Design Verification Engineer Intern Jobs

At Affirm, we exist for the moments that matter—giving people a clear, predictable way to pay over time, with no hidden fees, no surprises, and no tradeoffs on what matters most. Identity at Affirm is mission-critical; it is the very first step of the customer journey and the foundation of global expansion. The International Expansion Unit (IEU) owns Identity for every market outside North America, placing our team at the center of Affirm’s global strategy. We are responsible for ensuring Affirm can enter and scale in new markets while operating compliantly across diverse regulatory environments. Our scope includes building and expanding Identity Data Management, KYC Verification, and Decisioning capabilities, while driving architectural changes that impact Identity services globally. We don’t just execute; we influence the core platform’s evolution to support new risk models and market dynamics. Operating at the intersection of technical depth and regulatory complexity, we directly impact approval rates, conversion, and fraud exposure. By joining this team, you will shape the foundational processes that unlock revenue and build customer trust on a global scale. What You'll Do · You will be responsible for setting technical strategy for your team on a year-long time scale, and help your team tie it together with critical, business-impacting projects. · You will collaborate across teams in the product development lifecycle by collaborating with product management, design & analytics to ensure technical sustainability, risks and trade-offs are well understood and managed. · You will act as a force-multiplier for your team through your definition and advocacy of technical solutions and operational processes. · You take ownership of your team’s operations and availability by ensuring you have the right monitoring, triage rotations, playbooks, polcities, testing and alerting in place to support “keep the lights on” & on-call efforts. · You will foster a culture o

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities Be part of a highly skilled and challenging high-speed PHY design team working on advanced technology nodes (12nm and below). Own analog sub-blocks within the PHY and drive specification, design, simulation, reliability, and mixed-mode verification. Leverage AI-enabled tools to improve productivity and decision-making. Drive layout implementation through mask designers while ensuring compliance with process rules and DFM requirements. Participate in design reviews with internal teams and customers, explaining design choices and robustness. Collaborate with cross-functional teams across multiple global locations. Create IP EDA views including Behavioral models, Verilog-A, timing views, and abstracts. Participate in silicon bring-up, characterization, and correlation of silicon results with models and simulations. Mentor and guide junior engineers. Competitive compensation and equal opportunity workplace. Required Skills Strong analog/mixed-signal CMOS circuit design experience in deep sub-micron technologies (2nm to 28nm). Experience in High-Speed Memory Interfaces (DDR3/4/5, LPDDR5/6, GDDR5/6/7) or SerDes Interfaces (PCIe, MIPI, HDMI, USB, SATA, etc.). Full ownership experience of at least one critical PHY sub-block such as: PLL DLL CDR High-speed Receiver with Equalization Transmitter Front-End High-Speed Data Path </ul

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. We are shaping the memory technologies that power today's most advanced computing platforms, from AI accelerators to mobile and client devices. Our DRAM Engineering team brings together skilled engineers across the globe to solve complex technical challenges, drive innovation, and deliver high-performance memory solutions. If you enjoy tackling difficult problems and turning ideas into products, you'll find exciting opportunities to make an impact here. As a Semiconductor Design Engineer (Principal / Member of Technical Staff / Senior Member of Technical Staff), you will play a key role in designing and optimizing next-generation DRAM products. You will work closely with global design, verification, and multi-functional teams to develop innovative circuit solutions that balance performance, power, quality, reliability, and cost. This role also offers the opportunity to influence technical direction, mentor engineers, and help advance future memory technologies. Responsibilities: Design and optimize digital and analog circuits for next-generation DRAM products, including memory arrays, control logic, datapaths, address decoding, and I/O circuitry. Lead circuit development, simulation, verification, and silicon validation to achieve performance, power, area, and quality targets. Drive floor-planning, layout optimization, parasitic analysis, and tape-out activities. Advance AI-assisted design, automation, and design-space exploration through collaboration with internal and external partne

