Assembly Test Tactical Planner Jobs

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a dynamic and driven Silicon Supply Planner to help power the future of AI and computing hardware. In this role, you will support end-to-end silicon supply and production planning across foundry and OSAT partners, from wafer starts through assembly and test output. You will help translate demand into executable supply plans, track production and capacity, manage supply risks, and coordinate cross-functional recovery actions across advanced AI and computing hardware programs. This role is remote, based in Taiwan, with candidates located in Kaohsiung preferred. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and offers will align with that level, which may differ from the one in this posting. Who You Are You have 3-6 years of experience in semiconductor supply planning, production planning, operations, or a related supply chain role. We ideally seek candidates who are fluent in both Mandarin and English and have 3–6 years of relevant experience. You understand semiconductor manufacturing flows, including foundry processes such as FEOL and BEOL, and OSAT operations such as wafer probe, assembly, and test. You are experienced in demand and supply balancing, forecasting, production tracking, capacity planning,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Monitor and react to wafer quality indicators and quality events highlighted by Fab Process, Product Engineering, and Site QA teams. Proactively contain any deviated or non-conforming material from shipping out to both internal and external customers. Create technical product risk assessment reports on deviated or non-conforming material in your areas of ownership, decide on additional QA data collection requirements, and recommend final disposition of the product. Coordinate Global MRB (Material Review Board) meetings with PQRA, PE, Site QA, and Supply Chain, Finance teams to assess product quality and reliability risk and finalize disposition balancing supply chain and Q&R risks. Monitor Outgoing Quality Control (OQC) from BEOL processes and coordinate with BE Assembly and Test teams to disposition deviations assigned to FE Fabs. Assess risk, define Q&R data collection requirements, and approve planned deviations as part of Global Conversion/Change Management business process. Create SBL QRA hold criteria, maintain, and update criteria on regular cadence. Coordinate with Site QA team to identify root- cause for RMAs & deviations and drive corrective and preventive actions using systematic problem-solving methodologies such as 8D, 5 Whys, and/or Fishbone. Collaborate with Site QA team to formalize Customer Communication for all Automotive RMA’s, CSPL Inline and Electrical specification CpK performances. Lead projects to drive global compliance to manufacturing quality standards and support Automotive Zero Defects program. Design and develop automa

ATLO (Assembly, Test & Launch Operations) Functional Manager - Millennium Space Systems — USA - El Segundo, Canada. Apply via Workday.

Principal Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is seeking a Principal Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 6) for a satellite development program in Huntington Beach or El Segundo, California. This position will lead a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Drives technical excellence throughout all Optical Sensor development activities Troubleshoots sensor design and integration issues with the telescope and sensor focal plane Provides technical leadership to SMS and BTI sensor teams Serves as the primary technical interface with the EO/IR suppliers Provides oversight and approval of technical approaches, products and processes. Works closely with program manager, program chief engineer, and other Boeing teams Ensure mission success and prompt resolution of anomalies Provides mentoring and coaching to Optical Sensor Engineers and Technicians Performs Technical Lead Engi

Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer Company: The Boeing Company Boeing Defense, Space and Security (BDS) is looking for an Experienced Electro-Optical Infrared Design, Assembly, Integration, and Test Engineer (Level 3) to join our team in Huntington Beach or El Segundo, California. This position will be joining a team of engineers, analysts and staff within the Space and Missile Systems (SMS) and Boeing Technology and Innovation (BTI) Mission Systems organizations in the development, assembly, integration, and test of a constellation of satellites. The SMS and BTI organizations develop and capture technology for designing disruptive Mission Systems solutions. Focused on visible and infrared spectrum Electro-Optics Infrared (EO/IR) sensors operating in Space and Air domains, our growing team is leaping ahead of our competition with an exceptional mix of mission architectures, sensor designs, and algorithms for advanced image and data processing. Position Responsibilities: Develops and validates requirements for various communication, sensor, electronic warfare and other electromagnetic systems and components Develops and validates electromagnetic requirements for electrical\electronic systems, mechanical systems, interconnects and structures Develops architectures to integrate systems and components into higher level systems and platforms Performs trade studies, modeling, simulation and other forms of analysis to predict component, interconnects and system performance and to optimize design around established requirements Defines and conducts tests to validate performance of designs to requirements Manages appropriate aspe

