Cmp Staff Principal Engineer Jobs

Manufacturing Alignment Engineer (CVD/CMP) — Manassas, VA - Fab 6. Apply via Workday.

ENGINEER - F15 MFG CMP Equipment Engineer — Hiroshima - Fab 15, Japan. Apply via Workday.

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a Manufacturing Development Engineering (MDE) Shift Engineer in Wet Etch/CMP/Bond , you will play a critical role in enabling 24/7 process development for next-generation DRAM technologies within the Wet Etch/CMP/Bond Process Areas. This position operates on a 12-hour rotating shift schedule and serves as the primary engineering decision-maker for development activities occurring during off-hours for one of the three listed areas while also supporting the other two areas as needed. You will work closely with Process Development, Process Integration, Equipment Development, Manufacturing, and Shift Operations teams to ensure uninterrupted development execution, increase learning velocity, and support technology roadmap objectives. Unlike traditional manufacturing shift engineering roles, this MDE Shift Engineer operates in a highly dynamic development environment where process conditions, specifications, and experimental flows frequently evolve. This role requires strong engineering judgment to disposition development wafers, make real-time process decisions, troubleshooting process and equipment issues, and appropriately balance execution needs with development objectives. Responsibilities Serve as the primary off-shift engineering decision-maker for development activities, using sound engineering judgment to disposition wafers, release or hold tools, define actions on development targets, respond to process deviations, handle execution risk

ENGINEER, APTD Wafer Thinning / CMP process — Taichung - Fab 16, Taiwan. Apply via Workday.

Wet Process, CMP and Bond MDE Principal Lead Engineer — Boise, ID - Main Site. Apply via Workday.

MGR, MTTN CMP Process and Equipment — Tainan, Taiwan. Apply via Workday.

SR MGR, F16 EE CMP — Taichung - Fab 16, Taiwan. Apply via Workday.

Advanced Technology Japan Engineer, CMP process — Hiroshima - Fab 15, Japan. Apply via Workday.

SNR ENGINEER, PD SG CMP — Fab 10N/X, Singapore. Apply via Workday.

MGR, F16 ME CMP — Taichung - Fab 16, Taiwan. Apply via Workday.

Intern - Process Development Engineer, 3D DRAM CMP — Boise, ID - Main Site. Apply via Workday.

Intern - Process Development Engineer, Planar DRAM CMP — Boise, ID - Main Site. Apply via Workday.

Senior Engineer, Process Development, CMP — Fab 10N/X, Singapore. Apply via Workday.