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. You will also work to enable and integrate AI-driven tools and AI-enabled workflows into the team's methodologies. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering,

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. As a SoC Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role passionate about RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Collaborate with SoC architects to translate architectural and micro‑architectural specifications into high‑quality RTL implementations. Participate in SoC‑level integration activities, including clocking, reset, power intent, and configuration infrastructure. Assist with pre‑silicon validation and post‑silicon bring‑up, including root‑cause analysis of silicon issues. Contribute to design documentation, block specifications, and design reviews. Collaborate multi-functionally with Product Engineering, Test, Probe, Process Integration, and Manufacturing to ensure robust and manufacturable builds. Minimum Qualifications Bachelor’s or master’s degree in electrical engineering, Computer

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. At Micron Technology, we transform how the world uses information to enrich life for all. The Heterogeneous Integration Group (HIG) develops next-generation High Bandwidth Memory (HBM) solutions that enable advanced AI, high-performance computing, data center, and networking applications. Our team collaborates across architecture, RTL design, verification, physical design, firmware, and product engineering to deliver innovative memory-centric SoC solutions that meet demanding power, performance, area, quality, and schedule objectives. As an HBM SoC Design Engineer/Architect, you will contribute to the design, integration, and validation of advanced HBM logic die and memory-centric SoCs. Working alongside experienced engineers, you will apply knowledge gained through academic coursework, research, internships, and engineering projects to solve real-world semiconductor design challenges. This role offers opportunities to develop expertise in digital design, ASIC development, HBM architecture, and AI-enabled engineering methodologies that improve design productivity and quality. Responsibilities Design, implement, and integrate digital logic and subsystem RTL using Verilog or SystemVerilog for next-generation HBM SoC solutions. Collaborate with architects and multi-functional engineering teams to translate functional requirements into microarchitectures, interface definitions, and implementation plans. Support design-quality activities including simulation, synthesis, static timing analy

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Silicon-to-systems solutions that transform how the world uses information. With over 45 years of industry leadership, Micron’s teams work across technology development, product engineering, and systems design to deliver high-performance, high-reliability memory products. As a Design Engineer, you will contribute to the design and analysis of digital and analog circuits used in memory technologies. You will collaborate with global, multi-functional engineering teams to optimize product performance, manufacturability, cost, and time-to-market while supporting end-to-end product development and validation. Responsibilities Design, simulate, and optimize memory circuits, including layout development and verification using industry-standard tools (e.g., SPICE, Verilog) Develop schematic blocks such as memory arrays, control logic, datapaths, address decoders, and internal test logic Analyze design trade-offs across power, speed, die size, and manufacturability to improve overall product performance Collaborate with Product Engineering, Test, Process Integration, Assembly, and Marketing teams to ensure robust and scalable designs Apply AI-enabled tools and methodologies to improve circuit design efficiency, simulation accuracy, and overall design flow optimization Minimum Qualifications Bachelor’s degree in Electrical Engineering (BSEE) or higher Foundational understanding of memory architectures, circuit design, and semiconductor device behavior Experienc

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Our vision is to transform how the world uses information to enrich life for all. Join an inclusive team passionate about one thing: using their expertise in the relentless pursuit of innovation for customers and partners. The solutions we build help make everything from virtual reality experiences to breakthroughs in neural networks possible. We do it all while committing to integrity, sustainability, and giving back to our communities. Because doing so can fuel the very innovation we are pursuing. As a SoC Architecture and Design Engineer, you will be part of the Heterogeneous Integration Group (HIG), contributing to the architecture, design, development, and integration of next‑generation HBM SoC logic die. You will work closely with architecture, design, verification, physical design, firmware, and product teams to implement robust, high‑performance SoC solutions that meet ambitious power, performance, area, and schedule targets. This is a hands-on technical role for candidates passionate about architecture, RTL build, IP integration, debugging, and pre/post-silicon support. Key Responsibilities Architect, design and implement RTL for SoC‑level blocks and subsystems used in HBM logic die. Architect and design memory sub-systems including memory IP selection and integration, bus and protocol selection, and power/performance/area optimization. Integrate internal and third‑party IP (e.g., controllers, microcontrollers, NOC, RAS, MBIST, interfaces, adapters, buffers, PHY‑adjacent logic). Trans

