Cmp Bonding Engineer Jobs

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron-Boise, ID, we are undergoing a historic $15 billion investment in semiconductor manufacturing; construction began in early 2023, with DRAM production slated for the second half of the decade. As a leader in the semiconductor industry, we build solutions that encourage and transform technology. With plans to invest more than $150 billion globally over the next decade in groundbreaking manufacturing, we are looking for hard-working people to join our Boise expansion team and give to the growth and innovation of the semiconductor industry. As a Senior Wet Etch Equipment Engineer , with a strong focus on safety and quality, you will play a meaningful role in improving our manufacturing processes by focusing on the installation, maintenance, optimization, and development of our wet etching equipment. Your expertise will give to the production of high-quality semiconductor components that are pivotal to our customers' success. You will work closely with multi-functional teams to tackle equipment issues and implement solutions that improve efficiency and yield. Your passion for engineering and willingness to learn will help us overcome the challenges of this fast-paced industry. We are looking for someone who enjoys hands-on work, values collaboration, and is eager to dive deep into the technical aspects of semiconductor manufacturing. This requisition is part of our talent pipeline for future opportunities. While we may not be actively hiring for this role today, we’re always looking to connect with gr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Process and Equipment Engineer (PEE) は、トラブル対応、リスク評価、ファブ立ち上げ、装置リリースにおいて、生産ラインを健全な状態に維持する責任を負います。さらにPEEは、製品の品質向上、歩留まり改善、コスト削減、キャパシティアウトプット（時間あたりのウエハ処理能力）の最大化のため、プロセス/ハードウエアの最適化に継続的に取り組む責任を負います。半導体ウエハ生産のCMPプロセスにおいては、機械的/化学的なウエハ平坦化技術による欠陥低減や配線の形成を行うため、PEEとしてプロセスと設備の両方の知識を備えます。すべての部門と協力し、経験を積んで学んでいくことで、技術的な知識およびソフトスキルを身に付けることができ、より優れたマイクロンのメモリ製品に貢献できるようになります。 私たちは平等に機会を与える会社であり、社内で多様性を重んじています。人種、宗教、肌の色、国籍、性別、性的指向、年齢、婚姻状況、退役軍人か否か、障がいの状況を問わず、すべての社員を受容する文化を持っています。 役割と職責: • プロセス条件とテクノロジーを開発し、改善する。 • プロセス能力を向上させ、生産コストを削減する。 • プロセス管理プロジェクトを確立し、修正する。 • 多様な半導体装置におけるプロセスパラメーターをセットアップする。 • 新しい装置/材料を評価し、生産稼働への展開と、プランの策定 • 異常発生時の解析と改善 募集要件: (下記のすべての条件を満たす必要はありません。) 電気・電子工学/化学工学/材料工学で、学士/修士の学位を有すること。 半導体/製造業界のプロセスに関わるポジションで最低２年間の経験があること。 学ぶこと、成長、自己開発に熱意をもっていること。 問題解決スキルと分析スキル。 目標達成にコミットし、粘り強く取り組めること。 最終目標の実現のために様々な相手と協働できる優れたコミュニケーション能力。 時間を管理し複数のタスク能力をこなせる能力。 日本語でのコミュニケーション能力。 Process and Equipment Engineer (PEE) will be responsible to maintain the production line health through troubleshooting and risk assessment, fab start up and tool release. PEE is also in charge of continuously process/hardware related optimization to enhance the products’ quality, improve the yield, reduce the cost as well as maximize the capacity output (wafer per hours output). In the CMP process of sem

MTS CMP — 2 Locations. Apply via Workday.

Experienced CMP Process Engineer (Evergreen) — Boise, ID - Main Site. Apply via Workday.

Fab15 CMP Process & Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

WET/CMP SHIFT ENGINEER — Taichung - Fab 16, Taiwan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Staff Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications Initiate and manage experiments to widen process margins as well as to eva

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a Staff Engineer, you will be a part of groundbreaking next generation NAND research & development dry etch team driving critical modules listed below. The position promises ample opportunities for innovation, collaboration and testing a new dimension and scaling with next generation NAND . You will work directly with process integration and other process areas such as Wet etch, CVD, Diffusion, Metals, Lithography & Dry Etch. You will be involved with innovative and outstanding dry etch chambers & own the process roadmap to meet program and yield goals. Your responsibilities include, but not limited to: Main Responsibilities: As a CMP Process Development Engineer, you will develop and optimize chemical mechanical planarization procedures. These procedures aim to improve product quality and reliability for the next generation of Micron's memory parts. Focus on understanding and improving the process margins required for meeting the mature yield goal for 3D NAND parts Advanced 3D NAND CMP process development will include performing fundamental research, consumables development, and hardware evaluation, as well as testing processes for novel applications Initiate and manage experiments to widen process margins as well as to eva

Job Details: Job Description: Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Staff Chemical Mechanical Planarization (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers. Core Responsibilities Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies Strategic Execution Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions Technology Transfer: Bridge technology development and manufacturing

