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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Overview｜職缺概述 Micron Taiwan is building a long‑term HBM talent pool to support the expansion of advanced memory manufacturing in Taichung. This evergreen posting is intended to attract talents across Engineering, Manufacturing, Quality, Automation, Facilities, and Operations Leadership functions. Micron 台灣持續擴展 HBM（High Bandwidth Memory）製造與營運團隊 ，此 evergreen 職缺用於建立長期人才庫，將依業務需求媒合合適職務。 Potential Roles｜涵蓋職務方向（不限於） Manufacturing / Process 製造／製程工程師 Automation & Manufacturing Systems Engineer 自動化與製造系統工程師 Industrial Engineer 工業工程師 Product Quality Assurance / Quality Engineering (PQA / PQE) 產品品質保證／品質工程 HBM Manufacturing / Test Production Supervisor HBM 製造／測試產線主任 Assembly Equipment Engineer / Process Engineer 設備／製程工程師 Facilities Engineer 廠務工程師(水處理/HVAC/氣體系統/擴建工程專案/二次配) What You Will Do｜工作內容摘要 Depending on role alignment, responsibilities may include: Support and improve HBM manufacturing, assembly, test, automation, or facility systems 支援並優化 HBM 製造、封裝、測試、自動化或廠務系統 Drive process optimization and yield improvement, enhance product quality, and support new product introduction and production ramp 負責分析與優化

About Mach Industries Founded in 2023, Mach Industries is a rapidly growing defense technology company focused on developing next-generation autonomous defense platforms. At the core of our mission is the commitment to delivering scalable, decentralized defense systems that enhance the strategic capabilities of the United States and its allies. With a workforce of approximately 350 employees, we operate with startup agility and ambition. Our vision is to redefine the future of warfare through cutting-edge manufacturing, innovation at speed, and unwavering focus on national security. We are dedicated to solving the next generation of warfare with lethal systems that deter kinetic conflict and protect global security. The Role Mach Industries is seeking an Integration Reliability Engineer to develop the methods that enable complex products to be assembled, integrated, tested, and fielded reliably throughout the product lifecycle. You will support integration strategy, build readiness, interface risk management, failure investigation, and reliability growth across product development and production. This role spans Design Engineering, Manufacturing Engineering, Test Engineering, Operations, Program Management, and field support. The work is hands-on and connected to integration builds, production environments, test activities, and hardware failure investigations in Victorville, Ca.. Key Responsibilities Define integration strategies that establish readiness for component, assembly, and production. Conduct risk assessments, and inspection plan reviews for complex products and assemblies. Develop and improve control plans, initial controls, and methods for integrating complete systems. Support component integration, built-to-print assembly, validation activities, and the transition from development into repeatable production. Monitor yield, build health, and process robustness to identify risks affecting throughput and product realization. Lead systemic root-cause and co

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Our team is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. Position Overview: As a Staff Process Engineer in Advanced Packaging CMP team, you will be primarily responsible for starting up, developing and optimizing processes to improve product quality and reliability, working on process yield improvement, cost reduction, productivity improvement and risk management as well as resolving manufacturing line problems. You will also be required to identify, diagnose and resolve assembly process related problems by applying failure analysis, FMEA, 8D or SPC/FDC methodology. This position requires communication and collaboration with associates both within the region and internationally. Strict adherence to Micron Intellectual Property Protection policy is vital. This role will also extensively collaborate with vendors to develop processes that meet integration requirements. Responsibilities: Perform fundamental research, consumables development, and hardware evaluation, as well as test processes for novel applications Initiate and manage experiments to widen process margins and evaluate man

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a Design Engineer, you will contribute to the design and analysis of digital and analog circuits used in memory technologies. You will collaborate with global, multi-functional engineering teams to optimize product performance, manufacturability, cost, and time-to-market while supporting end-to-end product development and validation. Responsibilities Design, simulate, and optimize memory circuits, including layout development and verification using industry-standard tools (e.g., SPICE, Verilog) Develop schematic blocks such as memory arrays, control logic, datapaths, address decoders, and internal test logic Analyze design trade-offs across power, speed, die size, and manufacturability to improve overall product performance Collaborate with Product Engineering, Test, Process Integration, Assembly, and Marketing teams to ensure robust and scalable designs Apply AI-enabled tools and methodologies to improve circuit design efficiency, simulation accuracy, and overall design flow optimization Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher Foundational understanding of memory architectures, circuit design, and semiconductor device behavior Experienc