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description Department description Micron’s Edge Devices Group (EDG) develops and supports advanced memory and storage solutions for edge and embedded applications. The team works closely with design, validation, firmware, quality, and customer-facing engineering teams to ensure high product performance, reliability, and customer satisfaction across demanding markets such as industrial, automotive, consumer, and embedded systems. EDG offers the opportunity to work on innovative technologies, solve complex technical challenges, and contribute directly to product quality and continuous improvement. Position overview We are looking for an enthusiastic Product Development Engineer to become part of our Edge Devices Group (EDG), for the team in charge of Non-Volatile Memory (NVM) technical customer support. This entry-level position is perfect for individuals who have a solid technical background and a passion for failure analysis, product quality, and reliability engineering. You will support the investigation of customer-reported issues, contribute to root cause analysis, and collaborate with cross-functional teams to improve product quality and prevent recurrence. Key Responsibilities Support the planning, execution, and tracking of verification activities. Define requirements for verification test programs/sequences based on specifications and application usage models. Perform Electrical Failure Analysis (FA), drive root cause analysis and coordinate corrective actions with other internal engineering groups. <l

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Participate in simulating, analyzing, and debugging pre-silicon full chip designs by applying leading edge verification technique Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environ

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Key Responsibilities: Contribute to the development of new product opportunities by assisting with the overall Verification Activities of DRAM Design Actively leverage AI‑based tools, agentic workflows, and automation frameworks to: Accelerate verification cycle time Assist in Test-Case/TB and various other components required for DRAM Design Verification Improve debug efficiency across simulation and silicon learning loops Provide verification support to design projects by simulating, analyzing, and debugging pre-silicon block level/full chip designs. Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features Develop and maintain test benches / test vectors using simulation tools and run regressions for coverage analysis and improvements using Agentic AI Flow Participate in simulating, analyzing, and debugging pre-silicon full chip designs by applying leading edge verification technique Develop Test cases/Stimulus to increase the functional coverage for all DRAM and emerging memory architectures and features. Develop and maintain test benches and test vectors using simulation tools and run regressions for coverage analysis and improvements. Co-work with international colleagues on developing new verification flows to take on the challenges in DRAM and emerging memory design. Participate in developing verification methodology and verification environ

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities Design and develop AC/DC Power Systems, including UPS and PDU hardware for enterprise products. Lead testing, validation, and troubleshooting at the system and component levels (e.g., batteries, inverters, and PCBAs). Work cross-functionally with R&D, DQA, Layout, and other engineering teams to define product requirements and resolve issues during development. Collaborate with manufacturing teams to ensure design for manufacturability (DFM), and support DOE planning, qualification, and production ramp-up. Ensure compliance with international electrical safety and environmental standards (e.g., UL, IEC, CE, RoHS). Provide technical documentation, design reviews, and electrical support throughout the product lifecycle. Own project timelines and drive technical decision-making to meet program goals. Analyze and improve power efficiency, battery integration, and thermal management for UPS/PDU systems. Qualifications Bachelor’s degree in Electrical Engineering or related field. 5+ years of experience in UPS/PDU, DC power systems, or OEM development. Proven experience designing UPS systems over 1kW, including single and 3-phase. Solid background in switching power design, battery systems (Lead-Acid, LiFePO4), and BMS technologies. Familiarity with testing methodologies and system-level verification. Strong communic