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our Opportunity Summary: Micron's Equipment Engineering team at our Manassas, VA (Fab 6) 300mm semiconductor manufacturing facility is responsible for maintaining, troubleshooting, and optimizing advanced wafer fabrication toolsets that directly drive yield, productivity, and cost of ownership. As an Equipment Engineer II – CMP, you will support CMP operations by resolving equipment issues, leading improvement projects, and partnering with process engineers, technicians, and suppliers to sustain high-volume manufacturing performance. (Disclaimer ) While you may not exhibit all of the characteristics/skills listed below today, we are highly interested in a team member who is anxious to grow in both technical breadth and depth. If you are open to learning from and being a valued member of a team of top-tier engineers, we are eager to help build on your existing foundation and expand your individual and collaborative skills in this exciting and unique opportunity. What’s Encouraged Daily: Maintain and optimize CMP semiconductor manufacturing equipment for high-volume production. Troubleshoot equipment issues using structured problem-solving methods such as 8D, FMEA, SPC, and root cause analysis. Support tool installations, qualifications, upgrades, and process integration activities. Drive equipment uptime, reliability, throughput, and yield improvements, including exploring Agentic AI workflows to streamline troubleshooting a

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. Join a dynamic team today! This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownership, Process efficiency, Quality defense line and Yield improvement initiatives. Partner with suppliers to develop the process and equipment roadmap to meet Micron’s technology roadmap. Pr

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. HVM WET/CMP Sr. Manager in Micron, you are accountable to continuously improve the defense lines in all aspects to enable and assure wafer quality surpass critical metrics and achieve Best-In-Class performance. This scope of HVM WET/CMP Sr. Manager run across Yield enhancement from new technology start-up, Quality improved by wafer performance matching, process capability control SPC/FDC and advanced detective solutions, Output increased through activities which collaborated w/ ME, Manufacture, Cost saving by exciting team member to find out opportunity and Talent Development. Besides this, All activities need to collaborate with OMT/ Micron Networks to achieve KPIs and win customer total satisfaction. In Fab, this position requires collaborating with Fab Manufacturing, Equipment, Facility groups and Process Integration, Yield, Defect and Quality group to perform the Best Quality / Mature Yield / Maximum Output / Low Cost. In Micron network requires collaborating with Global functions as well as interaction with procurement and materials suppliers to drive the roadmap to support Fab KPI with excellence. objectives. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Process

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. About the Role Micron Singapore’s NAND Process Development (PD) team invites a motivated and committed engineer to contribute to next-generation 3D NAND technologies. You will coordinate with worldwide teams, suppliers, and manufacturing partners to design, optimize, and transition advanced CMP processes from research into high-volume manufacturing. This is a fantastic opportunity to work with leading technology and innovation! Position Overview As an Engineer - PD SG CMP, you will play a meaningful role in developing advanced CMP processes. This position offers an outstanding opportunity to work on innovative technology and be part of a team that builds the future of memory solutions. Responsibilities: Lead the development of Chemical Mechanical Planarization (CMP) processes for advanced 3D NAND technologies. Characterize, optimize, and qualify CMP processes for future memory nodes. Work together with international teams based in Singapore and suppliers to fulfill technology and integration needs. Transfer new processes into manufacturing and drive continuous improvements in yield, quality, cost, and efficiency. Troubleshoot process and manufacturing issues, and develop effective solutions. Build and

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. In this role, your responsibilities will include, but are not limited to: Lead, hire, mentor, and develop a team of CMP & BTG engineers, providing regular feedback, career development, and fostering a culture of collaboration, accountability, and technical excellence. Own and drive CMP and BTG process module development, including process characterization, Integration, process margin improvement, and manufacturability for 3D NAND nodes. Drive execution of process development activities aligned with TD roadmap, ensuring timely delivery of robust, scalable, and high-performance solutions. Collaborate closely with Process Integration, Manufacturing Development, Equipment Engineering, and global TD teams to meet integration requirements and technology breakthroughs. Lead transfer of processes to high-volume manufacturing, supporting pilot ramp, yield improvement, and long-term process stability. Drive DOE-based experiments and data-driven methodologies to optimize process performance, expand process window, and improve cost effectiveness. Implement advanced process monitoring and control strategies to ensure stable, repeatable, and manufacturable performance. Identify and lead process simplification, cost reduction,

Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As the Operation Central Team (OCT) CPEE HVM team member, you will be responsible for leading and collaborate with multi-functional teams, leveraging global internal and external resources to develop BKMs and driving improvements in CMP. As a process/equipment expert in CMP Process, create innovative process and equipment solutions aligning to and executing global business strategy as well as delivering continuous improvements to meet Cost/Scale/Quality/Yield goals. This position requires interfacing with High-Volume manufacturing sites, Technology Development, Global Procurement as well as interaction with equipment and materials suppliers to drive area manufacturing issue forward and establish area improvement roadmaps. You must be willing and capable of effective collaboration with HVM sites, TD, Procurement, Quality Engineering, other OCT departments, and external suppliers to accomplish your objectives. Responsibilities: Engage HVM and TD and lead worldwide alignment efforts across technology to improve process effectiveness. Promote worldwide BKMs sharing and transfer of area-specific domain knowledge. Provide technical and hands-on support to HVM sites to create/identify and deploy best solutions in Safety, Productivity, Cost of ownersh