Manufacturing Test Engineering Manager Position Summary We are seeking an experienced Manufacturing Test Engineering Manager to lead the development and execution of the end-to-end manufacturing test strategy for next-generation AI server platforms and datacenter infrastructure. This role is responsible for defining and driving the manufacturing test architecture from L6 board assembly through L11 rack-level integration and final system validation , ensuring world-class product quality, manufacturability, and production scalability. This leader will manage a team of 3–5 Manufacturing Test Engineers while partnering closely with Hardware, Firmware, Platform, Validation, Quality, Operations, and Joint Design Manufacturing (JDM) partners. The role owns the manufacturing test strategy, test coverage, factory test infrastructure, manufacturing capacity planning, and continuous improvement of manufacturing quality. Key Responsibilities Manufacturing Test Strategy Define and own the end-to-end manufacturing test strategy from L6 board assembly through L11 rack integration . Develop standardized manufacturing test methodologies that optimize quality, throughput, cost of test, and scalability across multiple products and JDM sites. Establish manufacturing test standards, best practices, and engineering processes that support high-volume server manufacturing. Technical Leadership & People Management Lead, mentor, and develop a team of 3–5 Manufacturing Test Engineers supporting multiple hardware programs. Establish team priorities, allocate resources, and ensure successful execution of manufacturing test deliverables. Foster a culture of technical excellence, accountability, collaboration, and continuous improvement. Serve as the primary technical escalation point for manufacturing test and production issues. Cross-Functional Engineering Collaboration Partner with Hardware, Platform, Firmware, Validation, Reliability, Quality, and Operations teams to ensure manufac

Assembly Mechanic Company: Boeing Defense, Space and Security (BDS) has an exciting opportunity for Assembly Mechanics to support MQ-25 in Mascoutah, IL. The primary responsibility of this role is to assemble, install, and test structural components and systems according to engineering specifications and industry standards. The ideal candidate will have a strong background in structural assembly, excellent problem-solving skills, and the ability to work effectively both independently and as part of a team. Position Responsibilities: Individual job duties may include, but are not limited to: Read and interpret engineering drawings, blueprints, and technical specifications to understand assembly requirements for structural components. Assemble structural components, including beams, frames, panels, brackets, and other structural elements, using hand tools, power tools, and measuring instruments. Assemble precision assemblies, set up and operate ream fixtures to drill, ream, countersink, spot face, hone and bore for mating major assemblies. Install press fit bushings and force fit bushings. File, fit, hone, ream, drill, tap, saw, burr and adjust. Assemble a variety of production aircraft and spacecraft parts and install aircraft equipment, support equipment or power plant equipment. Install structural components into production aircraft ensuring proper alignment and connection. Test assembled structural systems to ensure functionality, safety, and compliance with quality standards. Assemble aircraft and/or spacecraft structures or aircraft and/or spacecraft support equipment structures with or without the aid of jigs and fixture

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Responsible for addressing and improve product and equipment -specific issues. Collaborating with other Equipment Engineering teams to implement new products and monitor existing products. Serve as the primary point of contact for product-specific engineering issues and acts as a liaison with outside departments including Manufacturing, Process, TSE, PE, QA and Planning. Liaised with QA group for quality improvement by introducing efficient working method, safety working environment, line audit, equipment health check and process and equipment improvement. Responsibilities and Tasks Evaluate and Improve Assigned Assembly Manufacturing Processes, Materials, and/or Equipment • Maintain General process knowledge • Maintain Equipment knowledge as it relates to the process • Maintain Materials knowledge as it relates to the process • Optimize process and/or equipment variables • Identify all process variables • Apply DOE techniques • Perform containment of process and equipment deviations • Determine root cause • Implement corrective action • Maintain knowledge of equipment and materials and how they interact • Monitor Assembly process SPC and implement working procedures, process specification , FMEA and OCAP for line personnel Evaluate Future Process, Equipment and/or Material Technologies • Evaluate pertinent technology and engineering advancements relating to equipment, materials and processes • Locate and research technical information on equ

