Assembly Equipment Engineer Jobs

About Sentry Software runs the world and the pace is faster than ever. Sentry helps developers fix errors and performance issues before users notice, so teams can spend less time firefighting and more time building. Trusted by 200,000+ organizations, Sentry is today’s application monitoring standard and our team is building its AI-native future. About the role Sentry provides developer-first observability to over 4 million developers worldwide. The Events Analytics Platform (EAP) team is at the heart of that mission: it powers how all of Sentry's event data, such as errors, transactions, spans, profiles, replays, and metrics, is stored, queried, and analyzed. It also powers Sentry's latest AI push, Seer. The EAP team makes it possible for developers to efficiently search and debug across massive volumes of data, providing the context needed to understand and fix issues quickly. This team is also a cornerstone of Sentry's long-term strategy to become a context assembly and telemetry platform that unifies different signals so developers can see the complete picture. As an engineering manager on the EAP team, you will lead a group of engineers building and scaling one of Sentry's most critical data platforms. You will be responsible for driving architectural evolution, ensuring system stability, and mentoring a talented team. This is a highly visible leadership role with direct ties to Sentry's long-term product and platform strategy. What you'll do Grow and develop a team of engineers with high expectations for ownership and impact Set the technical and strategic direction for the team, balancing short-term stability with long-term architectural evolution Drive development of core EAP features, including support for complex analytical queries, dynamic routing logic across fidelity levels, storage and compute separation, and modern patterns for analytical storage Ensure EAP can support the workload demands of AI agents and MCP servers that unlock new AI capabilities fo

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Location F10N, 1 North Coast Drive, Singapore 757432 Department Non-Volatile Memory Test Engineering Project Title AI-Driven Test Engineering Automation and Analytics for NAND Products Project Description As an Intern Test Solutions Engineer in Non-Volatile Memory Test Engineering, you will work on advanced semiconductor test engineering projects focused on NAND memory product development, manufacturing test optimization, and Artificial Intelligence-enabled engineering automation. The project provides hands-on exposure to wafer probe, burn-in, and assembly test solutions used in high-volume semiconductor manufacturing environments. You will collaborate with experienced test engineers and cross-functional teams to develop analytical and automation solutions that improve test quality, engineering productivity, cost efficiency, and decision-making. Through this project, you will apply data analytics, machine learning, scripting, and software development techniques to real engineering challenges while developing practical knowledge of semiconductor memory testing. Objective of the Project Develop data analytics and Artificial Intelligence-enabled solutions for NAND test engineer

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As an PDE Yield Enhancement (YE) Engineer within Package Development Engineering (PDE), you will be responsible for yield monitoring, excursion management, and yield stabilization during High Bandwidth Memory (HBM) New Product Introduction (NPI) . This role is critical to ensuring robust yield performance from first silicon through NPI ramp and early HVM , working closely with Process Integration (PI), MRDA, Process Engineering (PE), Assembly/Test Manufacturing, and Quality teams. You will act as a hands‑on yield owner during NPI builds, driving fast learning cycles, early risk detection, and disciplined yield recovery. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness,exercising sound judgment and complying with organizational standards and legal requirements. Contributes to a culture of continuous improvement by identifying, testing, and sharing AI-enabled enhancements within one’s scope of work. Yield Loss Accounted For Account for HBM NPI builds across Post Wafer Finishing (PWF), Assembly, and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimizati

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the member of HIG HBM Package Product Engineering, you will be part of a high-performing team to driving Package and HBM Product engineering activities within the HBM Systems and Product Engineering Team. You will be part of a Global team of professional Product Engineers leading a portfolio of Best-In-Class Next Generation HBM Product focused on the critical KPI’s Quality, Cost, Cycle Time and Scale. You will collaborate across functions within and outside of HBM to meet both strategic and tactical objectives while continually maximizing the effectiveness of the HIG HBM PE organization. Key Responsibilities ASM Yield and DPM Improvement: Accountable for improving assembly related coverage within the manufacturing flows to improve the Time 0 and Field DPM and reduce/prevent inline fallout within the assembly process. HBM Cube Yield Improvement: Improving HBM Cube yield through test optimization