About Graphcore Graphcore is a global leader in artificial intelligence computing systems. We design advanced semiconductors and data center hardware that provide the specialized processing power needed to advance AI while improving the efficiency required for broad adoption. As part of SoftBank Group, Graphcore belongs to a family of companies developing transformative technologies. Our AI Engineering Campus in Austin plays an important role in building the hardware platforms that support the next generation of AI systems. The Opportunity We are looking for a recent graduate or early-career engineer to join the Mech/Thermal Platform team as a Graduate Mechanical Engineer. You will contribute to the mechanical design, thermal validation, and verification of advanced AI hardware and data center systems. You will work with experienced mechanical, thermal, hardware, and systems engineers throughout the development lifecycle. The role combines 3D computer-aided design, prototype evaluation, lab testing, data analysis, troubleshooting, and clear engineering documentation. What You Will Do Create and update mechanical parts, assemblies, and drawings using Creo or comparable 3D CAD software. Take ownership of defined mechanical design tasks from requirements and concepts through detailed design, review, release, and verification. Apply mechanical design, materials, manufacturing, heat transfer, and thermodynamics principles to engineering decisions. Develop mechanical and thermal test plans and procedures for prototypes and development systems. Set up and operate laboratory equipment, collect accurate data, analyze results, and document conclusions. Evaluate prototypes and identify mechanical, thermal, assembly, or manufacturability issues. Support design verification, troubleshooting, root-cause analysis, and implementation of verified design improvements. Maintain accurate engineering documentation, including design notes, drawings, test procedures, results, and change r

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Design Architecture Lead in Non-Volatile-Engineering NAND Flash design team at Micron Technology, Inc., your role will cover both pathfinding as well as execution of innovative non-volatile memory designs! You will work with and support the efforts of functional teams to innovate and evaluate key multi-functional features and architecture to ensure best in class memory products in terms of die size, performance, reliability and power. In this role, you are expected to participate in definition of simulation plans, environment setup, pass/fail criteria, and coverage analysis. You will also work closely with design team members during all phases of design from concept to production. In addition, you will actively participate in the design and quality methodology improvements across the department. You will also be responsible for assisting product engineers in post-silicon design validation, root cause analysis, and providing solutions! Responsibilities and Duties include, but not limited to: Innovate and architect innovative memory/storage solution for high performance and energy efficient systems Identify and innovate new concepts and features based on customer requirements Contributing to the development of new NAND Flash Memory by assisting with the overall design, layout, and optimization of Memory/Logic circuits Drive multi-functional team in key features evaluation and recommend decision on architecture Working with Marketing, Probe, Assembly, Test,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron, we design the memory that moves the world — from advanced DRAM to complete silicon-to-systems solutions! Our design teams work at the leading edge of memory technology, and we collaborate across the globe to turn ambitious ideas into world-class products. If you want your work to show up in the devices billions of people rely on, this is the place to do it. As a Staff Design Engineer on our DRAM team, you'll shape the circuits at the heart of our next memory generations. You'll own design decisions that directly affect cost, quality, reliability, and time-to-market, and you'll partner with talented engineers across design, verification, product, and manufacturing. This is a role for someone who enjoys working close to silicon and wants real ownership over the products they help create. Responsibilities: Design, lay out, and optimize Memory, Logic, and Analog circuits for new memory products Handle parasitic modeling and support design validation, reticle experiments, and tape-out revisions Oversee the layout process, including floor-planning, placement, and routing Run verification through modeling and simulation using industry-standard simulators Partner with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering to ensure manufacturability, and use Generative AI tools to speed up design, analysis, and documentation while owning correctness and signoff Minimum Qualifications: Bachelor's degree in Electrical