At Lyft, our purpose is to serve and connect. We aim to achieve this by cultivating a work environment where all team members belong and have the opportunity to thrive. Lyft Urban Solutions powers the bike-sharing and scooter-sharing systems that move millions of people in over 60 cities worldwide. We built North America's first automated bike-share system and continue to lead the micromobility revolution. Our systems operate globally - from Citi Bike in New York to BIXI in Montreal, Divvy in Chicago, Capital Bikeshare in DC, and iconic systems in Austin, Barcelona, Bogota, Boston, Buenos Aires, Columbus, Detroit, Dubai, London, Madrid, Mexico City, Monaco, Pittsburgh, Portland, Rio de Janeiro, San Francisco, Toronto, and beyond. We're not just technology providers - we operate these systems, building the software, hardware, and operations that make urban micromobility work at scale. Ready to shape how millions of people move through their cities every day? Our team is transforming urban transportation through Lyft’s micromobility ecosystem — the shared bikes and scooters riders use every day. Lyft’s Hardware Manufacturing & Quality team is looking for a Manufacturing Test Engineer to design, build, and manage the test systems that ensure every bike and scooter leaving our production lines is safe, durable, and functional. You’ll own the software, electrical, and hardware test fixtures used on the factory floor, and you’ll be the person production turns to when something breaks — whether that’s a failing assembly or a misbehaving test station. Responsibilities: Test System Ownership Design, build, and own the software, electrical, and hardware test fixtures used during production Define the vision, strategy, and architecture for current and future manufacturing test systems, and author the test specifications and fixture acceptance plans that govern quality Write scripts and programs to run automated tests and capture factory data for traceability and yield anal

Entry-Level Electrical / Wire Harness Assembly Technician Company: Boeing is currently seeking Entry-Level Electrical / Wire Harness Assembly Technicians in Mesa, AZ . Fabricate, assemble, modify, repair, test development, production and prototype wire harnesses and electrical assemblies. Utilize the Boeing Quality management system to identify and document nonconforming detail parts, assemblies and processes. Work with support teams including engineering, material management, and quality to improve manufacturing processes. Fabricate, assemble, modify, repair, test development, production and prototype wire harnesses and electrical assemblies. Construct wire harnesses and panels by cutting, sorting, color-coding, measuring, stripping, crimping, soldering, routing, and inspecting various lengths, types, and gauges of wire, heat-shrink, and other related materials including use of ruler, scale, and other measurement devices to interpret lengths. Operate tools and equipment such as wire strippers, crimpers, solder iron, wire identification and cutting machines, heat guns, and associated tools. Ensure all assemblies and detail parts are free of Foreign Object Debris (FOD) and non-conformance issues. Complete and maintain all required training and certifications needed to do your job efficiently. Maintain safety procedures and reports unsafe conditions to safety officials or manufacturing supervision. Knowledgeable and able to interpret blueprints, sketches, specifications and written or verbal instructions. Knowledgeable and skilled in electrical (wire harness) materials, fabrication and assembly methods and common shop practices. Knowledgeable and able to apply basic mathematics. Tr

Job Details: Job Description: The Role and Impact: We are seeking a Manufacturing Quality and Reliability Engineer to join the Foundry QnR team at our Penang site, supporting Intel's advanced packaging programs (EMIB, Foveros). This role spans silicon processing and wafer-level assembly (WLA) flows, and key interfaces with packaging substrates and 2.5D EMIB technology. You will help ensure that products and processes meet rigorous quality and reliability standards from wafer fabrication through packaging and assembly. The position directly influences manufacturing performance, yield, reliability, and customer satisfaction by driving robust quality control, disciplined excursion management, and continuous process improvement. You will also have the opportunity to represent Quality and Reliability in development forums, Silicon and Advanced Packaging factory operations, and Substrate suppliers. Key Responsibilities Apply Advanced Packaging expertise to assess inline process health, excursion impact, yield risk, defect mechanisms, and downstream packaging implications. Collaborate with cross-functional teams to drive effective root cause analysis, systemic corrective and prevention actions using 8D and related problem-solving methodologies. Partner with fab manufacturing, substrates assembly, test, process engineering, and quality teams to strengthen early excursion detection, process controls, in-line screens, and outgoing quality. Drive quality control improvements devising incoming/ outgoing quality controls, using statistical process control, defect pareto analysis, control plans, audit learnings, and excursion prevention indicators across fab, substrate manufacturing, and assembly manufacturing steps. Support manufacturing excursion management, including MRB facilitation, cont