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a dynamic and driven Silicon Supply Planner to help power the future of AI and computing hardware. In this role, you will support end-to-end silicon supply and production planning across foundry and OSAT partners, from wafer starts through assembly and test output. You will help translate demand into executable supply plans, track production and capacity, manage supply risks, and coordinate cross-functional recovery actions across advanced AI and computing hardware programs. This role is remote, based in Taiwan, with candidates located in Kaohsiung preferred. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have 3-6 years of experience in semiconductor supply planning, production planning, operations, or a related supply chain role. We ideally seek candidates who are fluent in both Mandarin and English and have 3–6 years of relevant experience. You understand semiconductor manufacturing flows, including foundry processes such as FEOL and BEOL, and OSAT operations such as wafer probe, assembly, and test. You are experienced in demand and supply balancing, forecasting, production tracking, capacity planning,

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We're seeking a Software Engineer to join our First-Party Hardware team. In this role, you will design, build, integrate, and validate the software used to manufacture, qualify, and deliver our hardware from the factory. You will work across the stack to create the infrastructure that runs internally and externally to coordinate all aspects of the production process. You will create the critical tools and procedures to execute, capture, process, and present the data resulting from the end to end assembly and validation of our hardware across multiple vendors and sites. This role is hands-on and high-ownership. You will work closely across teams both internal and external to define the standards that will be used across our products to ensure the velocity and quality of our 1P hardware. You will own the implementation, deployment, and output of these systems as well their continued maintenance and SLAs. Location: San Francisco, CA (Hybrid: 3 days/week onsite). Relocation assistance available. In this role, you will: Design, develop, and maintain the software infrastructure for manufacturing process execution and data export. Own integration across internal customers and vendor systems and processes. Build and maintain the CI, release, and delivery pipeline of tooling to external partners. Build and maintain internal systems to ingest, process, deliver, and visualize critical data for internal teams and systems. Build system health monitoring, telemetry, remote d

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Lead the Future of AI-Powered Manufacturing at Micron Micron is accelerating its transformation toward Autonomous Operations through Artificial Intelligence, advanced analytics, digital twins, robotics, and intelligent automation. As a Staff/Principal Full-Stack AI Engineer , you will be a technical leader driving the strategy, architecture, and delivery of next-generation AI products that power smarter manufacturing across Micron's global network of fabs and assembly/test sites. In this highly influential role, you will own AI solutions end-to-end—from data engineering, machine learning, and agentic AI systems to modern full-stack applications, digital twin platforms, robotics integration, and edge-to-cloud deployment. Working closely with data scientists, software engineers, robotics teams, and manufacturing leaders, you will transform innovative ideas into scalable, production-grade solutions that improve efficiency, increase automation, and enable intelligent decision-making at enterprise scale. This is a unique opportunity to shape the future of AI in semiconductor manufacturing and directly contribute to Micron's vision of autonomous, data-driven opera

About the Team OpenAI’s Hardware organization develops AI-native silicon and system-level solutions for the unique demands of advanced AI workloads. Building on efforts like Jalapeño, the team is developing future generations of AI-native silicon and tightly integrated systems to power the next generation of frontier models. By co-designing chips, systems, tools, and methodologies, the team helps deliver faster, more efficient, and production-ready hardware for OpenAI’s supercomputing platform. About the Role We’re looking for a product manufacturing & quality engineer, who will be responsible for driving technical initiatives related to the manufacturing, quality and reliability of our AI supercomputer hardware systems to ensure product success from concept to launch and through mass production. You’ll have the opportunity to coordinate with functional SMEs and work with a wide range of stakeholders, from design engineering and operations teams, TPMs, external industry vendors and partners to ensure that all products are developed and delivered on time and to the highest quality standards. This role is based in San Francisco, CA. We use a hybrid work model of 3 days in the office per week and offer relocation assistance to new employees In this role, you will: Own the integrated manufacturing and quality readiness for a product across L6, L10, and L11, with clear gates, milestones, deliverables, owners, and closure criteria. Lead readiness of process flows, tooling, fixtures, assembly operations, test interfaces, and production controls. Review and contribute to work instructions. Translate product requirements into qualification plans, process controls, test requirements and acceptance criteria with design engineering and Area SMEs Coordinate and drive execution of product and process qualification, reliability testing, and validation with the relevant SMEs. Maintain traceable evidence that assigned products and processes meet agreed performance, reliability,