We anticipate the application window for this opening will close on - 6 Oct 2026 Careers that change lives start here. Medtronic is a global leader in healthcare technology with a Mission to alleviate pain, restore health, and extend life. Our 95,000 employees work across more than 150 countries to put patients first — developing innovative medical technologies that improve the lives of 72+ million patients each year. Your unique talents will help shape the future of healthcare while building a career grounded in purpose, growth, and impact. A Day in the Life At Medtronic, we bring bold ideas forward with speed and decisiveness to put patients first in everything we do. In-person exchanges are invaluable to our work. We’re working onsite 5 days a week as part of our commitment to fostering a culture of professional growth and cross-functional collaboration as we work together to engineer the extraordinary. This Principal Process Development Engineer will be responsible for the development of material finishing, material handling and automated handling systems and processes through release to manufacturing. The Engineer will lead equipment and system development and process improvement projects to support various component and device handling, finishing, and assembly needs in new and current manufacturing lines. Process development work scope often spans across multiple process areas including wafer processing functional areas, component assembly, laser processes, and device test and finishing processes. They will coordinate risk burn down and problem-solving experiments by utilizing DRM/DFSS (Design and Reliability for Manufacturing / Design For Six Sigma) and data driven methods. They will also be responsible for managing the validation activities for the development work including requirements flow down, effective control

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Metro Real-time Defect Analysis (RDA) Shift Engineer, you will be responsible for ensuring stable, continuous, and safe operation of advanced packaging equipment platforms, with a strong focus on New Product Introduction (NPI) and early-life production phases. You will serve as the first-line technical responder for equipment alarms, system issues, and process deviations across advanced packaging lines (e.g., wafer-level packaging, assembly, test, and backend processes). You will leverage RDA tools, automation systems, and cross-functional collaboration to minimize downtime, accelerate learning cycles, and ensure smooth transition from New Product Introduction (NPI) to high-volume manufacturing (HVM). You will work closely with Process, Equipment, NPI, Automation, IT, and Global RDA teams to support 24x7 operations, drive rapid issue resolution, and ensure adherence to standard operating procedures during high-change, high-learning environments typical of NPI ramps. Job Responsibilities: Integrates AI-assisted tools and insights into daily work to improve efficiency, quality, or effectiveness, exercising sound judgment and complying with organizational standards and legal requirements.

Technical Program Manager III itD is seeking a Technical Program Manager III to drive hardware program execution for next-generation AR wearable devices. This role will play a critical part in managing PCB development and electrical component integration, ensuring seamless collaboration between electrical engineering, layout, and manufacturing teams. The ideal candidate will bring deep experience in hardware engineering or program management and a proven track record of delivering complex PCB and wearable device programs from design through production. Location: Onsite – Sunnyvale, CA Duration: 12 Months (potential for extension / FTE conversion) Pay Rate: $75 - $80 per hour, depending on experience We provide comprehensive medical benefits, a 401k plan, paid holidays, and more. Please note that we are only considering direct W2 candidates at this time, as we are unable to offer sponsorship. Responsibilities Lead end-to-end program management of PCB development, including flex circuits and multi-layer boards (MLBs) from design through production Drive design release processes, ensuring alignment across electrical engineering, layout, and cross-functional teams Manage SMT (Surface Mount Technology) and FATP (Final Assembly, Test, and Pack) builds, optimizing for schedule, quality, and yield Collaborate closely with electrical and layout engineers to develop and refine circuit designs for compact wearable devices Track program schedules, dependencies, and risks, proactively driving mitigation strategies Coordinate with APAC-based teams and vendors, including participation in early morning or evening meetings Ensure successful integration of small electrical components into advanced AR wearable form factors Provide strong program leadership, driving ownership, clarity, and execution across stakeholders Internal Responsibilities Attend regular internal practice community meetings Collaborate with your itD practice team on industry thought leadership Complete client case

