Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 概要 CMP/BONDING工程における装置エンジニアとしてご活躍いただくポジションです。 本ポジションでは、半導体業界でも先進的なBONDING技術の新規装置立ち上げに携わっていただきます。 CMP量産工程の維持・管理にとどまらず、最先端の半導体BONDING技術開発の最前線で、新たなプロセスや装置の導入・最適化を推進していただく重要な役割です。 確立された技術を運用するだけでなく、試行錯誤を重ねながら課題解決に取り組む機会が多くあります。 そのため、技術革新やイノベーションに興味があり、自ら考え行動しながら新たな価値を創出することにやりがいを感じる方に最適な環境です。 ルーティンワークよりも、変化の多い環境で挑戦を楽しみながら成長したい方のご応募をお待ちしております。 職務内容 CMP/BONDING process toolの立ち上げ 必要な安全教育をすべて完了し、Micronの安全方針に従ってすべての作業を実施する 新装置の設計、開発、特性評価を主導し、ハードウェアおよび手順上のギャップを特定・解消する 作業品質、コスト管理、プロジェクトスケジュールの遵守を確保しながら、装置のインストールとアップグレードを監督する 装置ベンダーと連携し、既存製品の改善とロードマップのニーズ実現に努める 装置の性能、運用手順、保守仕様、コスト指標をまとめた文書の作成・維持管理を行う 社内監査および社外監査への対応 AIを用いた業務工数改善、データのサマライズ 必須条件 半導体業界での経験、または生産現場における装置・設備エンジニアとしての経験をお持ちの方 データや事実に基づく問題解決能力をお持ちの方 チーム内外の関係者と円滑なコミュニケーションを図り、協働して業務を推進できる方 技術的な内容を理解し、説明・教育・開発に活用できる能力をお持ちの方 優れた時間管理能力およびマルチタスク遂行能力をお持ちの方 Microsoft Office（Excel、Word、P
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Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron leads the creation of powerful memory and storage solutions that power the AI era. We work hands-on with global R&D groups, suppliers, and manufacturing teams to turn breakthrough ideas into real, production-ready technologies. We thrive on innovation and collaboration! Position Overview: This role will be part of a highly collaborative and innovative Advanced Packaging Wafer Edge Trim, Backgrind & Thinning R&D team, responsible for developing and scaling critical mechanical wafer processing modules. This role offers broad opportunities for technical innovation, early stage pathfinding, and ownership of process solutions that enable next generation advanced packaging technologies. You will work closely with process integration and adjacent process areas including Bonding/De-bonding, CMP, Wet Etch, Lithography, Assembly, and Test, while driving process readiness to meet bold program, performance, and yield targets. </
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Department Intro: The Advanced Packaging Technology Development (APTD) team at Micron drives the technologies that enable the AI era. We work hands‑on with global R&D, suppliers, and manufacturing teams to turn breakthrough ideas into production‑ready solutions. Our work sits at the intersection of innovation, scale, and real‑world impact—and collaboration is how we win. Position Overview: Artificial intelligence is transforming the world, and High Bandwidth Memory (HBM) is at the center of that transformation. As a Senior or Staff Engineer on the Dry Etch R&D team, you will play a key role in developing and scaling plasma‑based etch processes that enable next‑generation packaging technologies. This role offers deep technical ownership, broad cross‑functional collaboration, and the opportunity to influence long‑term technology roadmaps from early research through high‑volume manufacturing. Responsibilities: Develop and optimize dry e
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As the Operation Central Team (OCT) team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with High Volume Manufacturing (HVM) sites, Technology Development (TD), Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manager of the CMP area for the Advanced Technology Engineering team at Micron Technology, Inc., you will build and develop an elite team. Your team will drive new product introduction and ramp at our newest memory fab. This brand-new site in Boise, ID will combine technology development and manufacturing to transfer groundbreaking products from R/D into manufacturing. Your team will engage on Micron’s groundbreaking products from early in the development stage and support them all the way through customer qualification. Your objective is to use global internal and external resources to enable equipment and yield performance to plan. Responsibilities: Ensure all required safety training is completed and work is conducted in accordance with Micron safety policies while promoting a positive work environment. Hire, develop, mentor, and manage a team of highly capable process engineers. Support the qualification of a ne
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. 【職務概要】 CMP工程シフトエンジニアは、プロセス開発部門、プロセスインテグレーション開発部門、および量産部門と連携し、24時間365日（24/7）稼働体制下での技術開発業務を担当します。 新規デバイス開発、冗長化装置（Redundancy tool）の展開、開発デバイスにおける迅速な異常品対応などを通じて、止まることのない技術開発体制の実現に貢献します。 【業務詳細】 CMP工程（CMP：化学機械研磨）エリアにおける、24時間365日（24/7）稼働体制下での技術開発業務 開発デバイスにおけるLevel Owner業務 （プロセスセットアップ、プロセス改善評価、SPC管理、冗長化装置の展開など、PMIで規定された各種開発業務） 新規装置評価および新規材料評価を含むCMPプロセス開発の推進 新規材料導入に伴う剥離（はがれ）検査の実施および評価 開発デバイスにおいて、CMPプロセス異常品ならびに膜厚（Thickness）計測エラー発生時に、迅速かつ的確な対応を行い、ロットの円滑なリリースを実現 慢性的なプロセス課題に対し、データ収集および解析・取りまとめを行い、プロセス開発部門またはプロセスインテグレーション開発部門へエスカレーショ 開発ロットにおけるサイクルタイム改善活動 （冗長化装置の展開、量産プロセスとの条件整合など）を、量産部門と連携して推進 4勤4休シフト体制でのエンジニア業務対応、勤務時間は以下の通り 昼勤：08:00～20:15（実働10時間30分、休憩105分）/夜勤：20:00～08:15（実働10時間15分、休憩120分） AI使用について：データ解析や業務改善活動などあり/Using AI for dat
OCT CMP Mfg. Alignment (MA) Engineer/Sr Engineer — Taichung - Fab 16, Taiwan. Apply via Workday.