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: A senior advanced assembly technology development engineer is responsible for introducing new technology to enable next generation packaging. This position engaged latest stacking/flip chip technology, advance packaging material and work on new process set up, process/ packaging characterization and process transfer from TD phase to high volume production to meet development milestone. This position required high motivation and operation skill to build DOE sample and fulfill customer requirement sample as well as cooperate with Material engineer, Bumping, PI, NPI, quality and manufacturing team to ensure process transfer successfully. Responsibilities Explore new technology on semiconductor industry such as flip chip, TCB and hybrid bonding process equipment and packaging material. Provide plan and resource requirement to enable new technology. Set up DOE plan and execute. Build sample and perform data analysis skill. Lead efficiency trouble shooting skill to improve process. Prepare documentation for process transfer from TD to HVM Review process stability by FDC, SPC and test result. Self-motivated and capable of working independently, proactively identifying opportunities and driving projects with minimal direction. <span

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Product Yield Enhancement (PYE) Electrical Failure Analysis (EFA) Engineer, you will work with a team dedicated to improving yields of next-generation memory products across all stages of the manufacturing lifecycle. Through failure analysis of test, internal qualification, and RMA failures, you will identify and help eliminate yield-limiting defects — driving enhanced product reliability, rapid production ramp, and early time to market. Your day-to-day work will center on fault isolation using a combination of electrical and physical characterization techniques paired with data analysis to pinpoint physical defects introduced during process fabrication or package assembly. You will also be responsible for presenting and coordinating failure analysis findings with Management, Product, Process, Assembly, and Global Quality teams to ensure corrective actions are implemented and yields continue to improve. Responsibilities Perform Electrical Failure Analysis and Fault Isolation using emission microscopy, laser techniques, EOTPR, and PFA/de-processing methods Characterize and model backend test, internal qualification, and RMA fail signatures using layout, schematic, and data analysis tools Apply in-depth knowledge of CMOS fabrication processes and package assembly flows to identify process- and assembly-related defects, root causes, and downstream effects Evaluate reliability concerns and delayed breakdown failure mechanisms across test insertions Perform

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, Inc., you will join a team responsible for bringing next-generation High Bandwidth Memory (HBM) products from design through high-volume manufacturing. This role plays a critical part in improving product reliability, accelerating production ramp, and enabling early time-to-market through advanced failure analysis. You will focus on analyzing failures from production test, internal qualification, and customer returns (RMA), using a combination of electrical, physical, and data-driven techniques to identify root causes related to fabrication or assembly processes. Key Responsibilities Perform electrical failure analysis and fault isolation using techniques such as emission microscopy, laser-based methods, and EOTPR. Analyze and model failure signatures from backend testing, qualification, and RMA data. Apply physical failure analysis (PFA) and de-processing techniques to isolate defects. Develop and maintain deep technical knowledge of CMOS/FinFET fabrication processes, device structures, and process integration. Generate clear, organized, and timely failure analysis reports, including root cause and corrective action insights. Collaborate multi-functionally with Product, Process, Assembly, Quality, and Management teams to communicate findings and drive resolution. Apply AI-assisted tools and workflows to analyze large datasets, identify failure patterns, and accelerate root-cause determination. Support flexible work sch

Tenstorrent is leading the industry on cutting-edge AI technology, revolutionizing performance expectations, ease of use, and cost efficiency. With AI redefining the computing paradigm, solutions must evolve to unify innovations in software models, compilers, platforms, networking, and semiconductors. Our diverse team of technologists have developed a high performance RISC-V CPU from scratch, and share a passion for AI and a deep desire to build the best AI platform possible. We value collaboration, curiosity, and a commitment to solving hard problems. We are growing our team and looking for contributors of all seniorities. Tenstorrent is looking for a hands-on Manufacturing Engineer to own the manufacturing interface between package design, semiconductor assembly, package test, board assembly, and final product integration. This role is focused on making advanced packages manufacturable and transferable from design engineering into qualified OSAT processes and downstream board/system assembly. You will work closely with Packaging Engineering, Silicon Manufacturing and Test, Quality, Supply Chain, PCB/board design, and external partners such as substrate suppliers, OSATs, test houses, and contract manufacturers. The ideal candidate understands how package decisions—such as package size, substrate construction, bump and ball design, warpage, underfill, materials, and assembly location—affect package yield, package test, PCB footprint and stencil design, SMT assembly, and final product readiness. This role is remote based out of Taiwan but requires close engagement with regional OSATs, foundry/test partners, contract manufacturers, and Tenstorrent engineering teams across multiple time zones. Regular on-site presence at partner factories is expected during qualification, commissioning, build, and ramp activities. We welcome candidates at various experience levels for this role. During the interview process, candidates will be assessed for the appropriate level, and of