About the Team OpenAI’s Hardware organization develops silicon and system-level solutions designed for the unique demands of advanced AI workloads. The team builds next-generation AI-native silicon and systems while working closely with software, research, and manufacturing partners to co-design hardware tightly integrated with AI models. In addition to delivering systems for OpenAI’s supercomputing infrastructure, the team develops the tools, methodologies, and strategic partnerships needed to accelerate hardware innovation. About the Role We’re seeking an experienced Hardware Strategic Sourcing Manager to own sourcing strategy and supplier partnerships for fiber and optical interconnect components across OpenAI’s next-generation AI infrastructure. Reporting to the Head of Partnerships & Strategic Sourcing, you will lead sourcing across fiber cable assemblies, internal optical harnesses, fiber shuffles, optical backplane assemblies, connectorized and standalone passive optical assemblies, fiber-array units (FAUs), fiber-to-chip and coupling interfaces, detachable connectors, optical routing, and assigned optical packaging, assembly, and test services. You will work closely with electrical engineering, optical engineering, systems engineering, mechanical and packaging engineering, quality, rack integration, data-center deployment,manufacturing, supply chain, finance, legal, and program management teams to translate demanding bandwidth, signal integrity, reliability, and scale requirements into resilient supplier partnerships and scalable commercial strategies. Your work will directly support the performance, reliability, manufacturability, and scale of the high-speed optical connectivity required for OpenAI’s next-generation AI systems. In this role, you will: Develop and execute a comprehensive sourcing strategy for fiber and optical interconnect components supporting high-bandwidth AI systems and infrastructure. Own sourcing across optical fiber cable assembli

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsibilities will include, but are not limited to: Contributing to the development of new product opportunities by assisting with the overall design, layout, and optimization of Memory/Logic/Analog circuits. Design, implementation, and improvement of Complex Analog Power Management IPs such as Bandgap reference, Voltage/Current reference, Regulators, Charge-pumps, CMOS Amplifiers, Comparators in advanced semiconductor process nodes for advanced DRAM products. Parasitic modeling and assisting in design validation, reticle experiments and required tape-out revisions. Being responsible for and managing the layout process including floor-planning, placement, and routing. Performing verification processes with modeling and simulation using industry standard simulators. Contributing to cross group communication to work towards standardization and group success. Working with Marketing, Probe, Assembly, Test, Process Integration, and Product Engineering groups to ensure accurate manufacturability of product. Proactively solicit guidance from Standards, CAD, modeling, and verification groups to improve the design quality. Driving innovation into the future Memory generations within a dynamic work environment. Leveraging AI About Micron Technology, Inc. We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. Responsibilities: Develop and optimize wafer edge trim, backgrind, and thinning processes to meet the mechanical, electrical, and reliability requirements of Micron’s advanced memory products. Improve process capability, yield, cost efficiency, and wafer integrity through data‑driven optimization and equipment or consumable innovation. Conduct root‑cause and failure‑mode analyses to understand wafer damage mechanisms such as edge chipping,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Firmware Engineer at Micron Technology, Inc., you will build groundbreaking high-performance controller firmware for volatile and non-volatile memory systems. You will assist in the evaluation, creation, build, bench testing, debugging, and failure analyzes of firmware for new high-performance memory controllers and Solid State Drives (SSD) that will improve performance, while reducing power, latency and SoC (System on Chip) complexity for the target sectors. You can expect to partner multi-disciplinary Engineers seek multi-functional product development issues. You will triage failures, file bug reports, AI Supported and help the development teams with isolating issues. Job Responsibilities 6-12 Years in Embedded Firmware Storage/SSD would be a strong plus. Strong firmware design and debug experience using assembly and C programming. Knowledge of mass storage interface protocol PCIe/NVMe, Understanding of storage interfaces including SATA, or SAS (optional) Strong skill in ARM development tools and IDE such as Eclipse Knowledge in the use of scripting languages, programming tools and environments Experience in the storage industry in SSD, HDD, storage systems, or a related technology. Working knowledge of NAND flash and other non-volatile storage is optional but plus. Experience in test equipment such as oscilloscopes and logic/bus analyzers (good to have). Ability to work indepe

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Key Responsibilities 1. NPI Demand Fulfillment & Execution Manage end-to-end execution of NPI demand lines from build request through shipment. Monitor MAD commitments and proactively identify delivery risks. Drive recovery plans and mitigation actions for schedule deviations. Partner with site NPM and operations teams to improve delivery predictability. Support demand line closure and disposition governance processes. 2. Build Plan & Production Order Management Coordinate build plan commitments with manufacturing sites. Monitor production order start and completion performance. Drive execution to meet production order due dates and customer commitments. Resolve execution bottlenecks impacting critical NPI deliveries. 3. WIP & Hot Lot Management Monitor critical NPI WIP movement across assembly, test, module and SSD operations. Manage hot lot prioritization and escalation processes. Track end-to-end cycle time performance and ensure timely lot progression. Collaborate with operations teams to remove bottlenecks and expedite critical material. 4. NPI Cycle Time Governance Analyze model