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Process and Equipment Engineer (PEE) は、トラブル対応、リスク評価、ファブ立ち上げ、装置リリースにおいて、生産ラインを健全な状態に維持する責任を負います。さらにPEEは、製品の品質向上、歩留まり改善、コスト削減、キャパシティアウトプット（時間あたりのウエハ処理能力）の最大化のため、プロセス/ハードウエアの最適化に継続的に取り組む責任を負います。半導体ウエハ生産のCMPプロセスにおいては、機械的/化学的なウエハ平坦化技術による欠陥低減や配線の形成を行うため、PEEとしてプロセスと設備の両方の知識を備えます。すべての部門と協力し、経験を積んで学んでいくことで、技術的な知識およびソフトスキルを身に付けることができ、より優れたマイクロンのメモリ製品に貢献できるようになります。 私たちは平等に機会を与える会社であり、社内で多様性を重んじています。人種、宗教、肌の色、国籍、性別、性的指向、年齢、婚姻状況、退役軍人か否か、障がいの状況を問わず、すべての社員を受容する文化を持っています。 役割と職責: • プロセス条件とテクノロジーを開発し、改善する。 • プロセス能力を向上させ、生産コストを削減する。 • プロセス管理プロジェクトを確立し、修正する。 • 多様な半導体装置におけるプロセスパラメーターをセットアップする。 • 新しい装置/材料を評価し、生産稼働への展開と、プランの策定 • 異常発生時の解析と改善 募集要件: (下記のすべての条件を満たす必要はありません。) 電気・電子工学/化学工学/材料工学で、学士/修士の学位を有すること。 半導体/製造業界のプロセスに関わるポジションで最低２年間の経験があること。 学ぶこと、成長、自己開発に熱意をもっていること。 問題解決スキルと分析スキル。 目標達成にコミットし、粘り強く取り組めること。 最終目標の実現のために様々な相手と協働できる優れたコミュニケーション能力。
Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technolo
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. Job Summary: As a Staff/Principal Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities:
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. Join a dynamic team today! This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide align
Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HVM WET/CMP Sr. Manager in Micron, you are accountable to continuously improve the defense lines in all aspects to enable and assure wafer quality surpass critical metrics and achieve Best-In-Class performance. This scope of HVM WET/CMP Sr. Manager run across Yield enhancement from new technology start-up, Quality improved by wafer performance matching, process capability control SPC/FDC and advanced detective solutions, Output increased through activities which collaborated w/ ME, Manufacture, Cost saving by exciting team member to find out opportunity and Talent Development. Besides this, All activities need to collaborate with OMT/ Micron Networks to achieve KPIs and win customer total satisfaction. In Fab, this position requires collaborating with Fab Manufacturing, Equipment, Facility groups and Process Integration, Yield, Defect and Quality group to perform the Best Quality / Mature Yield / Maximum Output / Low Cost. <
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role Micron Singapore’s NAND Process Development (PD) team invites a motivated and committed engineer to contribute to next-generation 3D NAND technologies. You will coordinate with worldwide teams, suppliers, and manufacturing partners to design, optimize, and transition advanced CMP processes from research into high-volume manufacturing. This is a fantastic opportunity to work with leading technology and innovation! Position Overview As an Engineer - PD SG CMP, you will play a meaningful role in developing advanced CMP processes. This position offers an outstanding opportunity to work on innovative technology and be part of a team that builds the future of memory solutions. Responsibilities: Lead the development of Chemical Mechanical Plan
Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In this role, your responsibilities will include, but are not limited to: Lead, hire, mentor, and develop a team of CMP & BTG engineers, providing regular feedback, career development, and fostering a culture of collaboration, accountability, and technical excellence. Own and drive CMP and BTG process module development, including process characterization, Integration, process margin improvement, and manufacturability for 3D NAND nodes. Drive execution of process development activities aligned with TD roadmap, ensuring timely delivery of robust, scalable, and high-performance solutions. Collaborate closely with Process Integration, Manufacturing Development, Equipment Engineering, and global TD teams to meet integration requirements and technology breakthro
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