Technical Program Manager III itD is seeking a Technical Program Manager III to drive hardware program execution for next-generation AR wearable devices. This role will play a critical part in managing PCB development and electrical component integration, ensuring seamless collaboration between electrical engineering, layout, and manufacturing teams. The ideal candidate will bring deep experience in hardware engineering or program management and a proven track record of delivering complex PCB and wearable device programs from design through production. Location: Onsite – Sunnyvale, CA Duration: 12 Months (potential for extension / FTE conversion) Pay Rate: $75 - $80 per hour, depending on experience We provide comprehensive medical benefits, a 401k plan, paid holidays, and more. Please note that we are only considering direct W2 candidates at this time, as we are unable to offer sponsorship. Responsibilities Lead end-to-end program management of PCB development, including flex circuits and multi-layer boards (MLBs) from design through production Drive design release processes, ensuring alignment across electrical engineering, layout, and cross-functional teams Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds, optimizing for schedule, quality, and yield Collaborate closely with electrical and layout engineers to develop and refine circuit designs for compact wearable devices Track program schedules, dependencies, and risks, proactively driving mitigation strategies Coordinate with APAC-based teams and vendors, including participation in early morning or evening meetings Ensure successful integration of small electrical components into advanced AR wearable form factors Provide strong program leadership, driving ownership, clarity, and execution across stakeholders Internal Responsibilities Attend regular internal practice community meetings Collaborate with your itD practice team on industry thought leadership Complete client case

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Monitor and react to wafer quality indicators and quality events highlighted by Fab Process, Product Engineering, and Site QA teams. Proactively contain any deviated or non-conforming material from shipping out to both internal and external customers. Create technical product risk assessment reports on deviated or non-conforming material in your areas of ownership, decide on additional QA data collection requirements, and recommend final disposition of the product. Coordinate Global MRB (Material Review Board) meetings with PQRA, PE, Site QA, and Supply Chain, Finance teams to assess product quality and reliability risk and finalize disposition balancing supply chain and Q&R risks. Monitor Outgoing Quality Control (OQC) from BEOL processes and coordinate with BE Assembly and Test teams to disposition deviations assigned to FE Fabs. Assess risk, define Q&R data collection requirements, and approve planned deviations as part of Global Conversion/Change Management business process. Create SBL QRA hold criteria, maintain, and update criteria on regular cadence. Coordinate with Site QA team to identify root- cause for RMAs & deviations and drive corrective and preventive actions using systematic problem-solving methodologies such as 8D, 5 Whys, and/or Fishbone. Collaborate with Site QA team to formalize Customer Communication for all Automotive RMA’s, CSPL Inline and Electrical specification CpK performances. Lead projects to drive global compliance to manufacturing quality standards and support Automotive Zero Defects program. Design and develop automa

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Role Summary: We are currently experiencing a ground-breaking period in artificial intelligence (AI), where AI is anticipated to become an integral component of daily life. This proliferation is being fueled by advances in memory and compute technologies. High bandwidth memory (HBM) is at the forefront of these innovations. Micron’s Advanced Packaging Technology Development (APTD) is responsible to deliver package development for high performance memory products and transfer to manufacturing . Your responsibilities include but are not limited to developing and enabling deployment of assembly processes for advanced packaging technologies to meet performance, cost, manufacturability, quality, reliability and schedule requirements. You will have opportunity to work with peers and partners across organizations to coordinate the development and launch of new technologies and integration fl

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Staff/Principal Full-Stack AI Engineer, IPAI, SMAI Job Summary Lead the Future of AI-Powered Manufacturing at Micron Micron is accelerating its transformation toward Autonomous Operations through Artificial Intelligence, advanced analytics, digital twins, robotics, and intelligent automation. As a Staff/Principal Full-Stack AI Engineer , you will be a technical leader driving the strategy, architecture, and delivery of next-generation AI products that power smarter manufacturing across Micron's global network of fabs and assembly/test sites. In this highly influential role, you will own AI solutions end-to-end—from data engineering, machine learning, and agentic AI systems to modern full-stack applications, digital twin platforms, robotics integration, and edge-to-cloud deployment. Working closely with data scientists, software engineers, robotics teams, and manufacturing leaders, you will transform innovative ideas into scalable, production-grade solutions that improve efficiency, increase automation, and enable intelligent decision-making at enterprise scale. This is a unique opportunity to shape the future of AI in semiconductor manufacturing and directly contribute to Micron's vision of autonomous, data-dri