by introducing tooling improvements while strengthening BOL conversion readiness by introducing a standardized tooling selection system covering Cornerfill (CF), Selective Solder (SS) and Enclosure Assembly (EA). The project aims to reduce conversion ambiguity, setup errors and process variability across BOL operations. Scope 1. Selective Solder Tooling Enhancement (SS) - Qualify and release selective solder process enhancement toolings to improve setup stability, consistency and repeatability - Address tooling‑related contributors to process variation during selective solder operations 2. BOL Conversion Readiness Enhancement (CF, SS, EA) - Develop and implement a tooling selection system defining required toolings for each product conversion across BOL - Standardize tooling requirements to eliminate ambiguity during CF, SS and EA conversions - Improve conversion clarity, reduce human dependency and minimize conversion‑related errors Deliverables 1. Qualify and release selective solder tooling enhancements, including: - Uflex quick‑change gripper - Fixed preheater jig positioning standardization - Hold‑down unit design improvements<