Work Flexibility: Onsite Stryker’s Instruments Test Lab is seeking a Senior Test Engineer to perform development, verification, and lifecycle testing on the next generation of medical devices. As a member of the Test Lab Team, you will be a key part of bringing the next generation of cutting-edge medical technology to market. In this role, you will be responsible for coordinating and conducting performance and lifecycle testing on assigned projects and products. You will act as the testing representative and primary technical point of contact between the Test Lab and the Product Development team responsible for the commercialization of equipment. This position will be key to determining test protocols, screening design concepts, developing new test methodologies, coordinating testing with other lab equipment, and working towards delivering on project due dates. This position may also coordinate other lab staff to keep the testing moving through 2nd and 3rd shift. What You Will Do In this role you will be responsible for the testing needs of a wide variety of products to make healthcare better. This includes assisting project teams with insightful feedback, hands on development of high quality test methodologies, and proactive planning to ensure reliable product testing. You will work to ensure team's testing needs are well thought out and proactively involve all of the necessary supporting groups before testing such as Metrology, Quality, CAE, and Test Operations. Individuals in this role may be responsible to: Assist design groups and internal customers from the start of research all the way to final verification testing. Select test equipment, develop test methods, create customized test fixtures, set-up test systems, and execute testing. Design, develop, and implement high quality test system

Our vision is to transform how the world uses information to enrich life for all . Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Job Description: For more than 45 years, Micron Technology, Inc. has redefined innovation with the world’s most advanced memory and semiconductor technologies. We’re an international team of visionaries and scientists, developing groundbreaking technologies that are transforming the ways people around the globe engage with information to improve life. We are looking for Layout Design engineer at our Micron Technology’s HBM Team in Guadalajara, Mexico. As a Layout Design engineer, you will be working for intensive applications such as artificial intelligence and high performance computing solution, High Bandwidth Memory. As a Layout Design Engineer you will be collaborating with peer teams crossing Micron global footprint, in a multiple projects-based environment. Responsibilities: Design and development of analog, mixed-signal, custom digital block and full chip level integration support. Perform layout verification like LVS/DRC/Antenna, quality check and documentation. Responsible for on-time delivery of block-level layouts with acceptable quality. Will bee leading planning, area/time estimation, scheduling, delegation and execution to meet project schedule/breakthroughs in multiple project environment. Effectively communicating with Global engineering teams to assure the success of layout project. Minimum Qualification: 5&#43; years of experience in analog/custom layout design in advanced CMOS process, in various

About Ubiquiti At Ubiquiti Inc., we create technology platforms for Businesses, Smart Homes, and Internet Service Providers, driven by our goal to connect everyone, everywhere. To date, Ubiquiti has shipped over 100 million devices worldwide, from ISP networking products to next generation of IT solutions. Our growth is made possible by the dedicated team of hundreds behind the scenes. From software developers and product managers to designers and strategists, Team UI is driven to achieve our common goal: Rethinking IT. At Ubiquiti, you’ll heighten your potential and broaden your horizons - all while shaping the future of connectivity. Responsibilities: - Product hardware development, schematics design, layout review, BOM maintenance, functionality verification, planning of production testing, and failure analysis - Work with RF engineers to figure out performance issues of radios. - Review design derating and suggest design update due to DFM (design for manufacturing), DFA(design for assembly) and DFC (Design For Cost.) - Report projects’ status and issue tracking to internal. - Survey and evaluate potential technologies for related products. Teardown and review new products in the market. Must-haves: - At least 3 years of relevant experience in network, server or Media ODM companies. - BS or MS in EE engineering. - Good working knowledge of system level architecture and switch applications, PoE etc.. - Can communicate with foreign engineers directly. - Basic knowledge of EE lab equipment including: oscilloscopes, multimeters, power supplies, etc. - Familiar with QCA/MTK platforms - Proficiency on PCB and schematic tools such as pads, allegro, orcad etc.. Nice-to-haves: - Familiar with EE and RF parts and its fundamental mechanism and its applications. - very organized on platforms and innovative on product concepts. - Leadership in a project. Better to have experience managing teams of 3+ engineers.